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Bonda Product List and Ranking from 25 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 キヤノンマシナリー Shiga//Industrial Machinery
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Bonda Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  2. Latest wire bonder with wire monitoring function
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Bonda Product List

16～30 item / All 108 items

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High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.

  • Assembly Machine
  • Other semiconductor manufacturing equipment

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Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

  • Other mounting machines

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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

  • Other processing machines

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Flip Chip Bonder "FB2000SS"

Flip Chip Bonder "FB2000SS"

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

  • 2-3.PNG
  • Other processing machines

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Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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Solar and secondary battery large wire wedge bonder "BJ980"

Solar and secondary battery large wire wedge bonder "BJ980"

Adoption of a central control system! Automatic calibration updates.

The "BJ980" has been newly developed for the wide area where demand is increasing, particularly for solar and battery products. The highly versatile bonding area features a wedge bonder with dimensions of X700mm and Y1132mm, allowing for the construction of fully automatic or manual operation systems. We have developed a bonding head for thick wires equipped with a unique transducer that includes sensors for non-destructive testing of bond head pull tests and real-time bond quality inspection. 【Features】 ■ Flexible, one of the largest work areas in the industry: 1700mm × 1132mm ■ Bond head: 150μm - 600μm, compatible with aluminum, copper, and aluminum-copper clad ■ Ribbon maximum 2000um × 400um (80mil × 16mil) ■ High-precision programmable bond force actuator ■ Components using wear-free piezo technology *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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Flux-free solder bond "DBD3580S"

Flux-free solder bond "DBD3580S"

Fluxless solder die bonding (wire solder) for power semiconductors. Multi-chip mounting support available as an option!

Fluxless solder bonder for power semiconductors 'DBD3580S' Compatible with multi-row work such as Power QFN with a maximum width of 100mm. 【Specifications】 ■ Bonding process: wire solder application ■ Chip size: □1.0~6.0mm ~10.0mm (optional) ■ Bonding accuracy (XY): +/-50μm ■ Bonding accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible work: lead frame or carrier ■ Maximum width supported: up to 100mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.60 seconds/chip, depending on various conditions ■ Pin transport ■ External dimensions: 2,000x1,235x1,650mm ■ Weight: 1,300kg ■ Main options: wafer changer (standard specification), magazine loader, wafer map, punch unit, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors

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Clip Bond "DCA1000"

Clip Bond "DCA1000"

Clip Bonder - Die bonder for power semiconductors, chip and clip bonding, with optional appearance inspection and NG product punching unit support.

The "DCA1000" is a die and clip bonder for power semiconductors. (The device photo shows the configuration of a die bonder + clip bonder + appearance inspection mechanism) 【Specifications】 ■Joining Process Joining of solder-coated chips and joining of lead chips using ribbon solder ■Chip Size □1.0~6.0mm ■Lead Chip Size 8.5x2.5mm, 8.5x3.5mm, etc. ■Bonding Accuracy (XY) +/-150μm ■Bonding Accuracy (Θ) +/-5° ■Bond/Pick Load 40~200gf ■Compatible Work Lead Frame ■Compatible Width Up to 30mm ■Chip/Lead Supply Parts Feeder Supply ■Machine Cycle Time 0.9sec (1 chip) 1.6sec (2 chips) ■Transport Method Pin Transport ■External Dimensions 2,300x1,000x1,490mm ■Weight 1,200kg ■Main Options Backside recognition for chip orientation determination, appearance inspection, and punching of defective products *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors

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Daibonda for Tanzaku Frame 'DBD4600S'

Daibonda for Tanzaku Frame 'DBD4600S'

Dai-bonder for tanzaku frames, compatible with both eutectic and epoxy, can also be used for both. Supports small chips (□0.15mm and above) and provides stable operation!

The "DBD4600S" is a die bonder for strip frames, capable of handling small chips starting from 0.15mm, providing stable operation. 【Specifications】 ■ Bonding process: Eutectic (DAF)/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bonding accuracy (XY): +/-35μm +/-25μm (when using backside recognition) ■ Bonding accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches Disco ring or expand ring ■ Machine cycle time: 0.3 seconds/chip (Eutectic), varies by conditions ■ Transport method: Pin transport (Eutectic or combined specifications) Gripper transport (Epoxy dedicated machine) ■ External dimensions: 2,200x1,250x1,880mm ■ Weight: 1,200kg ■ Major options: Rotary bond head, backside recognition, collet cleaner, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors

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High-precision die bonder/flip chip bonder 'sigma'

High-precision die bonder/flip chip bonder 'sigma'

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

  • Bonding Equipment

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[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

Multiple processes with a single device! Bonding position accuracy of 0.5µm!

The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.

  • Bonding Equipment

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High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!

This is a die bonder device that supports various bonding processes for prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic components. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers the safety of process gas usage and UV irradiation for operating personnel. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip support • Cost-effective equipment configuration • Compatible with various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

  • others

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High-precision full-auto flip chip bonder: femto2

High-precision full-auto flip chip bonder: femto2

The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.

The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.

  • Other semiconductor manufacturing equipment

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Full Auto Flip Chip Bonder: femto blu

Full Auto Flip Chip Bonder: femto blu

The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.

This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

  • others

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