Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 32 items
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Full automation is possible at a low cost through integration with the conveying system.
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.
High-performance flip chip bonder for multi-variety cell production lines.
By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.
Achieving a mounting accuracy of ±1 [μm] and an ultra-low load of 0.049 [N]! High-precision bonding compatible with extremely low loads.
The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.
![[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)](https://image.mono.ipros.com/public/product/image/5eb/2000580370/IPROS62527725738563657322.jpeg?w=280&h=280)
A lineup of features that meet the needs of various factories! Industry-leading speed FCB (Flip Chip Bonder) specialized for small chips.
The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.
LED flip chip mounting device
- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.
Fully automatic high-precision die bonding machine
The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.
The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.
The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ
High-precision bonding machine with ±5μm accuracy
The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).
