We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for resin.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

resin Product List and Ranking from 435 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

resin Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

  1. 三菱ガス化学ネクスト（旧日本ユピカ） 本社 Tokyo//Resin/Plastic
  2. 寺田 Tokyo//Electronic Components and Semiconductors
  3. 吉田ＳＫＴ Aichi//Manufacturing and processing contract
  4. 4 ヤスハラケミカル Tokyo//Chemical
  5. 5 MUROMACHI CHEMICALS INC. Chemicals Division Fukuoka//Chemical
Go to Company Ranking

resin Product ranking

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

  1. Epoxy Resin Zero Mar Series for Sample Grinding [Made in Japan] アイエムティー
  2. Heat-curable resin for CFRP CBZ 三菱ガス化学ネクスト（旧日本ユピカ） 本社
  3. Joint Surface Treatment Agent "Hitlock B" イチネンケミカルズ
  4. 4 Concrete joint surface treatment agent "Tritex CB-20" Sanyo Trading Co., Ltd.
  5. 5 What is the difference between fluororubber, Teflon, and fluororesin? 吉田ＳＫＴ

resin Product List

1351～1365 item / All 1452 items

Displayed results
UV-curable resin, high strength type TRU-0212

UV-curable resin, high strength type TRU-0212

It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

  • Other polymer materials
  • Coating Agent

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Room temperature short-term curing epoxy resin TE-6011K

Room temperature short-term curing epoxy resin TE-6011K

A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

  • Other polymer materials
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Inspection jigs and model epoxy resin Teradite

Inspection jigs and model epoxy resin Teradite

These are epoxy resin products that can be used for inspection jigs and models. They include gel coats, backing, casting, laminating, workable resins, release agents, and more.

This is a list of our company's brand epoxy resin "Teradite" for two-component mixed epoxy resin used for tooling. It is usually in stock, so you can purchase it in small quantities. *Contents of the document* ■ For vacuum, pressure, and RIM molding surface gel coat ■ For heat-resistant laminating and heat-resistant backing ■ For general casting for pattern models and jigs ■ For gel coat for precision inspection jigs ■ For sand backing and laminating (available for summer and winter) ■ Workable resin for master models ■ Release agent (MO-7) For more details, please check the "PDF Download" at the bottom.

  • Other polymer materials
  • Resin mold
  • plastic

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

  • IPROS87489559172950448823.jpeg
  • スクリーンショット 2023-11-30 164854.png
  • スクリーンショット 2024-05-22 091503.png
  • スクリーンショット 2024-06-20 143402.png
  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Araldite Urethane System 22BF (22B derivative)

Araldite Urethane System 22BF (22B derivative)

Huntsman manufactured potting polyurethane resin. Based on low hardness and elasticity of 22B, it features low viscosity and reduced curing time. In stock at our company. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 22BF features a low viscosity and shortened curing time based on the elasticity and low hardness of 22B. For more details, please check the property table below or contact us. Main agent: Polyol 3018BF Curing agent: Isocyanate 2023

  • Other polymer materials
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Araldite Urethane System 66B (Low Hardness)

Araldite Urethane System 66B (Low Hardness)

Huntsman manufactured polyurethane resin for potting. It has a Shore A hardness of 30, which is very low hardness. In stock at our company. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 66B is characterized by its elasticity and low hardness. For details, please check the property table below or contact us. Main agent: Polyol 3618B Hardener: Isocyanate 2023

  • Other polymer materials
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Araldite Urethane System 3002SB/2056 (Medium Hardness)

Araldite Urethane System 3002SB/2056 (Medium Hardness)

Huntsman manufactured polyurethane resin for potting. It is a well-balanced product in terms of usable time, curing time, hardness, and elongation. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 3002SB/2056 is characterized by its balanced performance. For details, please check the properties table below or contact us. Main agent: Polyol 3022SB Hardener: Isocyanate 2056

  • Other polymer materials
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

  • Other polymer materials
  • glue
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

  • Other polymer materials
  • glue
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Other electronic parts
  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to resin

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.