We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Conductive adhesive.
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Conductive adhesive Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Conductive adhesive Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. ニホンハンダ Tokyo//Electronic Components and Semiconductors
  2. ペルノックス Kanagawa//Other manufacturing
  3. 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  4. 4 新明和工業 Kanagawa//Automobiles and Transportation Equipment
  5. 5 ダイゾー ニチモリ事業部 Tokyo//Chemical
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Conductive adhesive Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Conductive Adhesive "ECA Series" ニホンハンダ
  2. Non-volatile, room temperature curing two-component epoxy-based conductive adhesive 'XJS-3066' ペルノックス
  3. Conductive Adhesive TCB Series 東洋アルミニウム
  4. 4 Interconnection Conductive Adhesive Silver Epoxy ダイゾー ニチモリ事業部
  5. 5 Conductive Heat-Resistant Adhesive | Piroduct 597-A オーデック

Conductive adhesive Product List

31～38 item / All 38 items

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Yunimec "Surface Mount Adhesive"

Yunimec "Surface Mount Adhesive"

Introduction of the registered trademark "Unimec" heat-curing conductive materials.

"Surface mount adhesive" is a thermosetting conductive adhesive that can undergo low-temperature processing compatible with lead-free mounting and has high-temperature solder reflow resistance. Our trademark "Unimec" is a conductive material that can be processed at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially treated in-house processed conductive powder uniformly dispersed. The development and blending of conductive powders enable the production of products with various characteristics. [Features] ■ Low-temperature processing possible ■ Thermosetting conductive material ■ Compatible with lead-free mounting ■ High-temperature solder reflow resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Other terminal blocks
  • Other polymer materials
  • Other electronic parts

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Low-temperature curing low-elasticity conductive adhesive

Low-temperature curing low-elasticity conductive adhesive

70℃ curing possible - good conductivity!

Development is underway for flexible/stretchable substrates for wearable devices. It accommodates substrates that do not have heat resistance for that purpose. 【Product/Device Features】 - Compatible with dispense coating - Can cure at 70°C! - Good conductivity - Supports component mounting on stretchable/flexible substrates ~ Achieves an elastic modulus of 0.6 GPa (25°C/DMA) with a thermosetting type ~ - High reliability ~ Connectivity stability after 1000 temperature cycles ~

  • Composite Materials
  • glue
  • Other electronic parts

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[Research Materials] Global Market for Isotropic Conductive Adhesives

[Research Materials] Global Market for Isotropic Conductive Adhesives

World Market for Isotropic Conductive Adhesives: Epoxy Resin-Based, Acrylate-Based, Others, Automotive, Home Appliances, Others

This research report (Global Isotropic Conductive Adhesive Market) investigates and analyzes the current status and outlook for the global isotropic conductive adhesive market over the next five years. It includes information on the overview of the global isotropic conductive adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include epoxy resin-based, acrylate-based, and others, while the segments by application focus on automotive, consumer electronics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of isotropic conductive adhesives. It also includes the market share of major companies in isotropic conductive adhesives, product and business overviews, and sales performance.

  • Other services

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Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.

Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.

Thick film circuits printed with conductive ink! Methods for selecting metal particles used as fillers and surface treatment techniques!

Speaker Part 1: Dr. Takeshi Suga, Engineering PhD, Technical Department, Fujikura Kasei Co., Ltd. Electronic Materials Division Part 2: Masayoshi Yoshitake, Technical Engineer (Metal Division), Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd. Part 3: Hiroshi Otsuka, Emeritus Professor, Meisei University Target Audience: Researchers and personnel interested in conductive adhesives, metal nanoparticle fillers, and trends in testing standards. Venue: Kawasaki City Industrial Promotion Hall, Conference Room 1 Date and Time: June 20, 2011 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Please apply early as there may be a rush of applications. Participation Fee: 57,750 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 6 will receive an early bird discount price of 52,500 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same organization, an additional fee of 23,100 yen per person will be charged.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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[Research Material] Global Market for Anisotropic Conductive Adhesives

[Research Material] Global Market for Anisotropic Conductive Adhesives

World Market for Anisotropic Conductive Adhesives: Epoxy-based Adhesives, Silicone-based Adhesives, Acrylic-based Adhesives, Others, Electrical & Electronics, Semi ...

This research report (Global Anisotropic Conductive Adhesives Market) investigates and analyzes the current status and outlook for the global market of anisotropic conductive adhesives over the next five years. It includes information on the overview of the global anisotropic conductive adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the anisotropic conductive adhesives market include epoxy-based adhesives, silicone-based adhesives, acrylic-based adhesives, and others, while the segments by application cover electronics, semiconductors, the glass industry, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of anisotropic conductive adhesives. The report also includes the market share of major companies in anisotropic conductive adhesives, product and business overviews, and sales performance.

  • Other services

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Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!

Lecturers Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd. Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials. Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen) ◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price. *However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free. *After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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[Research Material] Global Market for Epoxy-based Conductive Adhesives

[Research Material] Global Market for Epoxy-based Conductive Adhesives

Global Market for Epoxy-based Conductive Adhesives: Isotropic, Anisotropic, Automotive Industry, Home Appliance Industry, Aerospace Industry, Bioscience Industry, Other Industries

This research report (Global Epoxy Based Electrically Conductive Adhesives Market) investigates and analyzes the current state and future outlook of the global market for epoxy-based conductive adhesives over the next five years. It includes information on the overview of the global epoxy-based conductive adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on isotropic and anisotropic, while the segments by application target the automotive industry, consumer electronics industry, aerospace industry, bioscience industry, and other industries. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of epoxy-based conductive adhesives. It also includes the market share of major companies in the epoxy-based conductive adhesives sector, product and business overviews, and sales performance.

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