We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
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glue Product List and Ranking from 280 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jun 10, 2026~Jul 07, 2026
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jun 10, 2026~Jul 07, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 寺田 Tokyo//Electronic Components and Semiconductors
  3. null/null
  4. 4 理経 Tokyo//IT/Telecommunications
  5. 5 積水フーラー Tokyo//Chemical

glue Product ranking

Last Updated: Aggregation Period:Jun 10, 2026~Jul 07, 2026
This ranking is based on the number of page views on our site.

  1. SUNLIKY Heat-Generating Agent and Adhesive [New Model Listing] High-Performance Material Collection
  2. One-component ultra-low temperature curing epoxy adhesive 'f·Stick 4410 series'
  3. 高機能エポキシ系接着剤『f・Stickシリーズ』
  4. 4 Epoxy adhesive Araldite RAPID 寺田
  5. 5 Conductive adhesive that cures at room - ONE-HAND MIXINGⓇ ペルノックス

glue Product List

931~960 item / All 1091 items

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Hot melt adhesive for carpet backing "Hirodine 7000"

Methods such as extrusion lamination, inflation, and roll coating are possible!

The "Hirodine 7000" is a hot melt adhesive that can be used for carpet backing. It offers cost reduction proposals through labor-saving and high-speed processes, featuring heat seal methods, shortened adhesive curing time with 100% solid content without solvents, and improved fiber penetration due to its low melting point. Additionally, it is suitable for continuous operations using roll-to-roll processes, with high adaptability for width expansion and increased line speed, making it easy to establish labor-saving and mass production methods. 【Features】 ■ Heat seal method ■ Shortened adhesive curing time with 100% solid content without solvents ■ Improved fiber penetration due to low melting point *For more details, please download the PDF or feel free to contact us.

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Hot melt adhesive for IC tags 'Hirodine 7000'

Proposal for cost reduction through labor-saving and high-speed processes! Adhesive can also be applied to difficult-to-bond materials such as metals and glass.

"HIRODAIN 7000" is a hot melt adhesive material that can be used for IC tags. In addition to adhering to substrates such as PE, PP, PET, and PS, it can also bond to difficult materials like metals and glass, making it suitable for a wide range of industrial and manufacturing applications. Furthermore, it offers cost reduction proposals through labor-saving and high-speed processes, featuring characteristics such as reduced adhesive curing time with heat seal methods and 100% solid content without solvents. [Features] ■ Heat seal method ■ Reduced adhesive curing time with 100% solid content without solvents *For more details, please download the PDF or feel free to contact us.

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Introduction of case studies on the use of heat sealants and hot melt adhesives!

Customizable upon request! We also accommodate samples and consider new developments!

We would like to introduce examples of the adoption of gravure coating agents handled by Leader Co., Ltd. Our "heat sealant" is utilized in various fields, including pharmaceuticals and food, taking advantage of its high safety and hygiene properties as well as its adhesion between different materials. Additionally, our "hot melt adhesive" is employed for lid materials of refrigerated and frozen foods, leveraging its high safety and hygiene properties. If you have any interest in our products, we are happy to provide samples and discuss new development opportunities, so please feel free to contact us. [Adoption Examples] *Excerpt ■ PTP packaging, food packaging ■ Food trays ■ Automotive-related ■ Daily necessities ■ General packaging *For more details, please refer to the PDF materials or feel free to contact us through our website.

  • glue
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One-component heat-releasing epoxy adhesive [developed product]

It is an adhesive with a high thermal conductivity of 3.1~3.3 W/m·k.

The thermally conductive one-component epoxy adhesive has the following features: 【Features】 ■ It has a high thermal conductivity (3.1~3.3 W/m·k), making it suitable for thermal dissipation applications. ■ There are grades with a high glass transition temperature of 200°C. ■ It can be considered for heat generation measures and thermal interface materials (TIM). ■ Being a one-component adhesive, there is no need for weighing or mixing, resulting in good workability. ■ It excels in workability, stability, and electrical insulation. ■ Two grades with different reactivity and glass transition temperatures are available for selection.

