We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonda.
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Bonda Product List and Ranking from 25 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 キヤノンマシナリー Shiga//Industrial Machinery
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Bonda Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  2. Latest wire bonder with wire monitoring function
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Bonda Product List

46～60 item / All 108 items

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Coated Wire TAB Beam Lead Bonder Model 7440D/7440E

Coated Wire TAB Beam Lead Bonder Model 7440D/7440E

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. The coated wire, TAB, and beam lead bonders are manual bonders that excel in operability and versatility, utilizing a new X-Y-Z three-axis manipulator for operations. The applicable load range is from 25 to 250 grams.

  • Steel

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Flip chip bonder, high-precision die bonder

Flip chip bonder, high-precision die bonder

Ideal for prototype development of laser diodes and fine chip implementation.

Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.

  • Steel

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Wire Bonder - Fully Automatic Wire Bond

Wire Bonder - Fully Automatic Wire Bond

Achieve high productivity with UPH25000!

Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.

  • Other processing machines

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COF/COG compatible flip chip bonder

COF/COG compatible flip chip bonder

Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.

Full automation is possible at a low cost through integration with the conveying system.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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Cell production compatible, ultrasonic compatible flip chip bonder

Cell production compatible, ultrasonic compatible flip chip bonder

Cell production support. Capable of handling everything from multi-variety production applications to process and material development!

● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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High-precision flip chip bonder with multi-pin chip support

High-precision flip chip bonder with multi-pin chip support

High-performance flip chip bonder for multi-variety cell production lines.

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.

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  • Bonding Equipment

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Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.

Introducing the PowerFusion wedge bonder manufactured by K&S, handled by Techno Alpha. PowerFusion is a fully automatic wedge bonder for lead frame package devices, featuring the latest beltless direct drive motion system and a high-performance image recognition system, significantly improving productivity (UPH) and reliability compared to conventional models. Additionally, it offers a bond head configuration ranging from a single head type to a maximum of six heads, allowing for high productivity tailored to application needs and enabling line changes as necessary. 【Features】 <Productivity> - UPH increase: Adoption of direct drive servo system and high-speed image recognition system - MTBA increase: Enhanced uptime due to high-performance image recognition system <Performance> - Customizable loop profile - Improved bond position repeatability - Reduced damage to lead frames through the use of an input kicker with adjustable overload settings <Advanced Package Compatibility> - Support for small power devices - Expanded bond area - Improved indexing accuracy

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  • Other processing machines
  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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Battery bonding dedicated wire bonder "Asterion-EV"

Battery bonding dedicated wire bonder "Asterion-EV"

Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.

The "Asterion-EV" is a hybrid wedge bonder equipped with an expanded bonding area, intelligent pattern recognition capabilities, and rigorous process control. Based on a redesigned architecture, it combines these features to enhance productivity, bonding quality, and reliability. Additionally, it is equipped with a built-in wire feed system that operates in sync with the bond head, allowing for continuous operation at room temperature without applying heat. 【Features】 ■ The expanded bonding area improves flexibility ■ Contributes to reduced line integration costs ■ Achieves high productivity ■ Simplifies programming and optimization of bonding processes for complex devices *For more details, please download the PDF or feel free to contact us.

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  • Bonding Equipment

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Universal Die Bonder "MODEL860Eagle"

Universal Die Bonder "MODEL860Eagle"

Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.

The "MODEL860Eagle" is a universal die bonder that allows for bonding suitable for various purposes, including flip chip, eutectic, ultrasonic, thermal compression, and epoxy bonding, all achievable simply by exchanging the head. It features high placement accuracy and excellent operability, made possible by the use of a half-mirror viewing system. 【Product Overview (Excerpt)】 ■ Half-mirror viewing system ■ High-precision servo motor used (Z drive) ■ Automatic temperature control (stage / collet temperature) ■ Bond weight selection (15 g to 700 g or 50 g to 10 kg) ■ Ultra-high precision linear scrub bond head (start position reproducibility within ± 1 micron) *For more details, please refer to the external link or feel free to contact us.

  • Bonding Equipment

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12-inch high-precision die bonder for stacked packages

12-inch high-precision die bonder for stacked packages

Supports high-precision stacked packages such as NAND flash.

The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~

  • Bonding Equipment

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High thermal capacity device compatible soldering die bonder

High thermal capacity device compatible soldering die bonder

It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement

  • Bonding Equipment

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8-inch wafer compatible high-speed high-precision twin dispense die bonder

8-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Best TCO 　~Small footprint, reduced changeover time~ ◆Best Quality 　~Supports fast-drying paste~ ◆Wide lead frame compatibility 　~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system 　~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup 　~Supports sizes from 0.15 to 8.0mm~

  • Other semiconductors
  • Bonding Equipment

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High-Load Wafer Bonder XB8

High-Load Wafer Bonder XB8

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

  • Bonding Equipment
  • Wafer processing/polishing equipment

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Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.

  • Bonding Equipment

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