[Case Study] Mechanism of Silicon Wafer (Semiconductor) Cleaning
This is an introduction to a case that clearly shows the area ratio that can be cleaned has reached 92%!
Here is a case study on the mechanism of silicon wafer cleaning. By utilizing the characteristic of ultra-fine bubbles that creates high pressure inside, we experimentally verified the effect of removing fine particles from solid surfaces using pressure waves. It was revealed that fine particles larger than 1 micron were removed and became unobservable, and that the area ratio of the cleaned surface reached 92%. 【Cleaning Effect】 ■Before cleaning: 359–472 µm² ■After ultrapure water cleaning: 320–482 µm² ■After ultrapure water jet + ultra-fine bubble cleaning - 1000x image: 28.65 µm² - 3000x image: 37.33 µm² *For more detailed information about the case study, please refer to the related link. For further inquiries, feel free to contact us.
- Company:OKエンジニアリング
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