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Conductive adhesive for the energy industry, room temperature curing type.

Easily achieve professional quality solar panel connections with one hand.

In the energy industry, particularly in the connection of solar cells, long-term reliability and stable conductivity are required. Solar panels are exposed to outdoor conditions and temperature changes, making it important to ensure the durability of connections and minimize the impact on heat-sensitive components. Improper connections can lead to decreased power generation efficiency and potential failures. Our room-temperature curing conductive adhesive ONE-HAND MIXINGⓇ provides reliable conductivity without the need for heating, making it safe to use with heat-sensitive materials, thus making it suitable for solar cell connections. 【Application Scenarios】 - Wiring connections for solar cell modules - Connections for flexible solar cells - Conductive repairs for outdoor equipment 【Benefits of Implementation】 - Reduces work time by eliminating the need for soldering - Minimizes damage to heat-sensitive components - Maintains stable conductivity even under vibration and stress

  • Repair Agent
  • Solder
  • glue
  • glue

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Room temperature curing conductive adhesive for semiconductors

Completed with one hand. Professional quality conductive repair for everyone.

In the semiconductor industry, chip fixation requires reliable connections of tiny components and compatibility with heat-sensitive materials. It is particularly important to maintain the conductivity of precise circuits while enhancing work efficiency. Our room-temperature curing conductive adhesive eliminates the need for soldering irons, providing reliable conductivity and adhesion strength without causing thermal damage. 【Application Scenarios】 - Fixing and wiring semiconductor chips - Conductive connections for heat-sensitive components - Repairing flexible substrates - Creating and repairing circuits for prototyping and experimental purposes 【Benefits of Implementation】 - Reduces work burden by eliminating the need for soldering - Avoids damage to heat-sensitive components - Ensures stable conductivity with low resistance - Flexible enough to accommodate bending and vibrations - Improves work efficiency with one-handed operation

  • Repair Agent
  • Solder
  • glue
  • glue

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"Hot melt adhesive for adhesive processing" Moresco Melt BM-508

This is a biomass mark certified product by the Japan Organic Resources Association, which contains 25% biomass. It can be applied even in low-temperature environments of -18°C!

This is a hot melt adhesive used for labels for refrigeration and freezing applications. It has excellent adhesion in low-temperature environments and can adhere even at -18°C. It contains 25% biomass and is certified with the biomass mark by the Japan Organic Resources Association.

  • glue
  • glue
  • glue

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"Hot melt adhesive for adhesive processing" Moresco Melt BM-546Z

This is a product certified with the Biomass Mark by the Japan Organic Resources Association, containing 30% biomass. It has good die-cutting suitability and excellent oil bleed resistance.

This is a hot melt adhesive used for labels and the adhesive on envelope flaps. It has good die-cutting suitability and excellent oil bleed resistance. It contains 30% biomass and is certified with the Biomass Mark by the Japan Organic Resources Association.

  • glue
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Leave it to us for small lots and small quantities - 'Continuing OEM'

There’s no need to give up just because it’s a small quantity. We fully accommodate small lots!

Orders are decreasing, and our in-house equipment is inefficient... We are considering discontinuation as we do not meet the minimum lot size... Despite having customers who say, "We still want it," we can't produce it because the quantity is too small. This dilemma can be resolved by "Continuing OEM." Our company can accommodate small lot production. We manufacture original putty starting from 40kg. By outsourcing even small quantities, we continue to produce your products. ◆ Strengths of Small Lot Production - Original putty: Available from 40kg - Supports diverse small lot production - Flexible production schedule - Minimization of inventory risk We handle all processes from raw material procurement to shipping. We can also accommodate high-viscosity products (over 100,000 mPa·s). We can continue to respond to the voices of customers who say, "We still want it." If you are struggling with small production runs, please feel free to consult with us.

  • Contract manufacturing
  • Processing Contract
  • Other contract services
  • glue

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[Research Material] The Global Market for Industrial Adhesives and Tapes

Global Market for Industrial Adhesives and Tapes: Hot Melt, Contact Spray, Acrylic, Anaerobic Adhesives, Epoxy Adhesives, Others, Automotive ...

