Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.
61～87 item / All 87 items
It is an adhesive that can cure at lower temperatures and in a shorter time compared to typical one-component epoxy adhesives.
The low-temperature fast-curing epoxy adhesive "A-2201BKLC" has the following features: 【Features】 ■ Can cure at low temperatures of 70-80°C. ■ Can cure in a short time of 30-60 minutes. ■ Compliant with low halogen standards.
It is a flexible adhesive with minimal physical property changes at high temperatures. It is suitable for bonding components that require stress relaxation and parts where silicone resin cannot be used.
The flexible epoxy adhesive series includes the following grades: 【Product Range】 ■ White Grade [A-8511WLC] ■ Black Low-Temperature Curing Grade [A-8530BKLC] We have improved the hardness changes during thermal history, which were a challenge with conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. Both are one-component, thermosetting adhesives that are low-halogen compliant, offering good workability and can be used for bonding various shapes of components. They are suitable for applications where silicone cannot be used due to siloxane, as well as for bonding materials and structures that require stress relief.
It is an epoxy adhesive with a low linear expansion coefficient of 17 ppm and high heat resistance!
<Features> - It is an adhesive with a high glass transition temperature and low expansion and contraction. - It is suitable for bonding areas exposed to high temperatures or where stress from expansion and contraction needs to be reduced. - Heat cycle resistance can be expected. - An environmentally friendly adhesive that complies with SDGs. - A low halogen product managed for total chlorine and total bromine content.
Focusing on the development of adhesive, sealing, and coating products as a high-quality adhesive manufacturer!
Our company is a Japanese corporation fully funded by Shanghai Hanzi Industrial Co., Ltd. (a Chinese adhesive manufacturer), and we specialize in products such as cured epoxy and acrylic adhesives. We provide adhesive, sealant, and coating materials for small components related to electronic parts like 5G communication devices and smartphones, as well as semiconductors. As part of the Hanzi Group, we have bases around the world and develop custom products based on international technological standards with a customer-oriented approach. 【Business Description】 ■ Development, manufacturing, and sales of advanced adhesives utilizing cutting-edge science and technology along with a strong research and development system. *For more details, please download the PDF or feel free to contact us.
An epoxy-based adhesive developed as a temporary fixing agent for chip components! It reduces the burden on electronic components with low-temperature curing at 90°C for 90 seconds.
Solve the problem of component drop due to chip component miniaturization! We achieve fine coating that overturns conventional wisdom. With 'Seal-glo Chip Adhesive', fine coatings such as 1005CR, which are difficult for other companies, can be applied smoothly without clogging the dispenser or mask openings! We have received numerous inquiries due to the trend of component size reduction. 【Benefits】 - No issues with 1005CR bond application (dispenser/printing) - Proven application for 0603CR bond (dispenser) - Confirmed discharge capability with a nozzle inner diameter of Φ0.075mm - Achieved low-temperature curing at 90℃ for 90 seconds - Stable and moderate height coating shape due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible Compared to other chip adhesives currently in use, 'Seal-glo Chip Adhesive' offers many cost advantages, and there are many cases where it results in VA/VE. We encourage you to consider Fuji Chemical Industry's 'Seal-glo Chip Adhesive' at this opportunity. *For details, please contact us or download the catalog.
We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "National Tile Industry Association for Adhesive Tiles."
Epoxy adhesive EA=925 is an adhesive for decorative tiles. It has a relatively high viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Decorative Tiles" set by the Japan Tile Industry Association, providing strong adhesion for decorative tiles. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=925 is the standard type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.
We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "Japan Tile Industry Association for Adhesive Tile Products."
Epoxy Adhesive for Tile Accessories EA=925 Product Image It strongly adheres tiles. In strength and durability tests, it meets the "Quality Standards for Adhesive Tile Accessories" set by the Japan Tile Industry Association. The epoxy adhesive EA=925 is designed for tile accessories. It has a higher viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Tile Accessories" set by the Japan Tile Industry Association, providing strong adhesion for tile accessories. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=950 is a fast-curing type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.
Huntsman’s two-component epoxy fast-curing adhesive. A room temperature rapid curing type that exhibits initial strength in 20 minutes. It can be used universally on a wide range of substrates.
This is a two-component epoxy fast-curing adhesive from the global chemical manufacturer Huntsman. It cures rapidly at room temperature, has high shear and peel adhesion strength, and offers a wide range of adhesion to various substrates. *For more details, please refer to the materials or contact us.*
![One-component heat-releasing epoxy adhesive [developed product]](https://image.mono.ipros.com/public/product/image/03b/2000853160/IPROS12289008076012958777.jpeg?w=280&h=280)
It is an adhesive with a high thermal conductivity of 3.1~3.3 W/m·k.
