Double Access Flexible Circuit Board (Double Access FPC)
The copper foil itself is the base without polyimide.
The copper foil itself is the base material of the FPC.
- Company：スコットデザインシステム
- Price：Other
Flexible PCB(フレキシブル) - List of Manufacturers, Suppliers, Companies and Products
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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Flexible PCB Product List
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Button-plated flexible printed circuit board (FPC)
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.
- Company：山下マテリアル
- Price：500,000 yen-1 million yen
![Long-length multi-layer flexible substrate [Substrate manufacturing achievements]](https://image.mono.ipros.com/public/product/image/857/2000674579/IPROS01080264647980196626.png?w=280&h=280)
Long-length multi-layer flexible substrate [Substrate manufacturing achievements]
4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.
We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.
- Company：プリント電子研究所 本社
- Price：Other
4-layer blind via flexible circuit board
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.
- Company：山下マテリアル
- Price：Other
Impedance control flexible substrate
Achieving high-frequency and high-speed transmission by matching the characteristic impedance.
This is an FPC that matches characteristic impedance and achieves high-frequency, high-speed transmission.
- Company：スコットデザインシステム
- Price：Other
Flexible substrates that accommodate a wide range from prototype to mass production.
From prototype to mass production, we select the most suitable factory according to your needs! Supports single-sided and double-sided!
Our company is engaged in the export, import, and sales of printed circuit boards and electronic components. Our "Flexible Circuit Boards" are produced in suitable factories according to your needs, from prototype to mass production. We accommodate both single-sided and double-sided boards. 【Features】 ■ Supports from prototype to mass production ■ Single-sided and double-sided options available ■ Maximum size: 600mm x 600mm ■ Minimum pattern/clearance: 50um/50um. *For more details, please refer to the PDF document or feel free to contact us.
- Company：サーリューション
- Price：Other
Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*
- Company：山下マテリアル
- Price：Other
Ultra-small, high-precision flexible substrate
Custom-made high-definition and ultra-high-definition substrates with narrow pitch! Leave it to us for flexible substrates (high-definition FPC)!
Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We cater to customer needs with features such as staggered layout narrow pitch, single-sided narrow pitch BGA, and sensor coils with both sides pitch, as well as single-sided, double-sided, and multilayer options. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Single-sided 20μ pitch ■ Subtractive method ■ Staggered layout narrow pitch ■ Semi-additive method *For more details, please download the PDF or contact us.
- Company：三陽
- Price：Other
Multilayer Flexible Printed Circuit (Multilayer FPC) "Ultra-thin Flexible Multilayer FPC"
Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.
The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電線
- Price：Other
Ultra-small, high-precision flexible substrate
Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!
Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.
- Company：三陽
- Price：Other
Narrow pitch pad on beer flexible substrate
By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.
By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.
- Company：山下マテリアル
- Price：100,000 yen-500,000 yen
Flexible circuit board
Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.
"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.
- Company：三和電子サーキット
- Price：Other
Flexible Printed Circuit (FPC) "Long-Length FPC"
Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.
The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.
- Company：沖電線
- Price：Other
High Current Compatible Flexible Circuit Board BigElec
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.
Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.
- Company：山下マテリアル
- Price：500,000 yen-1 million yen
Are you facing any issues with the production of transparent substrates or films?
Solve your problems with transparent flexible substrates, transparent antennas, transparent heaters, and insert molded substrates!
We offer a transparent substrate called "SPET." We address concerns such as, "I want to request production, but I'm worried about the price and would like to know the market rate before placing an order," and "There are different types of transparent substrates, and I don't quite understand the differences, so I want to know the advantages and disadvantages of each method." As experts in transparent substrates, we solve issues related to the production of transparent flexible substrates, transparent antennas, transparent heaters, and insert-molded substrates. 【We solve the following concerns】 ■ I don't know the market rate for substrates ■ How should I choose? ■ I'm busy and it's a hassle *For more details, please refer to the related links or feel free to contact us.
- Company：シライ電子工業 SPET事業部
- Price：Other
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Related Categories of Flexible PCB
- Printed Circuit Board
- substrate
- Control Board
- Ceramic Substrate
- Circuit Board
- Wiring Board
- Multilayer Board
- Flexible Board
- Alumina Substrate
- Power Supply Board
- Heat dissipation board
- Build-up Board
- Universal Board
- Mounting board
- Light Board
- Glass Substrate
- Conversion Board
- To Board
- Base Substrate
- Single-sided board
