We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Equipment development services.
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Equipment development services Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Aug 20, 2025~Sep 16, 2025
This ranking is based on the number of page views on our site.

Equipment development services Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Aug 20, 2025~Sep 16, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. カイジョー Tokyo//Industrial Electrical Equipment ODM事業部
  3. 超音波工業 Tokyo//Industrial Electrical Equipment
  4. 4 兼松PWS Kanagawa//Industrial Machinery
  5. 5 ヘッセ・メカトロニクス・ジャパン Tokyo//Industrial Machinery

Equipment development services Product ranking

Last Updated: Aggregation Period:Aug 20, 2025~Sep 16, 2025
This ranking is based on the number of page views on our site.

  1. Latest wire bonder with wire monitoring function
  2. Semiconductor assembly equipment Wire Bonder FB-900 カイジョー ODM事業部
  3. Semiconductor assembly equipment Wire Bonder FB-780 カイジョー ODM事業部
  4. 4 Ultrasonic Wire Bonder REBO-9 超音波工業
  5. 5 Fully Automatic Thick Wire Bonder 'BJ955/959' ヘッセ・メカトロニクス・ジャパン

Equipment development services Product List

1~15 item / All 61 items

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Standard ultrasonic oscillator and transducer

Introducing high-lifespan, uniform, and efficient oscillators and oscillators.

At Japan Alex, we offer a variety of ultrasonic oscillators and transducers, including the "Standard Unit NEO SONIC" and the "High-Performance Digital Oscillator NEO SONIC Digital." The "Standard Unit NEO SONIC" can handle a frequency range of 28 to 200 kHz and an output from a minimum of 50 W to a maximum of 3600 W, making it suitable for a wide range of applications. The "High-Performance Digital Oscillator NEO SONIC Digital" allows users to check the oscillation frequency and output status on a display, and it is well-suited for integration with external devices. Additionally, our ultrasonic vibration units are designed and manufactured from the piezoelectric elements that form the basis of the ultrasonic transducers. By utilizing new analytical technologies for the diaphragm, we achieve exceptionally uniform vibrations and enhanced longevity, characteristic of products made in Japan. **Features of the Standard Unit NEO SONIC:** - Equipped with a sweep function - Dual chamber structure - Output adjustment function - Cost reduction through simultaneous oscillation specifications *For more details, please refer to the PDF materials or feel free to contact us.*

  • Ultrasonic Oscillator
  • Oscillator

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FC/COG/COF Bonder Market Analysis Report 2005

FC/COG/COF Bonder Market Analysis Report 2005

With the expansion of FC implementation, the FC bonder market is experiencing rapid growth. An analysis is provided regarding the market, manufacturer shares, and application adoption status for various types of FC bonders, including COG, COF, ultrasonic FC, general-purpose FC, and mounter-type FC bonders.

  • Bonding Equipment
  • LCD display
  • Printed Circuit Board

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Semiconductor assembly equipment Wire Bonder FB-900

Further evolved, speed and stability.

This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.

  • Other semiconductor manufacturing equipment

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High-speed matching automatic aligner

It is an automatic aligner that enables high-speed integration.

Model: NM1A-XX Frequency: 13.56MHz Power Input: 1kW Input Impedance: 50Ω Unbalanced Matching Mode: Automatic or Manual Switching Input Connector: HN Connector Output: Busbar Cooling: Water Cooling/Air Cooling Combined Matching Time: Within 0.5 Sec when using preset External Analog I/O: 0 to 10.0V External Serial Communication: RS232C/422/Device Net Power Supply: AC84V to 220V/DC24V (80VA)

  • Other power sources

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Tabletop Wire Bonder "Full Manual HB05"

Profiles can store up to 20 programs! Suitable for simple wiring tasks.

The "Full Manual HB05" is a full manual type tabletop wedge-ball combined wire bonder that prioritizes cost above all else. It features a liquid crystal display, with the bond profile shown digitally, and can store up to 20 programs in memory. Additionally, the wire feed function and movable clamp make wire handling tasks easy. 【Features】 ■ Focused on price with minimal functions ■ Suitable for simple wiring tasks ■ Ideal for prototype development with both wedge bond and ball bond capabilities ■ Excellent cost performance ■ Easy operation with liquid crystal display and wire feed function *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines

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Tabletop wire bonder "Thick wire semi-auto HB30"

This is a thick line wedge bonder that can be utilized in prototype development scenes with its light footwork and excellent operability.