The thermally conductive one-component epoxy adhesive has the following features: 【Features】 ■ It has a high thermal conductivity (3.1~3.3 W/m·k), making it suitable for thermal dissipation applications. ■ There are grades with a high glass transition temperature of 200°C. ■ It can be considered for heat generation measures and thermal interface materials (TIM). ■ Being a one-component adhesive, there is no need for weighing or mixing, resulting in good workability. ■ It excels in workability, stability, and electrical insulation. ■ Two grades with different reactivity and glass transition temperatures are available for selection.
We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "National Tile Industry Association for Adhesive Tile Products."
Epoxy adhesive EA=925 is an adhesive for decorative tiles. It has a relatively high viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Decorative Tiles" set by the Japan Tile Industry Association, providing strong adhesion for decorative tiles. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=928 is a high-viscosity type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.
Adhesive for heat sinks that combines aluminum filler, low viscosity, high adhesion, and thermal conductivity.
Epoxy, Etc.'s 70-3812 NC is an innovative solution for industries requiring excellent thermal conductivity and heat resistance, containing aluminum filler. This epoxy adhesive is designed for bonding parts and materials that require heat resistance, making it a superior material in the market. 70-3812RNC is popular for various heat sink applications due to its good thermal conductivity. Common applications in heat sinks include bonding fins to bases, folding fin sets to bases, pin fin sets to bases, and cold plate tubes to extruded bases. It has passed NASA's low outgassing test (ASTM E-595-07), making it suitable for use in outer space.
A fast-curing adhesive with high bonding strength that cures in 5 minutes at room temperature. Used for electronic devices and jewelry.
Epoxy, Etc.'s fast-curing epoxy adhesive boasts high bonding strength and excellent applicability to a wide range of materials and uses. The curing time at room temperature is quick, ranging from 5 to 46 minutes, making it ideal for situations where workability is required. The features are as follows: - High bonding strength. - Rapid curing at room temperature (three stages of speed) - Resistance to water and chemicals - Excellent thermal shock resistance - 1:1 mixing ratio - Impact resistant This adhesive is not only effective for bonding various materials but also meets the UL94HB flammability requirements, making it suitable for use in applications with thermal loads.
![[Specification Sheet Available] TERADITE Adhesive Series](https://image.mono.ipros.com/public/product/image/5ea/2000704845/IPROS56124320361784046822.png?w=280&h=280)
We offer one-component heat-curing types, two-component room temperature curing types, and anaerobic curing types. Samples are also available.
The TERADITE adhesive series from Terada Corporation is an adhesive primarily designed for bonding various metals and plastics. It is made to order, but you can purchase it in small quantities (around a few hundred grams). Samples are also available, so if you are interested, please feel free to contact us. Additionally, customization according to customer requirements is possible. If you wish to customize, please do not hesitate to inquire. ■ Single-component heat-curing epoxy adhesive ■ Two-component room temperature-curing epoxy adhesive (Note: TE-6010 is a potting resin, but it has high suitability for bonding bake boards.) ■ Anaerobic curing (polyepoxy methacrylate) adhesive *For more details, please download the PDF document from the bottom or contact us.
Huntsman’s general-purpose two-component epoxy adhesive. It is in paste form, making it less likely to drip, and has weather resistance and chemical resistance.
This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has good weather resistance and chemical resistance, and it comes in a paste form with a metallic color that can be applied to vertical surfaces. This is a general-purpose grade paste adhesive. If you prefer a low-viscosity product, please consider 2011 or 2012 (RAPID). For more details, please check the documentation or contact us. *Please note that 2013-1 has a hardener that is classified as a toxic substance.
Two-component epoxy adhesive from Huntsman. In addition to heat resistance up to 140°C, it also has high chemical resistance, water resistance, and thixotropic properties that prevent dripping even at a thickness of 5mm.
This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has a heat resistance of up to 140°C and particularly high chemical and water resistance, making it suitable for bonding various materials such as metals, electronic components, and glass. Due to its high heat resistance, it can also be used in relatively high-temperature environments. For more details, please check the documentation or contact us. *Please note that the 2014-2 hardener is classified as a hazardous substance.
It is a two-component epoxy adhesive from Huntsman. It has excellent toughness and weather resistance. It can fill gaps and has high thixotropy, allowing it to remain non-sagging even at a thickness of 10mm.
This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a tough paste that can bond GRP, SMC, and dissimilar materials, and can fill gaps. It does not sag even when applied thickly. For details, please check the properties table below or contact us. It is a non-hazardous substance, making it easy to manage and handle.
This is a two-component epoxy adhesive from Huntsman. It has excellent heat resistance and chemical resistance, withstanding temperatures up to 140°C. Thixotropic. TDS and SDS are available for distribution.
