Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
91～105 item / All 108 items
Supporting the ever-evolving semiconductor applications!
We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.
High-precision bonding machine with ±5μm accuracy
The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).
FC/COG/COF Bonder Market Analysis Report 2005
With the expansion of FC implementation, the FC bonder market is experiencing rapid growth. An analysis is provided regarding the market, manufacturer shares, and application adoption status for various types of FC bonders, including COG, COF, ultrasonic FC, general-purpose FC, and mounter-type FC bonders.
Hot bonder for the aerospace industry (controller for composite molding and repair)
The HOTBONDER for the aerospace industry is a controller for molding and repairing composite materials. Its main applications include the molding and repair of carbon fiber and glass fiber for aircraft equipment, ground equipment, ships, and academic research purposes.
Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.
The "FINEPLACER femto2" is a fully automatic high-precision die bonding machine that achieves a mounting accuracy of 0.3μm @ 3 sigma. It supports various mounting methods such as thermal eutectic, ultrasonic, and more, ensuring a consistently stable assembly process even when transitioning from product development to full-scale manufacturing. 【Features】 ■ High-precision alignment with UHD vision alignment system ■ Integrated process management for quick adaptation to multiple mounting processes ■ Compatible with various mounting processes (thermal compression, soldering, adhesives, ultrasonic, etc.) ■ Modular system design allows for diverse configurations ■ Process environment managed with cleanroom quality ■ Equipped with three-color LED lighting for excellent visibility and image recognition ■ Intuitive operation via touch screen panel *You can view product materials and technical documents related to bonding by downloading the PDF. Please feel free to contact us with any inquiries.
![[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips](https://image.mono.ipros.com/public/product/image/f38/2000625203/IPROS71322913749513752980.png?w=280&h=280)
We are stacking delicate membrane chips with a post-bonding accuracy of less than 1μm!
The Microelectronics Research Institute in Stuttgart conducts business-oriented research in fields such as silicon technology, application-specific integrated circuits (ASICs), nanostructures, and image sensor technology, and provides specialized training. In new applications, it has become a critical requirement to stack membrane chips of a few centimeters in size with very high precision. After all steps of placement and stacking are completed, the post-bonding accuracy for the entire process must be less than 1μm. This case study introduces a "die bonder compatible with stacking implementation of membrane chips with a post-bonding accuracy of 1μm." *For more detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*
![[Customer Case] Utilization of High-Precision Die Bonder](https://image.mono.ipros.com/public/product/image/a6c/2000625207/IPROS96249786410669164996.png?w=280&h=280)
We provide advanced research facilities for microsystem technology to our partners!
We will introduce how the University of South-Eastern Norway is utilizing assembly equipment from Finetech to promote innovation at one of Norway's leading microtechnology hubs. The University of South-Eastern Norway (USN), which has 20,000 students across eight campuses, is one of the educational institutions in Norway. This university, which was formed by the merger of three regional colleges, currently offers a variety of bachelor's, master's, and doctoral programs in many scientific fields. In addition, USN not only plays an important role in domestic and international research and education but is also closely linked to one of the dynamic economic regions. This case study introduces the use of high-precision die bonders in the "Electronic Coast." *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.
![[Research Material] Global Market for Semiconductor Assembly Process Equipment](https://image.mono.ipros.com/public/product/image/51e/2001456883/IPROS16332850475457528683.jpeg?w=280&h=280)
Global Market for Semiconductor Assembly Process Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT
This research report (Global Semiconductor Assembly Process Equipment Market) investigates and analyzes the current status and outlook for the global market of semiconductor assembly process equipment over the next five years. It includes information on the overview of the global semiconductor assembly process equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly process equipment. It also includes the market share of major companies in semiconductor assembly process equipment, product and business overviews, and sales performance.
![[Research Material] Global Market for Semiconductor Assembly Equipment](https://image.mono.ipros.com/public/product/image/af3/2001476177/IPROS55883798478253534179.jpeg?w=280&h=280)
World Market for Semiconductor Assembly Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT
This research report (Global Semiconductor Assembly Equipment Market) investigates and analyzes the current state of the global semiconductor assembly equipment market and its outlook for the next five years. It includes information on the overview of the global semiconductor assembly equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor assembly equipment market include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly equipment. It also includes the market share of major companies in semiconductor assembly equipment, product and business overviews, and sales performance.
West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.
West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.
Flip Chip Bonder for IC Cards
Supports everything from user-friendly standalone types to inline systems.
Realizing joining technology for new fields
Operator-friendly, stable, full-auto wire bonder.
