Component Mounting Flexible Circuit Board (Component Mounting FPC)
Support for component mounting is also available.
This is an FPC with electronic components mounted.
- Company：スコットデザインシステム
- Price：Other
Flexible PCB(実装) - List of Manufacturers, Suppliers, Companies and Products
Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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Flexible PCB Product List
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Narrow pitch pad on beer flexible substrate
By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.
By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.
- Company：山下マテリアル
- Price：100,000 yen-500,000 yen
Double-sided flexible printed circuit board (double-sided FPC)
Double-sided type that allows for complex wiring.
This is an FPC with conductor patterns on both sides, allowing for complex wiring.
- Company：スコットデザインシステム
- Price：Other
Blind Via (BVH) connection Flexible Printed Circuit (FPC)
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Stretchable flexible printed circuit board (FPC/flexible board)
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Transparent flexible printed circuit board (transparent FPC)
A transparent flexible substrate with wiring that cannot be seen with the naked eye.
It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.
- Company：シライ電子工業 SPET事業部
- Price：Other
Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*
- Company：山下マテリアル
- Price：Other
Flexible circuit board
Flexible circuit board
Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A
- Company：ウェル
- Price：Other
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
High Current Flexible Circuit Board [*FPC Technology Catalog Available]
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
- Company：山下マテリアル
- Price：Other
4-layer blind via flexible circuit board
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.
- Company：山下マテリアル
- Price：Other
Rigid Flexible Circuit Board (Rigid FPC)
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
- Company：スコットデザインシステム
- Price：Other
Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Flying lead flexible printed circuit board (FPC/flexible circuit board)
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Flexible circuit board / Rigid-flexible circuit board
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
- Company：グレンエアジャパン
- Price：Other
