Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980.
We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites.
【Features of T-5300/T-5300-W】
■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load.
■ Wide work table (250×330mm).
■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding.
■ Additional options can be retrofitted.
■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily.
■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved.
*For more details, please download the PDF or feel free to contact us.
