We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
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glue Product List and Ranking from 280 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jun 10, 2026～Jul 07, 2026
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jun 10, 2026～Jul 07, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 寺田 Tokyo//Electronic Components and Semiconductors
  3. null/null
  4. 4 理経 Tokyo//IT/Telecommunications
  5. 5 積水フーラー Tokyo//Chemical
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glue Product ranking

Last Updated： Aggregation Period:Jun 10, 2026～Jul 07, 2026
This ranking is based on the number of page views on our site.

  1. SUNLIKY Heat-Generating Agent and Adhesive [New Model Listing] High-Performance Material Collection
  2. One-component ultra-low temperature curing epoxy adhesive 'f·Stick 4410 series'
  3. 高機能エポキシ系接着剤『f・Stickシリーズ』
  4. 4 Epoxy adhesive Araldite RAPID 寺田
  5. 5 Conductive adhesive that cures at room - ONE-HAND MIXINGⓇ ペルノックス

glue Product List

961～990 item / All 1091 items

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Structural adhesive PLEXUS

Structural adhesive PLEXUS

Structural adhesive that achieves strong bonding! Reduces the need for rivets and welding, and can bond difficult materials without a primer.

To customers using "epoxy adhesives": → Are you worried about cracks, peeling, or sink marks on the surface caused by rigid bonding? → Is the overly strict mixing ratio becoming a hassle for you? → Are you struggling with the slow strength development and the curing time and space? To customers using "urethane adhesives": → Is primer treatment becoming part of your work process? → Are you concerned about insufficient strength at the bonding points? → Is storage stability due to humidity becoming an issue? To customers using "rivets, bolts, and welding": → Are you considering reducing the processes involved in drilling, installation, bonding, and sealing with silicone? → Are issues like distortion and poor finishing becoming a problem? → Are there any concerns regarding long-term reliability? PLEXUS will address these needs while significantly reducing costs.

  • glue
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TRA-CON/Epoxy Mixer Adhesive for Optical Connectors

TRA-CON/Epoxy Mixer Adhesive for Optical Connectors

Adhesive for optical connectors from TRA-CON Corporation

TRA-CON's adhesive for optical connectors is available for sale in 2g packages. ● Usage Examples Assembly of connectors for various optical fibers used in optical communication Assembly of connectors for various optical fibers used in data communication Assembly of various optical devices *Short delivery time: Low price* You can place your order immediately from the web.

  • glue
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A strong adhesive that sticks well and peels off cleanly: "Pita! to Peel."

A strong adhesive that sticks well and peels off cleanly: "Pita! to Peel."

Can be used indoors and outdoors! It is also highly water-resistant, so it can be used anywhere! *Video available.

Pita! Peel is a removable adhesive for posters. Just apply it, and it holds strongly! Plus, it can be removed when no longer needed. It is perfect for displaying posters and notices not only indoors but also outdoors. It can be used on uneven surfaces where tape doesn't stick well or in areas exposed to water. Additionally, it is water-resistant, making it ideal for use in kitchens and wet areas. Its paste-like consistency allows you to apply it in your desired shape. Once it hardens, it can be removed cleanly without leaving any residue. It can be used without dirtying or damaging the surrounding area. *For more details, please contact us or download and view the catalog.

  • glue
  • Repair Agent
  • glue

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Adhesives for bonding with PVC resin, flame-retardant coatings for electric wires, and insulating seals.

Adhesives for bonding with PVC resin, flame-retardant coatings for electric wires, and insulating seals.

Available for selection from ethyl acetate, MEK, toluene, etc.! In addition to providing as a resin solution, we also support the formulation of your original products with fillers and pigments dispersed.

☆ We provide PVC acetate resin solutions! ~ Various types of PVC acetate resins can be dispersed and dissolved. ☆ You can select the solvent! ~ Options include ethyl acetate, MEK, toluene, and more. ~ Additionally, solutions can be made with not only single solvents but also mixed solvents. ☆ Solid content of approximately 5% to 40% is possible! ~ We can provide a 40% solid content product for ethyl acetate/sole solvent (as a resin solution). ☆ Custom formulations for your original recipes are possible! ~ We can offer not just resin solutions but also formulations that disperse fillers and pigments for your original products. ☆ Filling into various packaging forms is possible! ~ We can fill not only 18L containers but also various other types of containers.

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[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding

[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

  • plastic
  • Coating Agent
  • Other electronic parts
  • glue

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Hot Melt Molding Case Study: "Waterproof Connector"

Hot Melt Molding Case Study: "Waterproof Connector"

Introduction to the hot melt molding method that completes 4 waterproof connectors in 30 seconds.

