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Non-contact tweezers for handling wafers! Non-contact tweezers type W.
Can be operated by hand like tweezers. Grabs and transports wafers without contact. Does not allow scratches or dirt to adhere.
Non-contact tweezers for transporting 50μm ultra-thin glass and ultra-thin wafers.
A non-contact tweezers that transports wafers and chips to a designated location without contact by attaching a handle with a valve to a Bernoulli chuck that transports wafers by ejecting gas, allowing for manual operation of the valve like a pair of tweezers. Since it is non-contact, it does not scratch the wafers and allows for easy non-contact transportation.
Heat-resistant tweezers for non-contact removal of wafers from a high-temperature susceptor.
A "non-contact tweezers" designed for high-temperature operation that allows for the non-contact removal of wafers from a hot susceptor after epitaxial film deposition on semiconductor wafers using a CVD apparatus. It features a handle equipped with a manual valve, enabling gas supply ON-OFF control through valve operation with a hand holding the handle, similar to using tweezers, while the wafers are suspended and transported by a "float chuck" that holds them non-contact by ejecting gas.
It is possible to grasp 6-inch and 8-inch wafers with the same non-contact tweezers.
"6in・8in Dual-Use Non-Contact Tweezers" (Patent) We have adopted a new gas vertical jet method. The gas vertical jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional types. This increases the holding stability and makes it more resistant to shocks, while nearly halving the gas consumption. The non-contact transport device "Float Chuck" (patent) at the tip of the handle of the "6in・8in Dual-Use Non-Contact Tweezers" allows for the ON-OFF control of air supply through hand operation, enabling non-contact suction and detachment of wafers. ◎ Features 1. 6-inch and 8-inch wafers can be handled with the same tweezers. 2. Operated by hand. 3. No scratches or dirt attachment. 4. Simple to use. ◎ Applications 1. 6-inch and 8-inch wafers (Other wafer sizes are also manufactured.) 2. Glass substrates 3. Lenses 4. Chips 5. Solar cells
Catch with air.
- By ejecting gas, it generates negative pressure through the Bernoulli effect and the ejector effect, allowing for non-contact suction, holding, and transportation of LCOS pieces. - No scratches, dirt, or pad marks will be left. - Usable in a clean room. - Suitable for breathable workpieces, perforated workpieces, and ultra-thin flexible workpieces. - Can also be used manually.
Non-contact tweezers for 300mm high refractive index glass wafers
Transfer and handle the φ300mm high refractive index glass wafer non-contact using tweezers through manual operation, without bending, applying stress, or causing scratches and dirt.
Non-contact tweezers for transferring wafers for protoss carriers without damaging them.
The non-contact tweezers for proto carriers remove or store thin wafers and warped wafers from or to the proto carrier without contact.
Air supply on-off manual operation non-contact wafer tweezers
Using a valve attached to a handle, the air supply is manually operated to turn ON and OFF, allowing the wafer, chip, lens, and solar cell substrate, as well as the glass substrate, to be grasped non-contact.
Tweezers for handling water and engineering soft contact lenses.
The "moist soft contact lens tweezers" for handling hydrated contact lenses in the hydration process grasp and transfer the lenses by blowing air. Additionally, during attachment and detachment, the internal pressure of the transport device is increased for the process. Therefore, there are no mechanical operations involved in the suction and detachment processes. All operations are performed by the action of airflow, allowing for the transfer of flexible contact lenses without causing damage. Thus, it is possible to transport thin and soft contact lenses without causing any harm. It is also capable of picking up and transferring hydrated lenses in the hydration process. ◎ Features 1. The suction grip and detachment of contact lenses are performed using airflow. 2. It is capable of picking up and detaching hydrated contact lenses in the hydration process. 3. Since it does not use vacuum suction, it does not deform or damage the lenses. 4. Because it does not use a mechanical peeling mechanism, it does not deform or damage the lenses.
The compound semiconductor wafers (GaAs, InP, GaP) are transported to a designated position non-contactly through manual operation.
◎Features 1. Non-contact transport of high-temperature wafers at 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible: - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
