Hot press machine
Flip Chip Bonder for IC Cards
Supports everything from user-friendly standalone types to inline systems.
- Company：Ito Corporation
- Price：Unset
Flip Chip Bonder Product List and Ranking from 10 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Flip Chip Bonder Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
- ファインテック日本 Tokyo//Industrial Electrical Equipment
- 兼松ＰＷＳ Kanagawa//Industrial Machinery
- null/null
- 4 テクノアルファ Tokyo//Electronic Components and Semiconductors
- 5 澁谷工業 メカトロ統轄本部 Ishikawa//Other manufacturing
Flip Chip Bonder Product ranking
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
- ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
- ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder
- High-precision flip chip bonder 'femto2' ファインテック日本
- 4 ASMPT's ultra-high precision flip chip bonder 'NANO Pro' 兼松ＰＷＳ
- 5 High-precision flip chip bonder: lambda2 ファインテック日本
Flip Chip Bonder Product List
31～32 item / All 32 items
Displayed results
High-precision flip chip bonder: lambda2
The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.
Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.
- Company：ファインテック日本
- Price：Other