Hot melt molding is a molding technique that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce examples of process improvement and value analysis through the switch from waterproof connector rubber bushings. [Challenge] We want to waterproof the wire insertion area. *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Automotive Connectors
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High-performance adhesive "1-component epoxy resin adhesive"

High-performance adhesive "1-component epoxy resin adhesive"

It is compatible with many materials and exhibits strong adhesion. It is a one-component type that eliminates the hassle of mixing.

Alteco aims for further innovation in adhesives and adhesive technology through daily research and development, responding to the needs of the cutting-edge industrial sector. We provide custom-made products tailored to specific applications and purposes. 【Features】 ◆ Convenient one-component type The one-component type eliminates the hassle of mixing, enhancing work efficiency. ◆ Strong adhesion Compatible with many materials, it exhibits robust adhesive properties. ◆ Excellent durability It excels in heat resistance, water resistance, weather resistance, and chemical resistance, and is used in applications such as IC chip reinforcement agents and underfill materials. ◆ Environmentally friendly It is low in chlorine and bromine and complies with RoHS directives. A product compatibility chart (applications/properties/compatible products, etc.) can be viewed by downloading the catalog. ——————————————————————————————————————— ↓ ↓ ↓ ↓ ↓ ↓

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Hot melt adhesive (PA: polyamide-based)

Hot melt adhesive (PA: polyamide-based)

Instant bonding and insulation sealing of electronic components!

It is possible to instantly complete the potting and fixing work of electronic components and wire harnesses.

  • glue
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Hot melt adhesive (SR: synthetic rubber-based)

Hot melt adhesive (SR: synthetic rubber-based)

Instant bonding with adhesive hot melt at high speed!

Significant cost reduction is possible as an alternative to double-sided tape.

  • glue
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Hot melt gun glue gun (desktop foot switch type)

Hot melt gun glue gun (desktop foot switch type)

Achieve precise coating and two-handed operation with foot switch control!

The tabletop foot switch type applicator allows for precise application of hot melt using a foot switch, making it ideal for gluing small boxes and items that require both hands, as well as for filling tasks with melt or resin.

  • glue
  • Other processing machines
  • Other packaging machines
  • glue

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Hot melt adhesive for packaging "Asahi Melt Series"

Hot melt adhesive for packaging "Asahi Melt Series"

Asahi Melt will deliver benefits to your company.

This is a packaging hot melt adhesive used for sealing cardboard boxes and bonding small cartons. It is used as an alternative to tape sealing, and when sealed with hot melt adhesive, it requires no manual labor, improves productivity, and reduces running costs. Our "Asahi Melt" is used in everyday items such as sealing tissue boxes, ice cream boxes, direct mail envelopes, attaching handles (strings) to shopping bags, and bonding straw packs on beverage containers. We offer a lineup of series tailored to various applications. *For more details, please contact us.*

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Low-temperature coating and packaging hot melt adhesive "Asahi Melt LR Series" 2

Low-temperature coating and packaging hot melt adhesive "Asahi Melt LR Series" 2

【Hot Melt for Packaging】Reduces costs and carbide issues with low-temperature application: Asahi Melt LR Series

To the production management and maintenance personnel of food, beverage, and daily necessities manufacturers, Are you currently facing issues with your EVA-based hot melt adhesive, such as "rising electricity costs," "nozzle clogging (carbonization)," and "line contamination due to stringing"? The "Asahi Melt LR Series" is a low-temperature application type of EVA-based hot melt adhesive that allows for use at 140-150°C. It achieves significant energy savings and reduces maintenance labor while maintaining adhesion strength superior to that of olefin-based adhesives. This product is ideal for sites facing such challenges: Beverage manufacturers: Want stable application on high-speed lines and to reduce carbonization troubles. Food manufacturers: Looking to improve the packaging room environment and reduce CO2 emissions. Daily necessities manufacturers: Aiming to lower inspection and disposal costs due to adhesion failures and contamination. [Contact Us / Sample Request] Please let us know your current challenges (cost, maintenance, adhesion failures, etc.) through the related link URL. Our representative will propose the optimal conditions for your production line. *Our representative will contact you promptly.

  • glue
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Introduction to Adhesives and Adhesive Technology - Basics, Functionality, Evaluation, Troubleshooting

Introduction to Adhesives and Adhesive Technology - Basics, Functionality, Evaluation, Troubleshooting

A must-attend course packed with essential knowledge about adhesives and bonding techniques that are currently in demand, covering everything from the basics to troubleshooting!