This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has excellent chemical resistance and can withstand temperatures up to 140°C. Additionally, it is thixotropic and suitable for gap filling. For more details, please check the properties table below or contact us. *Please note that the hardener HV998-1 is classified as a hazardous substance.
Huntsman’s two-component epoxy adhesive. A low-viscosity, transparent adhesive with a low refractive index. Recommended for bonding glass and ceramics, transparent casting, and laminating.
This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a low-viscosity transparent adhesive suitable for bonding glass and ceramics, as well as for transparent casting and laminating. It has a refractive index equivalent to that of glass. *Please note that the 2020 Hardener is classified as a hazardous substance. *For details, please check the properties table below or contact us.
This is a two-component epoxy quick-setting adhesive from Huntsman Corporation. It cures rapidly at room temperature and can fill gaps.
This is a two-component epoxy-based fast-curing adhesive from the global chemical manufacturer Huntsman. It features a usable time of 4 to 8 minutes and rapid curing at room temperature. Although it is in paste form, it has thixotropic properties, allowing for gap filling. While it is not as fast-curing as RAPID (2012), it has high heat resistance. It exhibits adhesion to various substrates such as metals, ceramics, and rubber. *For more details, please check the property table below or contact us.*
Two-component epoxy adhesive made by Huntsman. It has high strength and elasticity, allowing it to bond various materials, but it is particularly recommended for bonding CFRP and GFRP.
Araldite is an epoxy-based adhesive manufactured by Huntsman, used in advanced technology fields such as electronics, automotive, and aerospace around the world, earning high reliability. Araldite 420AB excels in shear and peel strength and can bond to a variety of materials. In addition to metals, it demonstrates high adhesion to CFRP and GFRP. *This is a stock item. *For details, please check the documentation or contact us. *The TDS is available in English.
【New development product number!】This is an epoxy-based adhesive with a shear adhesive strength of 32 MPa between SUS materials and equivalent to UL94 5mm V-0!
TE-1002FR is an epoxy-based adhesive with flame retardancy equivalent to UL94 V-0 (5mm thick). It can be used for bonding, fixing, and sealing in areas where flame retardancy is required. Two-component room temperature curing epoxy resin Features: Room temperature curing, high adhesion strength, flame retardancy *Samples are available upon request. Please contact us for more details. *For more information about this product, please download the specification sheet from below. *For other products, please download the catalog and epoxy & acrylic resin "TERADITE" from below.
Compatible with low halogenation! An adhesive with good adhesion to liquid crystal polymer (LCP).
We would like to introduce our LCP-compatible epoxy adhesive, 'A-7373BKLC.' It can be used for adhesion to liquid crystal polymers (LCP) and has excellent adhesive properties. It is also compliant with low halogen requirements, with a viscosity of 62,000 mPa.s and a gel time of 80 seconds. 【Features】 ■ Excellent adhesion to liquid crystal polymers (LCP) ■ Compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us.
This is a grade that is compatible with materials such as liquid crystal polymer (LCP) and PA9T, which are difficult to bond with conventional adhesives.
The epoxy adhesive series for difficult-to-bond materials includes the following grades: 【Product Group】 ■ Liquid Crystal Polymer (LCP) Grade 【A-7373BKLC】 ■ PA9T Grade 【A-2230BK】 Both are one-component thermosetting adhesives with good workability, suitable for bonding various shapes of components.
It is a product with a glass transition temperature of 269°C, exhibiting particularly excellent heat resistance.
"A-5410-11, H-2410-11" is an adhesive characterized by a high glass transition temperature (Tg) of 269°C, excellent heat resistance, and low linear expansion. Due to its minimal expansion and contraction, it has good heat cycle resistance, making it suitable for use in harsh temperature environments. 【Features】 ■ High Tg and low linear expansion coefficient ■ Good workability for casting applications due to low viscosity ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.
![[Research Material] Global Market for Epoxy Adhesives](https://image.mono.ipros.com/public/product/image/379/2001467340/IPROS89432718754584855663.jpeg?w=280&h=280)
Global Market for Epoxy Adhesives: Single-component, Two-component, Aerospace & Defense, Automotive, Marine, Electrical & Electronics, Construction, Energy & Power
This research report (Global Epoxy Adhesive Market) investigates and analyzes the current state of the global epoxy adhesive market and its outlook for the next five years. It includes information on the overview of the global epoxy adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on single-component and two-component adhesives, while the segments by application target aerospace & defense, automotive, marine, electrical & electronics, construction, and energy & power. The regional segments calculate the market size of epoxy adhesives by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the epoxy adhesive sector, product and business overviews, and sales performance.