This research report (Global Industrial Adhesives and Tapes Market) investigates and analyzes the current state and outlook for the global industrial adhesives and tapes market over the next five years. It includes information on the overview of the global industrial adhesives and tapes market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the industrial adhesives and tapes market include hot melt, contact spray, acrylic, anaerobic adhesives, epoxy adhesives, and others, while the segments by application cover automotive, construction, electronics, medical, mining, oil and gas, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size for industrial adhesives and tapes. It also includes the market share of major companies in the industrial adhesives and tapes sector, product and business overviews, and sales performance.

  • Other services
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[Research Material] Global Market for Water-Based Adhesives for Footwear

Global Market for Water-Based Adhesives for Footwear: Polyurethane, Acrylic, Others, Sports Shoes, Leather Shoes, Others

This research report (Global Water-based Shoes Adhesive Market) investigates and analyzes the current state and outlook for the global market of water-based adhesives for shoes over the next five years. It includes information on the overview of the global water-based adhesive market for shoes, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the water-based adhesive market for shoes include polyurethane, acrylic, and others, while the segments by application cover sports shoes, leather shoes, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size for water-based adhesives for shoes. It also includes the market share of major companies in the water-based adhesive market for shoes, product and business overviews, and sales performance.

  • Other services
  • glue

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[Research Material] World Market for Acid-Resistant Adhesives

World Market for Acid-Resistant Adhesives: Single-Component, Two-Component, Medical, Aerospace, Electronics, Others

This research report (Global Acid Resistant Adhesive Market) investigates and analyzes the current state and outlook for the global acid-resistant adhesive market over the next five years. It includes information on the overview of the global acid-resistant adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the acid-resistant adhesive market focus on single-component and two-component adhesives, while the segments by application cover medical, aerospace, electronics, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size for acid-resistant adhesives. It also includes the market share of major companies in the acid-resistant adhesive sector, product and business overviews, and sales performance.

  • Other services
  • glue

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[Research Material] Global Market for Adhesives for Wearable Devices

Global Market for Adhesives for Wearable Devices: Acrylic-based, Silicone-based, Others, Wearable Medical Devices, Consumer Wearable Electronics ...

This research report (Global Adhesives for Wearable Devices Market) investigates and analyzes the current status and outlook for the global market for adhesives used in wearable devices over the next five years. It includes information on the overview of the global market for adhesives for wearable devices, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments for adhesives for wearable devices by type include acrylic-based, silicone-based, and others, while the segments by application cover wearable medical devices, consumer wearable electronics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for adhesives for wearable devices. It also includes the market share of major companies in the adhesives for wearable devices sector, product and business overviews, and sales performance.

  • Other services
  • glue

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[Research Material] The Global Market for PUR Hot Melt Adhesives

Global Market for PUR Hot Melt Adhesives: Thermoplastic PUR Hot Melt Adhesives, Reactive PUR Hot Melt Adhesives, Textiles & Footwear, Construction, ...

This research report (Global PUR Hot Melts Adhesives Market) investigates and analyzes the current status and outlook for the global market of PUR hot melt adhesives over the next five years. It includes information on the overview of the global PUR hot melt adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include thermoplastic PUR hot melt adhesives and reactive PUR hot melt adhesives, while the segments by application cover textiles and footwear, construction, packaging industry, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of PUR hot melt adhesives. The report also includes the market share of major companies in the PUR hot melt adhesives sector, product and business overviews, and sales performance.

  • Other services
  • glue

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[Research Material] World Market for Polymer Adhesives

Global Market for Polymer Adhesives: Synthetic, Natural, Consumer Goods, Food & Beverage, Packaging & Printing, Plastics, Pharmaceuticals & Medical, Others

This research report (Global Polymer Adhesives Market) investigates and analyzes the current state and outlook for the global polymer adhesives market over the next five years. It includes information on the overview of the global polymer adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the polymer adhesives market focus on synthetic and natural types, while the segments by application cover consumer goods, food and beverages, packaging and printing, plastics, pharmaceuticals and medical, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of polymer adhesives. It also includes the market share of major companies in polymer adhesives, product and business overviews, and sales performance.

