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Flexible PCB(フレキシブル) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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Flexible PCB Product List

46～56 item / All 56 items

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Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Rich experience in embedded products for medical and special environments. Widely adopted by universities and research institutions! Simple mock-up production available. *Case study materials are currently being distributed.

At Stay Electronics Co., Ltd., we are engaged in the design, development, manufacturing, and sales of flexible printed circuits (FPC). We are equipped with prototyping facilities such as UV-YAG laser systems and cutting plotters, as well as inspection equipment like image dimension measuring instruments, allowing us to provide consistent support from design to prototyping, manufacturing, and inspection. With extensive manufacturing experience in FPCs for medical devices, we maintain a wide range of materials in stock and can flexibly respond to and propose solutions for customer requests under special conditions. ★ We also respond to requests for mock-up production! Whether it's challenges that other companies couldn't solve, stalled projects, or if you have never used flexible circuits before and just want to grasp the concept, please feel free to contact us for inquiries and consultations. 【Examples of Flexible Circuit Board Development】 ◎ FPC for ultrasound diagnostic probes ◎ FPC for superconducting devices operating at -269°C ◎ FPC for motor field winding ◎ FPC for ATM security monitoring, among others *Some development examples can be viewed via "PDF Download." Please feel free to reach out for inquiries.

  • Printed Circuit Board

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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance 　・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

  • Printed Circuit Board

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Low-rebound, high-speed transmission flexible substrate

Low-rebound, high-speed transmission flexible substrate

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

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  • Wiring materials

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Transparent flexible substrate

Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing

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[Design and Production Example] Coil_FPC for Motor Field Windings

[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Silicone flexible printed circuit board (Si FPC)

Silicone flexible printed circuit board (Si FPC)

Let's expand the application of products using "Si FPC" in fields that require excellent flexibility and weather resistance, such as IoT, medical devices, smart textiles, and industrial sectors.

FPC has six main features: 1) High-elasticity silver paste that can be printed with silicone 2) Flexible and foldable 3) Excellent weather resistance 4) Excellent electrical insulation 5) High chemical resistance 6) Biocompatibility Additionally, it has passed ROHS, ISO9000, and IECQ080000 certifications.

  • Printed Circuit Board

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[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

The conductor resistance value is low, and the change in conductor resistance during expansion and contraction is small! Suitable for applications that were difficult to apply in the past!

We would like to introduce a case where our EMS (design and manufacturing contract services) supported the IoT integration of clothing through the wiring of wearable devices. The customer's challenge was to improve the performance and quality of their own wearable devices. By using copper foil for the circuit conductors, we achieve low conductor resistance and minimal changes in resistance during stretching. This feature allows for wide application in areas that were previously difficult to implement. [Challenges] ■ Desire to improve the performance and quality of their own wearable devices ■ Traditional flexible substrates have issues with lack of elasticity ■ Unable to realize the desired wearable device *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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[Research Material] Global Market for Flexible Printed Circuit Boards

[Research Material] Global Market for Flexible Printed Circuit Boards

Global Market for Flexible Substrates: Plastic, Glass, Metal, Home Appliances, Solar Energy, Medical & Healthcare, Aerospace & Defense

This research report (Global Flexible Substrate Market) investigates and analyzes the current state of the global flexible substrate market and its outlook for the next five years. It includes information on the overview of the global flexible substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the flexible substrate market by type include plastics, glass, and metals, while the segments by application cover home appliances, solar energy, medical and healthcare, and aerospace and defense. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of flexible substrates. It also includes the market share of major companies in the flexible substrate market, product and business overviews, and sales performance.

  • Other services

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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What is SPET?

What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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