We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonda.
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Bonda Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. ヘッセ･メカトロニクス･ジャパン Tokyo//Industrial Machinery
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 テクノアルファ Tokyo//Electronic Components and Semiconductors
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Bonda Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder
  2. Fully Automatic Thick Wire Bonder 'BJ955/959' ヘッセ･メカトロニクス･ジャパン
  3. MPP Corporation's "Manual Wire Bonder iBond5000 Series" 兼松ＰＷＳ
  4. ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
  5. 5 ASMPT's ultra-high precision flip chip bonder 'NANO Pro' 兼松ＰＷＳ

Bonda Product List

76～90 item / All 100 items

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MPP Corporation's "Manual Wire Bonder iBond5000 Series"

MPP Corporation's "Manual Wire Bonder iBond5000 Series"

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other processing machines
  • Bonding Equipment

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ASMPT AD830Plus Epoxy Die Bonder

ASMPT AD830Plus Epoxy Die Bonder

The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.

The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

  • Bonding Equipment

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ASMPT manufactured die bonder Photon Pro

ASMPT manufactured die bonder Photon Pro

Multi-Wafer Handling Die Bonder (Auto)

The company's equipment is a die bonder that achieves high precision and high throughput for mass production.

  • Bonding Equipment

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ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

Multi-chip die bonder

The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)

  • Chip type LED
  • Laser Components
  • diode

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Notice of Participation in "SEMICON JAPAN 2023"

Notice of Participation in "SEMICON JAPAN 2023"

Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines

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Dai Bonder "MEGA"

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.

  • Bonding Equipment

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Ultra High Precision Bonder FDB210P

Ultra High Precision Bonder FDB210P

It is a super high-precision die bonder optimized for mass production of optical devices.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.

  • Other semiconductor manufacturing equipment

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Dia Attach System

Dia Attach System

Supporting the ever-evolving semiconductor applications!

We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.

  • Other semiconductor manufacturing equipment
  • Bonding Equipment

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Flip chip bonder, semi-automatic flip chip bonder.

Flip chip bonder, semi-automatic flip chip bonder.

High-precision bonding machine with ±5μm accuracy

The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).

  • Steel

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FC/COG/COF Bonder Market Analysis Report 2005

FC/COG/COF Bonder Market Analysis Report 2005

FC/COG/COF Bonder Market Analysis Report 2005

With the expansion of FC implementation, the FC bonder market is experiencing rapid growth. An analysis is provided regarding the market, manufacturer shares, and application adoption status for various types of FC bonders, including COG, COF, ultrasonic FC, general-purpose FC, and mounter-type FC bonders.

  • Bonding Equipment
  • LCD display
  • Printed Circuit Board

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