We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonda.
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Bonda Product List and Ranking from 22 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. ヘッセ･メカトロニクス･ジャパン Tokyo//Industrial Machinery
  4. 4 テクノアルファ Tokyo//Electronic Components and Semiconductors
  5. 5 null/null
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Bonda Product ranking

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
  2. Fasford Technology "SiP Bonder (DB830plus+)" ファスフォードテクノロジ
  3. ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  4. 4 High-speed fully automatic fine wire bonder 'BJ855' ヘッセ･メカトロニクス･ジャパン
  5. 4 ASMPT's ultra-high precision flip chip bonder 'NANO Pro' 兼松ＰＷＳ

Bonda Product List

31～60 item / All 96 items

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ASMPT's epoxy die bonder "INFINITE" <New Release>

ASMPT's epoxy die bonder "INFINITE" <New Release>

Bonding chips to substrates or lead frames quickly and accurately.

"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.

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  • Other electronic parts
  • Bonda

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ASMPT manufactured eutectic die bonder

ASMPT manufactured eutectic die bonder

High-speed eutectic die bonder

The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR

  • LED Module
  • Other optical parts
  • Chip type LED
  • Bonda

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【設備導入】大型パーツ対応　マルチモジュールボンダー

【設備導入】大型パーツ対応　マルチモジュールボンダー

多様なサイズ　高精度　フレキシブルな対応が可能に！

■様々な顧客要望に対応するマルチモジュールボンダーを導入致しました。 【対応例】 　 ・イメージセンサ：1型、フォーサーズ、APS-C、フルサイズ ・パッケージ：大型イメージセンサ、大型カメラモジュール、ラインセンサーなど 　※上記以外のサイズ、パッケージも対応できますので、ご相談ください。 ■表面実装（SMT）、基板切断、ワイヤボンドなど他工程との組み合わせ対応も承ります。 ■各種解析も社内で対応可能です。

  • Bonding Equipment
  • Bonda

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Small-scale production and development die bonder / flip chip bonder DB258

Small-scale production and development die bonder / flip chip bonder DB258

The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.

This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.

  • Bonding Equipment
  • Bonda

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High-precision die bonder / flip chip bonder FDB210 / 211

High-precision die bonder / flip chip bonder FDB210 / 211

It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.

  • Other semiconductor manufacturing equipment
  • Bonda

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Ultra-high precision flip chip die bonder

Ultra-high precision flip chip die bonder

Ultra-high precision alignment within ±1um. Ideal for prototype development.

Prototype/development specialized die flip chip bonder. It combines high-precision die bonding and flip chip bonding functions, allowing for ultra-high precision bonding through manual adjustments on the monitor screen. (For model MOA1250, no-load alignment ±1 micron) High-precision bonding is easily achieved through PC or sequencer control. ● It is compatible with various objects such as silicon wafers, chips, ceramic substrates, and FR4. ● Feedback on the movement amount is provided for each actuator unit, enabling ultra-high precision. (MOA-1250 type) ● Bonding can be performed in low oxygen concentration using an air curtain heat-up stage. ● Various options available, including conical collets, pulse heaters, and scribing functions. ● All equipment is made to order, customizable in layout, budget, and functions.

  • Other semiconductor manufacturing equipment
  • Bonda

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Coated Wire TAB Beam Lead Bonder Model 7440D/7440E

Coated Wire TAB Beam Lead Bonder Model 7440D/7440E

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. The coated wire, TAB, and beam lead bonders are manual bonders that excel in operability and versatility, utilizing a new X-Y-Z three-axis manipulator for operations. The applicable load range is from 25 to 250 grams.

  • Steel
  • Bonda

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Flip chip bonder, high-precision die bonder

Flip chip bonder, high-precision die bonder

Ideal for prototype development of laser diodes and fine chip implementation.

Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.

  • Steel
  • Bonda

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Wire Bonder - Fully Automatic Wire Bond

Wire Bonder - Fully Automatic Wire Bond

Achieve high productivity with UPH25000!

Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.

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  • Bonda

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COF/COG compatible flip chip bonder

COF/COG compatible flip chip bonder

Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.

Full automation is possible at a low cost through integration with the conveying system.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Bonda

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Cell production compatible, ultrasonic compatible flip chip bonder

Cell production compatible, ultrasonic compatible flip chip bonder

Cell production support. Capable of handling everything from multi-variety production applications to process and material development!

● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Bonda

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High-precision flip chip bonder with multi-pin chip support

High-precision flip chip bonder with multi-pin chip support

High-performance flip chip bonder for multi-variety cell production lines.

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment
  • Bonda

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Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.

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  • Bonding Equipment
  • Bonda

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Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.

Introducing the PowerFusion wedge bonder manufactured by K&S, handled by Techno Alpha. PowerFusion is a fully automatic wedge bonder for lead frame package devices, featuring the latest beltless direct drive motion system and a high-performance image recognition system, significantly improving productivity (UPH) and reliability compared to conventional models. Additionally, it offers a bond head configuration ranging from a single head type to a maximum of six heads, allowing for high productivity tailored to application needs and enabling line changes as necessary. 【Features】 <Productivity> - UPH increase: Adoption of direct drive servo system and high-speed image recognition system - MTBA increase: Enhanced uptime due to high-performance image recognition system <Performance> - Customizable loop profile - Improved bond position repeatability - Reduced damage to lead frames through the use of an input kicker with adjustable overload settings <Advanced Package Compatibility> - Support for small power devices - Expanded bond area - Improved indexing accuracy

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  • Bonding Equipment
  • Other semiconductor manufacturing equipment
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Battery bonding dedicated wire bonder "Asterion-EV"

Battery bonding dedicated wire bonder "Asterion-EV"

Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.

