Hot press machine
Flip Chip Bonder for IC Cards
Supports everything from user-friendly standalone types to inline systems.
- Company：Ito Corporation
- Price：Unset
Bonda Product List and Ranking from 21 Manufacturers, Suppliers and Companies | IPROS GMS
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Bonda Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Bonda Product ranking
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
- ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
- Fasford Technology "SiP Bonder (DB830plus+)" ファスフォードテクノロジ
- ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
- 4 High-speed fully automatic fine wire bonder 'BJ855' ヘッセ･メカトロニクス･ジャパン
- 5 Fully automatic high-precision die bonder "FINEPLACER femto2"
Bonda Product List
91～94 item / All 94 items
Displayed results
Semiconductor assembly device Wire bonder FB-880
Realizing joining technology for new fields
Operator-friendly, stable, full-auto wire bonder.
- Company：カイジョー
- Price：Other
Semiconductor assembly equipment Wire Bonder FB-780
Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.
Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.
- Company：カイジョー
- Price：Other
