Data Download Available: DSC Analysis of Curing Characteristics of Epoxy Resin
It is possible to estimate the curing time of epoxy resin from the DSC measurement results. We will simulate using the Kamal model.
In semiconductor packaging, it is important to understand the curing time of epoxy resin. The Kamal model is widely used as the reaction rate equation for the curing of epoxy resin. The coefficients of the Kamal model can be determined from the non-isothermal curing behavior measured by DSC (Differential Scanning Calorimetry). In this case, we will introduce "Analysis of Curing Characteristics of Epoxy Resin by Thermal Analysis using DSC." Please take a moment to read the PDF materials. In addition to DSC, our company also specializes in various thermal analyses such as TG/DTA and TMA. ● DSC: It can be used for analyzing sample melting, glass transition, thermal history, crystallization, curing, Curie point, and measuring specific heat. ● TG/DTA: It can be used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating thermal resistance. ● TMA: It can be used for measuring sample expansion rate, glass transition, and softening point. Please see the following for various examples of thermal analysis: https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. If you request through the inquiry button, we will send them to you.
- Company:セイコーフューチャークリエーション
- Price:Other