  • Other services
  • glue

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[Market Report] Global Market for Elastic Adhesives

The global market for elastic adhesives is expected to grow rapidly, reaching 35.08 billion USD by 2031, with a notable CAGR of 6.6%.

The global market for elastic adhesives is expected to see significant expansion driven by advancements in adhesive technology and applications across diverse industries. The market size in 2022 was estimated at $19.74 billion, and it is projected to achieve a remarkable valuation of $35.08 billion by 2031. This growth trajectory is supported by a robust compound annual growth rate (CAGR) of 6.6% from 2023 to 2031. Elastic adhesives are attracting attention across a wide range of industries, from construction to automotive, healthcare, and packaging. These versatile adhesives are valued for their ability to provide flexible bonding solutions that adapt to various stress levels, temperature fluctuations, and substrate characteristics. You can check the application method by clicking the [PDF Download] button or apply directly through the related links.

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Silicone adhesive "DOWSIL SE 9186 Sealant"

It has liquidity and allows for filling and self-leveling! Fast-drying type.

"DOWSIL SE 9186 Sealant" is a one-component, room-temperature curing silicone adhesive. It is translucent or white, featuring fast-drying properties and is a low-molecular siloxane reduced product. It is flexible and low-stress. After application, it has fluidity, allowing for filling and self-leveling, and it also addresses potential stress cracks due to sealing. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Curing can be accelerated by heating ■ Fluidity (allows for filling and self-leveling after application) ■ Flexibility, low stress ■ Solvent-free ■ Low-molecular siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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Silicone adhesive "DOWSIL SE 9189 L RTV"

Flame-retardant UL94 V-0 compliant! A fast-drying silicone material with good fluidity.

"DOWSIL SE 9189 L RTV" is a silicone adhesive that is fluid and available in white or gray. It is a one-component, room-temperature curing adhesive with a short tack-free time, eliminating the need for an oven. Curing can also be accelerated by heating. This product has been formulated to reduce low molecular weight siloxanes and is fast-drying. It is flexible and low-stress, with coloring added to prevent interference with the identification of electronic components. It is a solvent-free type. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Curing can also be accelerated by heating ■ Fluidity ■ Flexibility, low stress ■ Coloring to prevent interference with the identification of electronic components ■ UL94 V-0 (flame retardant) *For more details, please download the PDF or feel free to contact us.

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DOWSIL (TM)3145 RTV Mil-A-46146

No mixing required, a room temperature curing type that does not need a heating oven!

"DOWSIL(TM) 3145 RTV Mil-A-46146 Adhesive/Sealant" is a one-component, room temperature curing silicone adhesive. It is gray, non-flowable, and exhibits high tensile strength and elongation properties, conforming to MIL-A-46146. By promoting heating, it achieves faster inline curing processes. It is a product with high thermal stability. 【Features】 ■ Non-flowable ■ High tensile strength and good elongation properties ■ High thermal stability ■ Conforms to MIL-A-46146 ■ No mixing required, room temperature curing type ■ Achieves faster inline curing processes through heating promotion *For more details, please download the PDF or feel free to contact us.

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Heat-conducting silicone adhesive "DOWSIL(TM) SE 4450"

Thermal conductivity of 1.9 W/m·K! Achieving heat dissipation from delicate electronic components.

"DOWSIL(TM) SE 4450" is a one-component, gray, heat-curing silicone adhesive for heat dissipation. Before curing, it has fluidity, and after curing, it exhibits excellent strength. It is a solvent-free type with high tensile strength. After dispensing, it can fill and self-level. It is a versatile heat-curing type, and since it is one-component, there is no need to mix multiple components. 【Features】 ■ One-component - No need to mix multiple components ■ Solvent-free type ■ Fluidity - Can fill and self-level after dispensing ■ Versatile heat-curing type ■ High tensile strength ■ Thermal conductivity - Dissipates heat from delicate electronic components 1.92W * For more details, please download the PDF or feel free to contact us.

