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Bonda Product List and Ranking from 23 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
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  4. 4 テクノアルファ Tokyo//Electronic Components and Semiconductors
  5. 5 ヘッセ･メカトロニクス･ジャパン Tokyo//Industrial Machinery
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Bonda Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. High-precision flip chip bonder 'femto2'
  2. High-precision die bonder and flip chip bonder 'lambda2'
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
  5. 4 ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ

Bonda Product List

1～30 item / All 97 items

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Epoxy die bonder

Epoxy die bonder

Easy epoxy bonding is possible.

A machine that easily performs epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy materials (adhesives) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor of West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a significant track record of deliveries to government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel
  • Bonda

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Semiconductor assembly equipment Wire Bonder FB-900

Semiconductor assembly equipment Wire Bonder FB-900

Further evolved, speed and stability.

This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.

  • Other semiconductor manufacturing equipment
  • Bonda

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Ultrasonic flip chip bonder

Ultrasonic flip chip bonder

Ultrasonic flip chip bonder

A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.

  • Bonding Equipment
  • Circuit board processing machine
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Aluminum wire bonder/ribbon bonder ASTERION

Aluminum wire bonder/ribbon bonder ASTERION

"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.

The K&S manufactured wire bonder and ribbon bonder ASTERION adopts the latest beltless direct drive motion system, significantly improving productivity (UPH) compared to conventional models, and is a new type of wire bonder with enhanced newly added features. ASTERION has expanded the bonding area, incorporated advanced pattern recognition, and strengthened tight process control. This has improved high productivity, bond quality, and reliability. The enlarged bonding area accommodates various applications and reduces line integration costs. 【Features】 <Productivity> - The expanded bonding movable range (300mm x 300mm) shortens index/loading time. - Enhanced pattern recognition improves MTBA. - Cycle time reduction through pattern recognition with a new mode and direct drive motion system. <Performance> - Minimal frame movement and increased frame rigidity reduce the vibration of the machine during operation. - Repetitive accuracy of bond positioning. - Improved process stability.

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  • Bonding Equipment
  • Other semiconductor manufacturing equipment
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High-precision multi-die bonder flip chip bonder

High-precision multi-die bonder flip chip bonder

Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]

The "FALCON Series" is a die flip chip die bonder that offers a lineup of devices tailored to user needs, ranging from manual to automatic specifications. We can manufacture die flip chip bonders according to your company's required specifications by combining various options. We can propose devices suitable for your specifications, including heating mechanisms, high-load bonding, wafer pickup, and chip flipping functions. Additionally, there are higher models that can accommodate fully automatic specifications with attachments like conveyors, and since these are our own products, we can flexibly respond to your desired customization specifications. 【Features】 ■ Operability Achieves smooth XY stage operability using a joystick. Basic operations can be completed easily with the joystick, providing simple operation specifications. ■ Load Control Supports applications requiring advanced load control through program operation by a motor (Z-axis resolution in micrometers) and VCM control (optional). ■ Software User interface design that does not require a manual. User-friendly specifications that allow for easy setting of bonding parameters and recognition program creation. *For more details, please download the PDF materials.

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  • Bonding Equipment
  • Bonda

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12-inch wafer compatible high-speed high-precision twin dispense die bonder

12-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup

  • Bonding Equipment
  • Bonda

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LED package compatible die bonder

LED package compatible die bonder

Ideal for handling all types of LED packages.

◆Minimize the space between the mount and preform, prevent changes over time, and reduce unnecessary movements. ◆Direct transport of substrates, support for workpiece thickness, support for large substrates (optional), and carrier compatibility. ◆Support for larger and modular lighting substrates, offering a variety of bonding patterns and recognition patterns. ◆Facilitate work data input to reduce changeover time. ~Changeover time: 60 minutes (hardware 15 minutes, setup 45 minutes)~

  • Other semiconductor manufacturing equipment
  • Bonda

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Fully Automatic Wafer Bonder XBS200

Fully Automatic Wafer Bonder XBS200

Fully automatic wafer bonder for mass production, compatible with various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components.

【Features】 ■ Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. ■ Compatible with wafers and substrates ranging from 100mm to 200mm in diameter, and stacking thicknesses up to 6mm. ■ Achieves high-precision post-bond alignment accuracy through the combination of a high-precision bond aligner module XBS200 and an innovative transport mechanism. ■ Control of the bonding environment through vacuum or gas atmosphere control.

  • Sensors
  • Memory
  • Bonda

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Ultrasonic Wire Bonder REBO-9

Ultrasonic Wire Bonder REBO-9

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

  • Other semiconductors
  • Bonda

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High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.

