Special Printed Circuit Board "Metal Substrate"
Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.
A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.
- Company：ＴＳＳ
- Price：Other
