Points to consider when designing components with flip chip using AuSn joints.
During prototyping and mass production, problems are sure to arise! Points to consider for quality when designing AuSn joints.
The content I am about to reveal is based on our company's past experiences. Many of these experiences were gained during the mass production of LDs at Sanyo Electric. Additionally, regarding LEDs, we have gained significant experience while assisting with problem-solving during the implementation of CREE chip flip chips, which are based on AuSn bonding. The main purpose of this column is to help you recognize the quality considerations that should be taken into account when designing AuSn bonded products. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*
- Company:佐用精機製作所
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