The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Ultrasonic Wire Bonder REBO-9

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

  • Other semiconductors

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Automation Equipment Development Services

Automation equipment that realizes line automation and reduction of personnel.

Fukushin Electric Co., Ltd. develops automation equipment for the space between machines, contributing to short delivery times and high quality in line automation and labor reduction. We not only accept contract manufacturing based on customer designs but also broadly respond to orders from the development and design stage. ● For other functions and details, please download the catalog.

  • Contract manufacturing

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Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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Soundproof box "Soundproof box for portable generators (for nighttime use)"

A safe and comfortable product born from the requests of many customers!

The "Soundproof Box for Portable Generators (Night Use Only)" is a soundproof box that achieves 65 decibels of noise reduction while addressing the heat issues of the generator. You can start the engine while the generator is set up, and it features a sliding function for excellent operability. It is a soundproof box with an outstanding design. 【Features】 ■ Excellent design ■ Outstanding operability ■ Soundproof box that can release heat outside *For more details, please refer to the catalog or feel free to contact us.

  • Contract manufacturing
  • Generators and transmission motors

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Three-axis woven composite materials and the space sector

Research and development is being conducted aimed at further enhancing the functionality and performance of spaceborne equipment.

"Tri-axial woven composite materials" have a proven track record for antennas used in artificial satellites and exploration vehicles, holding a significant share both domestically and internationally. Currently, we are engaged in research and development of space deployable structures that can be compactly stored for launch and then expanded large in the space environment, as part of next-generation space development technology. Utilizing research results related to space materials technology, antenna technology, and space deployable structures, we have successfully developed experimental devices for scientific observation rockets and the International Space Station. In the future, based on the experience gained from these demonstrations and practical applications, as well as the valuable data obtained, we plan to aim for further high functionality and high performance of space-mounted equipment. [Features] ■ Lightweight mesh structure ■ Excellent shape recovery and dimensional stability ■ In-plane and out-of-plane pseudo-isotropy ■ Low thermal expansion coefficient *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
  • Other polymer materials

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MPP Manual Wire Bonder iBond 5000 Series

Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.

iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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CAD design and manufacturing services

We are a professional group with top-class CAD design and advanced manufacturing technology in the industry.

Meino Engineering Co., Ltd. is engaged in the design and manufacturing of mechanical systems. We consistently handle everything in-house, from mechanism and control design, parts processing, assembly debugging, to on-site installation and final adjustments. We can also promptly respond to software modifications and other fieldwork after delivery. 【Business Activities】 ■ Mechanical system design ■ Mechanical system manufacturing ■ Dispatch of design engineers ■ Operation of the mechanical assembly general-purpose purchased parts recycling system "MechaComNet" *For more details, please download the PDF or feel free to contact us.

  • Mechanical Design

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Equipment and Device Development Services

We also accept drawing of parts and assembly diagrams, as well as the 3D conversion of large volumes of data.

Wintax Co., Ltd. is an engineering company specializing in the development of equipment and machinery. We undertake the design of production equipment and products, including mechanical design, electrical design, circuit design, software design, as well as on-site installation adjustments and debugging. Please feel free to contact us with your requests. 【Areas of Expertise】 ■ Semiconductor manufacturing equipment: crystal furnaces, processing machines, crucible manufacturing devices, various polishing devices ■ LCD manufacturing equipment: inspection devices, transport devices, etc. ■ Various inspection devices: appearance inspection devices, etc. ■ Various FA devices: automotive parts manufacturing equipment, packaging devices, etc. ■ Vacuum heating furnaces: crystal growth devices, etc. ■ Others: special processing machines, small processing machines, dental devices and equipment *For more details, please download the PDF or feel free to contact us.

  • Mechanical Design

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General Labor-Saving Equipment Development Services

Integrated manufacturing of mechanical design, electrical design, assembly, control adjustment, and some machining in-house!

Our company is engaged in the development, design, and manufacturing of general labor-saving equipment. Since everything is produced in-house, we can respond quickly to feedback on equipment delivered in the past as well as to unexpected incidents after delivery. 【Products Handled】 ■ Processing machines ■ Assembly machines ■ Conveying and loading devices ■ Inspection devices ■ Testing and demonstration machines, etc. *For more details, please feel free to contact us.

  • Other machine tools

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