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Heat-conductive silicone adhesive 'DOWSIL(TM) SE 4485'

1-component type, room temperature curing with a short tack-free time and no need for an oven! UL 94 V-0 certified.

"DOWSIL(TM) SE 4485" is a white, semi-flowable, fast-drying, room-temperature curing thermal silicone adhesive. It is designed to provide efficient heat transfer for cooling modules such as lamps, communication devices, and power supplies, and it combines good adhesion and thermal conductivity. It has obtained UL 94 V-0 certification and contributes to improved work efficiency due to its short tack-free time. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Semi-flowable ■ Short tack-free time ■ Good adhesion ■ Thermal conductivity ■ UL 94 V-0 certified *For more details, please download the PDF or feel free to contact us.

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Heat-conductive silicone adhesive 'DOWSIL SE 4486'

Excellent fluidity and quick-drying! A low molecular siloxane reduction product with high thermal conductivity.

"DOWSIL SE 4486" is a one-component, white, room-temperature curing thermal silicone adhesive. It is designed to have efficient thermal conductivity for cooling devices such as home appliances and has good adhesion properties. Being a one-component and room-temperature curing product, it has a short tack-free time and does not require an oven. It is semi-flowable and a low molecular siloxane reduced product. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Semi-flowable ■ Good adhesion ■ Thermal conductivity 1.6W ■ Low molecular siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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Silicone adhesive "Dowsil (TM)SE 9120"

Rapid-acting, non-adhesive radiation therapy! A product that cures at room temperature, eliminating the need for an oven.

"Dow Corning SE 9120" is a one-component, translucent, fast-drying, low-viscosity room temperature curing silicone adhesive. It is suitable for insulation protection coating applications, contains no added solvents, and requires no mixing. It has good flowability, fillability, and self-leveling properties after dispensing. It controls the volatility of silicone and reduces the potential generation of silicone volatile substances. It is a product that can be easily reprocessed. 【Features】 ■ Low viscosity ■ Controls silicone volatility ■ No added solvents ■ No mixing required ■ Room temperature curing, no oven needed ■ High-speed inline processing at room temperature (with heating acceleration option) *For more details, please download the PDF or feel free to contact us.

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Ultraviolet Curing Adhesive "Alonix UV Series"

Adjustable hardness, hardness, and viscosity! Suitable for a wide range of bonding including electronic components, metals, glass, and plastics.

The "Aronix UV Series" is a one-component UV-curable resin formulation based on the acrylic-based special monomer and oligomer "Aronix M Series" developed by Toa Gosei. It can be used in conjunction with heat curing as needed, allowing for curing from thick films to thin films. Additionally, it can produce cured materials that range from tough to flexible and elastic, enabling a wide selection and design of curing methods and properties of the cured products. Furthermore, due to its rapid curing under ultraviolet light, it facilitates the automation and acceleration of manufacturing processes, leading to significant cost reductions. 【Features】 ■ One-component, excellent workability ■ Cures quickly under ultraviolet light ■ Easy automation and acceleration of manufacturing processes ■ Significant cost reduction possible ■ Wide selection and design of curing methods and properties of cured materials *For more details, please refer to the PDF document or feel free to contact us.

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Industrial adhesive Saphalon 82

A spray type that is elastic and does not compromise the softness of polyurethane foam.

We provide high-value adhesives that achieve high production efficiency and support the creation of high-quality, high-functionality products.

  • Chemicals
  • glue

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Hot melt heat hose

Various types available! Heat hoses specialized in various manufacturing processes and adhesives! (News edition)

The heat hose transports hot melt that has been melted using applicators, extruders, drum melters, etc. Through years of research and development and sales achievements, we have lined up heat hoses that cater to various manufacturing processes and adhesives. * We offer a variety of hose types, including those for pressure resistance, high temperature, and PUR! ~~ We propose solutions based on our customers' challenges ~~ It can be used in various industries within the manufacturing sector.

  • Interior parts
  • Other processing machines
  • glue
  • glue

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