【Date and Time】January 27, 2011 (Thursday) 10:30-16:30 　【Lecture ends at 16:00. 16:00-16:30: Free time Q&A (reservation required, first-come, first-served)】 【Capacity】30 people *Once full, we will close applications. Please apply early. 【Participation Fee】48,300 yen per person (including tax, lunch, and text costs)

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
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Development Trends of Imidazole-based Curing Agents and Curing Accelerators for Epoxy Resin Formulations

Development Trends of Imidazole-based Curing Agents and Curing Accelerators for Epoxy Resin Formulations

★ What are the curing mechanisms of amine-based, anhydride, and catalytic hardeners? ★ What measures can be taken to improve heat resistance, weather resistance, impact resistance, and flexibility?

Speaker Part 1: Technical Consultant, Ph.D. Kazuo Kamagata Part 2: Shikoku Chemical Industrial Co., Ltd., Functional Materials Team, Mitsuichi Yoshinari Target Audience: Researchers and personnel interested in organic EL and organic EL materials Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Chuo Ward] 4-minute walk from Toei Asakusa Line, Higashi-Nihonbashi Station Date and Time: September 29, 2011 (Thursday) 13:00-16:15 Capacity: 30 people *Please apply early as there may be a rush of applications. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people from one company *Limited to Tech-Zone members who apply by September 15. Membership registration is free. *After September 15, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people from one company. ◆When applying for the early bird discount, please select “1 person (early discount)” or “2 people (early discount)” in the number registration. ◆If 3 people from the same organization apply, the fee will be 69,300 yen.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
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Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!

Lecturers Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd. Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials. Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen) ◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price. *However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free. *After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • glue

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Fundamentals and improvement of durability and weather resistance of construction adhesives and sealants, evaluation, and regulations.

Fundamentals and improvement of durability and weather resistance of construction adhesives and sealants, evaluation, and regulations.

It is essential to adapt to various quality requirements such as waterproofing, earthquake resistance, weather resistance, high durability, design, and environmental compatibility, and to maintain these for a long period!

☆You won't hear this anywhere else! An explanation of the waterproofing functions related to adhesive properties, dynamic followability, and long-term durability of difficult-to-bond materials being studied by the Architectural Institute of Japan and ISO committees, as well as the current situation regarding various contamination phenomena and future trends! ☆Preliminary content request service is currently available! We welcome your technical challenges!

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
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Laminating Adhesive "LAM"

Laminating Adhesive "LAM"

The curing method is UV! It is suitable for applications such as OLED low refractive index grids.

"LAM" is a laminate adhesive characterized by its unique combination of high adhesion strength and low refractive index. It offers a lineup including "LAM-134" with an adhesion strength of 200g/cm, "LAM-135" with 700g/cm, and "LAM-136" with 400g/cm. It has been introduced in various AR and VR displays and has received high praise. 【Specifications (partial)】 ■LAM-134 ・Refractive index (589nm): 1.346 ・Refractive index (950nm): 1.341 ・Elastic modulus (MPa): na ・Viscosity (CPS): 17000 ・Tensile strength (MPa): na *For more details, please refer to the related links or feel free to contact us.

  • glue
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Evergrip

Evergrip

It is a rubber-based adhesive. There are two types: solvent-based and hot melt.

The industrial adhesive "Evergrip" has been developed for a wide range of applications including building materials, woodworking, automotive parts, packaging, industrial use, and shoemaking. Beyond the products listed in the catalog, we respond to our customers' diverse needs with advanced consulting techniques.

  • furniture
  • glue

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Almighty

Almighty

High-performance reactive adhesive!

We have a variety of unique grades developed through our proprietary technology, including epoxy-based, urethane-based, and nylon-based materials. They are used in a wide range of fields such as electronic materials, automotive, and building materials for housing.

  • glue
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Rigid polyurethane and environmental issues

Rigid polyurethane and environmental issues

We have been addressing environmental issues! We have introduced high-pressure injection machines that do not require detergents.

We will introduce hard polyurethane and environmental issues. Our company has been addressing environmental issues for some time now. We have introduced high-pressure injection machines that do not require cleaning agents, and we have been using raw materials that do not use fluorocarbons (specific fluorocarbons and alternative fluorocarbons) as foaming agents. Please feel free to contact us if you have any requests. [Our Initiatives] ■ Introduction of high-pressure injection machines that do not require cleaning agents ■ Use of raw materials that do not use fluorocarbons as foaming agents *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials
  • glue

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Hard polyurethane treatment and dioxin issues

Hard polyurethane treatment and dioxin issues

Among the raw materials for rigid polyurethane, those that contain chlorine are freon and flame retardants!

