We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonda.
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Bonda Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. ヘッセ･メカトロニクス･ジャパン Tokyo//Industrial Machinery
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 テクノアルファ Tokyo//Electronic Components and Semiconductors
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Bonda Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder
  2. Fully Automatic Thick Wire Bonder 'BJ955/959' ヘッセ･メカトロニクス･ジャパン
  3. MPP Corporation's "Manual Wire Bonder iBond5000 Series" 兼松ＰＷＳ
  4. ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
  5. 5 ASMPT's ultra-high precision flip chip bonder 'NANO Pro' 兼松ＰＷＳ

Bonda Product List

91～100 item / All 100 items

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Fully automatic high-precision die bonder "FINEPLACER femto2"

Fully automatic high-precision die bonder "FINEPLACER femto2"

Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.

The "FINEPLACER femto2" is a fully automatic high-precision die bonding machine that achieves a mounting accuracy of 0.3μm @ 3 sigma. It supports various mounting methods such as thermal eutectic, ultrasonic, and more, ensuring a consistently stable assembly process even when transitioning from product development to full-scale manufacturing. 【Features】 ■ High-precision alignment with UHD vision alignment system ■ Integrated process management for quick adaptation to multiple mounting processes ■ Compatible with various mounting processes (thermal compression, soldering, adhesives, ultrasonic, etc.) ■ Modular system design allows for diverse configurations ■ Process environment managed with cleanroom quality ■ Equipped with three-color LED lighting for excellent visibility and image recognition ■ Intuitive operation via touch screen panel *You can view product materials and technical documents related to bonding by downloading the PDF. Please feel free to contact us with any inquiries.

  • Other semiconductor manufacturing equipment

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[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips

[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips

We are stacking delicate membrane chips with a post-bonding accuracy of less than 1μm!

The Microelectronics Research Institute in Stuttgart conducts business-oriented research in fields such as silicon technology, application-specific integrated circuits (ASICs), nanostructures, and image sensor technology, and provides specialized training. In new applications, it has become a critical requirement to stack membrane chips of a few centimeters in size with very high precision. After all steps of placement and stacking are completed, the post-bonding accuracy for the entire process must be less than 1μm. This case study introduces a "die bonder compatible with stacking implementation of membrane chips with a post-bonding accuracy of 1μm." *For more detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*

  • Other mounting machines

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[Customer Case] Utilization of High-Precision Die Bonder

[Customer Case] Utilization of High-Precision Die Bonder

We provide advanced research facilities for microsystem technology to our partners!

We will introduce how the University of South-Eastern Norway is utilizing assembly equipment from Finetech to promote innovation at one of Norway's leading microtechnology hubs. The University of South-Eastern Norway (USN), which has 20,000 students across eight campuses, is one of the educational institutions in Norway. This university, which was formed by the merger of three regional colleges, currently offers a variety of bachelor's, master's, and doctoral programs in many scientific fields. In addition, USN not only plays an important role in domestic and international research and education but is also closely linked to one of the dynamic economic regions. This case study introduces the use of high-precision die bonders in the "Electronic Coast." *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.

  • Other mounting machines

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[Research Material] Global Market for Semiconductor Assembly Process Equipment

[Research Material] Global Market for Semiconductor Assembly Process Equipment

Global Market for Semiconductor Assembly Process Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT

This research report (Global Semiconductor Assembly Process Equipment Market) investigates and analyzes the current status and outlook for the global market of semiconductor assembly process equipment over the next five years. It includes information on the overview of the global semiconductor assembly process equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly process equipment. It also includes the market share of major companies in semiconductor assembly process equipment, product and business overviews, and sales performance.

  • Other services

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[Research Material] Global Market for Semiconductor Assembly Equipment

[Research Material] Global Market for Semiconductor Assembly Equipment

World Market for Semiconductor Assembly Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT

This research report (Global Semiconductor Assembly Equipment Market) investigates and analyzes the current state of the global semiconductor assembly equipment market and its outlook for the next five years. It includes information on the overview of the global semiconductor assembly equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor assembly equipment market include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly equipment. It also includes the market share of major companies in semiconductor assembly equipment, product and business overviews, and sales performance.

  • Other services

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7600D

Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7600D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel

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Semiconductor assembly device Wire bonder FB-880

Semiconductor assembly device Wire bonder FB-880

Realizing joining technology for new fields

Operator-friendly, stable, full-auto wire bonder.

  • Other semiconductor manufacturing equipment

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Semiconductor assembly equipment Wire Bonder FB-780

Semiconductor assembly equipment Wire Bonder FB-780

Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.

Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.

  • Other semiconductor manufacturing equipment

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High-precision flip chip bonder: lambda2

High-precision flip chip bonder: lambda2

The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.

Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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