The "Asterion-EV" is a hybrid wedge bonder equipped with an expanded bonding area, intelligent pattern recognition capabilities, and rigorous process control. Based on a redesigned architecture, it combines these features to enhance productivity, bonding quality, and reliability. Additionally, it is equipped with a built-in wire feed system that operates in sync with the bond head, allowing for continuous operation at room temperature without applying heat. 【Features】 ■ The expanded bonding area improves flexibility ■ Contributes to reduced line integration costs ■ Achieves high productivity ■ Simplifies programming and optimization of bonding processes for complex devices *For more details, please download the PDF or feel free to contact us.

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  • Bonding Equipment
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Universal Die Bonder "MODEL860Eagle"

Universal Die Bonder "MODEL860Eagle"

Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.

The "MODEL860Eagle" is a universal die bonder that allows for bonding suitable for various purposes, including flip chip, eutectic, ultrasonic, thermal compression, and epoxy bonding, all achievable simply by exchanging the head. It features high placement accuracy and excellent operability, made possible by the use of a half-mirror viewing system. 【Product Overview (Excerpt)】 ■ Half-mirror viewing system ■ High-precision servo motor used (Z drive) ■ Automatic temperature control (stage / collet temperature) ■ Bond weight selection (15 g to 700 g or 50 g to 10 kg) ■ Ultra-high precision linear scrub bond head (start position reproducibility within ± 1 micron) *For more details, please refer to the external link or feel free to contact us.

  • Bonding Equipment
  • Bonda

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12-inch high-precision die bonder for stacked packages

12-inch high-precision die bonder for stacked packages

Supports high-precision stacked packages such as NAND flash.

The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~

  • Bonding Equipment
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High thermal capacity device compatible soldering die bonder

High thermal capacity device compatible soldering die bonder

It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement

  • Bonding Equipment
  • Bonda

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8-inch wafer compatible high-speed high-precision twin dispense die bonder

8-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Best TCO 　~Small footprint, reduced changeover time~ ◆Best Quality 　~Supports fast-drying paste~ ◆Wide lead frame compatibility 　~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system 　~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup 　~Supports sizes from 0.15 to 8.0mm~

  • Other semiconductors
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  • Bonda

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High-Load Wafer Bonder XB8

High-Load Wafer Bonder XB8

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

  • Bonding Equipment
  • Wafer processing/polishing equipment
  • Bonda

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Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.

  • Bonding Equipment
  • Bonda

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Tabletop Wire Bonder "Manual HB10"

Tabletop Wire Bonder "Manual HB10"

Ideal for prototype development! Recommended for simple applications such as test wiring and small-scale bonding.

The "Manual HB10" is a manual-type tabletop wedge-ball hybrid wire bonder that retains the excellent features of the "HB16" while considering price aspects. The Z-axis is motor-controlled, allowing for consistent control of loop height. The user interface features a 6.5-inch touch panel, enabling smooth changes and saving/loading of parameters. Additionally, the work surface is equipped with a sliding clamp and wire feed function, significantly reducing wire handling tasks and providing excellent operability. 【Features】 ■ Suitable for prototype development with both wedge bond and ball bond capabilities ■ Z-axis control for loop height management ■ Excellent operability with touch panel and wire feed function ■ Comprehensive features and stable bonding ■ Significant reduction in wire handling tasks *For more details, please refer to the PDF document or feel free to contact us.

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Rotary Head Bonder REBO-9T

Rotary Head Bonder REBO-9T

Significant improvements in recognition capabilities will contribute to the increased operational efficiency of the production line.

- Expanded the bonding area in the Y direction by 70mm, enabling support for wide bonding. - Integrated two heads to achieve space-saving. - Capable of accommodating various wire diameters through kit replacement.

  • Other semiconductors
  • Bonda

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Ultrasonic Ribbon Bond RB0300SS

Ultrasonic Ribbon Bond RB0300SS

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment
  • Bonda

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LED flip chip bonder

LED flip chip bonder

LED flip chip mounting device

- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.

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  • Bonda

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Oxygen-free binder

Oxygen-free binder

Oxygen, flux, stress-free! Achieving oxygen concentration below 100 ppm without a cover.

We would like to introduce our "Oxygen-Free Bonder." It achieves an oxygen concentration of 100 ppm or lower without a cover. An oxygen concentration meter can be installed to continuously monitor the oxygen levels. The microscope is a three-eyed type stereo microscope, capable of external monitor output. 【Features】 - Oxygen concentration on the main stage (device working position) is below 100 ppm. - An oxygen concentration meter can be installed for continuous monitoring. - The nitrogen flow rate supplied can be adjusted using a flow meter. - Maximum flow rate is 30 L/min, with a scale of 1 L increments. *For more details, please refer to the PDF materials or feel free to contact us.

  • Welding Machine
  • Bonda

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BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

  • Bonding Equipment
  • Bonda

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Manual and Automatic Bonding Device 'BJ653'

Manual and Automatic Bonding Device 'BJ653'

Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
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