We will introduce the hard polyurethane treatment and the dioxin issue. Dioxins are primarily generated as by-products during combustion processes such as waste incineration and in the manufacturing processes of organochlorine chemicals, with municipal waste incinerators identified as a major source. Among the raw materials for hard polyurethane, chlorinated substances include freons and flame retardants; however, the materials we use do not contain either of these. [Our Initiatives] ■ The raw materials we use do not contain freons or flame retardants. *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials
  • glue

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Silicone Sintered Body Adhesive "Sanwax MTC-201"

Silicone Sintered Body Adhesive "Sanwax MTC-201"

Introducing a versatile wax for ultrasonic, slicing, dicing, wrapping, and centerless applications.

The "Sanwax MTC-201" is an adhesive designed with the consideration that the performance of the wax does not change with heating. It is versatile for applications such as ultrasonic, slicing, dicing, wrapping, and centerless processes, and has the combined effectiveness of both "TXW" and "CHV-101". Additionally, it can be removed by boiling with alcohol or neutral detergent. Please feel free to contact us when you need assistance. 【Features】 ■ Versatile for ultrasonic, slicing, dicing, wrapping, and centerless processes ■ Has the combined effectiveness of "TXW" and "CHV-101" ■ Can be removed by boiling with alcohol or neutral detergent *For more details, please download the PDF or feel free to contact us.

  • glue
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[English Market Research Report] Global Market for Defense Tactical Radios

[English Market Research Report] Global Market for Defense Tactical Radios

"Free samples" are currently being offered! Please check the application method from the [PDF download] button, or apply directly from the related links.

The market size for defense tactical communications is expected to grow rapidly over the next few years. By 2028, it is projected to reach $24.18 billion with a compound annual growth rate (CAGR) of 10.8%. The anticipated growth during the forecast period is attributed to the increasing global emphasis on preventive dental care, rising demand for minimally invasive dental procedures, regulatory efforts promoting the safety and efficacy of dental products, and the evolution of trends in dental care that influence usage patterns, such as adhesives and sealants. Key trends expected during the forecast period include advancements in dental technology, a growing focus on aesthetic dentistry, the development of innovative medical tools, and the promotion of partnerships and collaborations.

  • Other services
  • glue

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Epoxy adhesive for tile fixtures EA=928 <Sample available>

Epoxy adhesive for tile fixtures EA=928 <Sample available>

We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "National Tile Industry Association for Adhesive Tile Products."

Epoxy adhesive EA=925 is an adhesive for decorative tiles. It has a relatively high viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Decorative Tiles" set by the Japan Tile Industry Association, providing strong adhesion for decorative tiles. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=928 is a high-viscosity type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.

  • glue
  • Chemicals
  • glue

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Heat-dissipating silicone adhesive

Heat-dissipating silicone adhesive

Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation.

Features and Benefits • Thermal conductivity • Soft, compressible • Self-adhesive • Non-flowable and thermosetting • No curing by-products • Addition curing with platinum catalyst

  • Other polymer materials
  • Other electronic parts
  • glue
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Low-temperature curing conductive adhesive "Muromac Bond H-220"

Low-temperature curing conductive adhesive "Muromac Bond H-220"

Two-component conductive adhesive that can cure from 50°C for bonding heat-sensitive components.

It is a two-component conductive adhesive that can cure at low temperatures starting from 50℃.

  • glue
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UV curing adhesive for lens bonding

UV curing adhesive for lens bonding

UV-curable refractive index adjusting adhesive suitable for lens bonding. Adjustments can be made to match the refractive index required for glass materials and lenses. Compatible with large-diameter lenses and features low distortion.

This is a UV-curable refractive index adjustment resin suitable for bonding composite lenses that can be stored at room temperature. It boasts high transparency, so it does not adversely affect the optical path when used. Additionally, it features a low distortion design, allowing for bonding without distorting the lenses even when used with large-diameter lenses.

  • lens
  • lens
  • Glass
  • glue

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Reactive hot melt adhesive with water resistance to hydrolysis.

Reactive hot melt adhesive with water resistance to hydrolysis.

A reactive hot melt that withstands hydrolysis testing, which was a weakness of urethane-based adhesives.

It is a polyurethane-based reactive hot melt adhesive that does not hydrolyze even after exposure to an environment of 85°C and 95% RH, maintaining the performance of the material.

  • Composite Materials
  • glue

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