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Bonda Product List and Ranking from 25 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 キヤノンマシナリー Shiga//Industrial Machinery
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Bonda Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  2. Latest wire bonder with wire monitoring function
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Bonda Product List

76～90 item / All 108 items

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Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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Fasford Technology "SiP Bonder (DB830plus+)"

Fasford Technology "SiP Bonder (DB830plus+)"

Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.

The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.

  • Bonding Equipment

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ASMPT's ultra-high precision flip chip bonder 'NANO'

ASMPT's ultra-high precision flip chip bonder 'NANO'

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

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  • Bonding Equipment

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ASMPT manufactured flip chip bonder/die bonder AFCPlus

ASMPT manufactured flip chip bonder/die bonder AFCPlus

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

  • Bonding Equipment

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ASMPT manufactured flip chip bonder - Novaplus

ASMPT manufactured flip chip bonder - Novaplus

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

  • Bonding Equipment

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MPP Corporation's "Manual Wire Bonder iBond5000 Series"

MPP Corporation's "Manual Wire Bonder iBond5000 Series"

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other processing machines
  • Bonding Equipment

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ASMPT AD830Plus Epoxy Die Bonder

ASMPT AD830Plus Epoxy Die Bonder

The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.

The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

  • Bonding Equipment

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ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

Multi-chip die bonder

The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)

  • Chip type LED
  • Laser Components
  • diode

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Notice of Participation in "SEMICON JAPAN 2023"

Notice of Participation in "SEMICON JAPAN 2023"

Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines

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Dai Bonder "MEGA"

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.

  • Bonding Equipment

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Ultra High Precision Bonder FDB210P

Ultra High Precision Bonder FDB210P

It is a super high-precision die bonder optimized for mass production of optical devices.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.

  • Other semiconductor manufacturing equipment

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