We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonda.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Bonda Product List and Ranking from 25 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 キヤノンマシナリー Shiga//Industrial Machinery
Go to Company Ranking

Bonda Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  2. Latest wire bonder with wire monitoring function
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Bonda Product List

61～75 item / All 108 items

Displayed results
Tabletop Wire Bonder "Manual HB10"

Tabletop Wire Bonder "Manual HB10"

Ideal for prototype development! Recommended for simple applications such as test wiring and small-scale bonding.

The "Manual HB10" is a manual-type tabletop wedge-ball hybrid wire bonder that retains the excellent features of the "HB16" while considering price aspects. The Z-axis is motor-controlled, allowing for consistent control of loop height. The user interface features a 6.5-inch touch panel, enabling smooth changes and saving/loading of parameters. Additionally, the work surface is equipped with a sliding clamp and wire feed function, significantly reducing wire handling tasks and providing excellent operability. 【Features】 ■ Suitable for prototype development with both wedge bond and ball bond capabilities ■ Z-axis control for loop height management ■ Excellent operability with touch panel and wire feed function ■ Comprehensive features and stable bonding ■ Significant reduction in wire handling tasks *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Rotary Head Bonder REBO-9T

Rotary Head Bonder REBO-9T

Significant improvements in recognition capabilities will contribute to the increased operational efficiency of the production line.

- Expanded the bonding area in the Y direction by 70mm, enabling support for wide bonding. - Integrated two heads to achieve space-saving. - Capable of accommodating various wire diameters through kit replacement.

  • Other semiconductors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-precision low-load flip chip bonder CB-600 by Athlete FA

High-precision low-load flip chip bonder CB-600 by Athlete FA

Achieving a mounting accuracy of ±1 [μm] and an ultra-low load of 0.049 [N]! High-precision bonding compatible with extremely low loads.

The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)

[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)

A lineup of features that meet the needs of various factories! Industry-leading speed FCB (Flip Chip Bonder) specialized for small chips.

The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.

  • image_02.png
  • image_03.png
  • image_04.png
  • Bonding Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-speed Die Bonder compatible with micro and thin chips!

We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate transport device (loader/unloader)

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Ultrasonic Ribbon Bond RB0300SS

Ultrasonic Ribbon Bond RB0300SS

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
LED flip chip bonder

LED flip chip bonder

LED flip chip mounting device

- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.

  • Other mounting machines

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Oxygen-free binder

Oxygen-free binder

Oxygen, flux, stress-free! Achieving oxygen concentration below 100 ppm without a cover.

We would like to introduce our "Oxygen-Free Bonder." It achieves an oxygen concentration of 100 ppm or lower without a cover. An oxygen concentration meter can be installed to continuously monitor the oxygen levels. The microscope is a three-eyed type stereo microscope, capable of external monitor output. 【Features】 - Oxygen concentration on the main stage (device working position) is below 100 ppm. - An oxygen concentration meter can be installed for continuous monitoring. - The nitrogen flow rate supplied can be adjusted using a flow meter. - Maximum flow rate is 30 L/min, with a scale of 1 L increments. *For more details, please refer to the PDF materials or feel free to contact us.

  • Welding Machine

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

  • Bonding Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Texas Corporation Business Introduction

Texas Corporation Business Introduction

Thoroughly manage the situation and take action based on the guidelines to "raise" it.

Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Die Bonding for Hoop Frame 'DBD4200R'

Die Bonding for Hoop Frame 'DBD4200R'

Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!

Die Bonder for Hoop Frame "DBD4200R" Compatible with small chips starting from 0.15mm. 【Specifications】 ■ Joining process: Eutectic/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bond accuracy (XY): +/-35μm ■ Bond accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Maximum width supported: Up to 78mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.25 seconds/chip (Eutectic), depending on various conditions ■ Transport method: Roller transport ■ External dimensions: 1,740x1,150x1,185mm ■ Weight: 1,000kg ■ Major options: Rotary bond head, uncoiler, cutter, wafer map, post-bond recognition, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Daibond for Tanzaku Frame 'EBD4350S'

Daibond for Tanzaku Frame 'EBD4350S'

Tanzaku frame double-sided adhesive, compatible with both epoxy and DAF, suitable for fast-drying paste.

The "EBD4350S" die bonder for short strips is an epoxy die bonder compatible with fast-drying paste. 【Specifications】 ■ Joining process: Epoxy/DAF/dual-use machine specifications ■ Chip size: □0.15~3.0mm ■ Bond accuracy (XY): +/-35μm, +/-25μm (when using backside recognition) ■ Bond accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible workpieces: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches, disco ring or expand ring ■ Machine cycle time: 0.35 seconds/chip, depending on various conditions ■ Transport method: Gripper transport ■ External dimensions: 1,680x1,135x1,645mm ■ Weight: 1,300kg ■ Major options: Rotary bond head, backside recognition, up-down mechanism, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.

[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.

Bonding position accuracy of 0.5µm!

In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.

  • Bonding Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-precision flip chip bonder 'femto2'

High-precision flip chip bonder 'femto2'

Fully automatic high-precision die bonding machine

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

  • Other semiconductor manufacturing equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-precision, high-function flip chip bonder: sigma

High-precision, high-function flip chip bonder: sigma

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

  • Bonding Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.