Non-contact tweezers for compound semiconductor wafers
Non-contact tweezers for compound semiconductor wafers
The compound semiconductor wafers (GaAs, InP, GaP) are transported to a designated position non-contactly through manual operation.
◎Features 1. Non-contact transport of high-temperature wafers at 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible: - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
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basic information
The Bernoulli chuck "Float Chuck SAG (InP) type" performs ON-OFF operation of gas supply for high-temperature compound semiconductor wafers (GaAs, InP, GaP), allowing the compound semiconductor wafers, including InP wafers, to be non-contact suctioned and detached at a predetermined position. The Bernoulli chuck "Float Chuck SAG (InP) type" creates a negative pressure inside by ejecting gas, depending on the distance from the wafer, utilizing the ejector effect and Bernoulli effect, while also generating positive pressure through the pressure chamber type air cushion effect and the cushioning effect of gas flow, thereby enabling the non-contact suspension holding of InP wafers.
Price range
P4
Delivery Time
Applications/Examples of results
Non-contact transport of the following notched wafers of compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