  • Bonding Equipment
  • Bonda

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Manual Flip Chip Bonder CB-505 Athlete FA Model

Manual Flip Chip Bonder CB-505 Athlete FA Model

Manual flip chip bonder suitable for small-scale production and various experiments.

The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Bonding Equipment
  • Bonda

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High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.

  • Assembly Machine
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Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

  • Other mounting machines
  • Bonda

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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

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Flip Chip Bonder "FB2000SS"

Flip Chip Bonder "FB2000SS"

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

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High-speed fully automatic fine wire bonder 'BJ855'

High-speed fully automatic fine wire bonder 'BJ855'

Expansion of productivity! The large work area allows for batch processing of multiple devices.

The "BJ855" is a next-generation fully automatic fine wire bonder that expands the portfolio of existing production processes. It meets the growing demands for wire bonding and offers simplified operations through smart features such as bond head memory and chip libraries. In addition to standard equipment configurations, it is possible to provide automated transport systems optimized for individual devices. 【Features (partial)】 ■ High-performance touchdown detection with no detection delay, suitable for bonding thin substrates ■ Optimized image recognition: imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment
  • Bonda

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Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment
  • Bonda

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Flux-free solder bond "DBD3580S"

Flux-free solder bond "DBD3580S"

Fluxless solder die bonding (wire solder) for power semiconductors. Multi-chip mounting support available as an option!

Fluxless solder bonder for power semiconductors 'DBD3580S' Compatible with multi-row work such as Power QFN with a maximum width of 100mm. 【Specifications】 ■ Bonding process: wire solder application ■ Chip size: □1.0~6.0mm ~10.0mm (optional) ■ Bonding accuracy (XY): +/-50μm ■ Bonding accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible work: lead frame or carrier ■ Maximum width supported: up to 100mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.60 seconds/chip, depending on various conditions ■ Pin transport ■ External dimensions: 2,000x1,235x1,650mm ■ Weight: 1,300kg ■ Main options: wafer changer (standard specification), magazine loader, wafer map, punch unit, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
  • Bonda

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Clip Bond "DCA1000"

Clip Bond "DCA1000"

Clip Bonder - Die bonder for power semiconductors, chip and clip bonding, with optional appearance inspection and NG product punching unit support.

The "DCA1000" is a die and clip bonder for power semiconductors. (The device photo shows the configuration of a die bonder + clip bonder + appearance inspection mechanism) 【Specifications】 ■Joining Process Joining of solder-coated chips and joining of lead chips using ribbon solder ■Chip Size □1.0~6.0mm ■Lead Chip Size 8.5x2.5mm, 8.5x3.5mm, etc. ■Bonding Accuracy (XY) +/-150μm ■Bonding Accuracy (Θ) +/-5° ■Bond/Pick Load 40~200gf ■Compatible Work Lead Frame ■Compatible Width Up to 30mm ■Chip/Lead Supply Parts Feeder Supply ■Machine Cycle Time 0.9sec (1 chip) 1.6sec (2 chips) ■Transport Method Pin Transport ■External Dimensions 2,300x1,000x1,490mm ■Weight 1,200kg ■Main Options Backside recognition for chip orientation determination, appearance inspection, and punching of defective products *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
  • Bonda

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Daibonda for Tanzaku Frame 'DBD4600S'

Daibonda for Tanzaku Frame 'DBD4600S'

Dai-bonder for tanzaku frames, compatible with both eutectic and epoxy, can also be used for both. Supports small chips (□0.15mm and above) and provides stable operation!

The "DBD4600S" is a die bonder for strip frames, capable of handling small chips starting from 0.15mm, providing stable operation. 【Specifications】 ■ Bonding process: Eutectic (DAF)/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bonding accuracy (XY): +/-35μm +/-25μm (when using backside recognition) ■ Bonding accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches Disco ring or expand ring ■ Machine cycle time: 0.3 seconds/chip (Eutectic), varies by conditions ■ Transport method: Pin transport (Eutectic or combined specifications) Gripper transport (Epoxy dedicated machine) ■ External dimensions: 2,200x1,250x1,880mm ■ Weight: 1,200kg ■ Major options: Rotary bond head, backside recognition, collet cleaner, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
  • Bonda

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MPP Manual Wire Bonder iBond 5000 Series

MPP Manual Wire Bonder iBond 5000 Series

Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.

iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Bonda

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ASMPT manufactured flip chip bonder/die bonder CoS

ASMPT manufactured flip chip bonder/die bonder CoS

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

  • Bonding Equipment
  • Bonda

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ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.

The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.

  • Other electronic parts
  • Bonda

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