LED flip chip bonder
LED flip chip mounting device
- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.
- Company：大橋製作所 機器事業部
- Price：Other
Bonda Product List and Ranking from 24 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Bonda Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
- 兼松ＰＷＳ Kanagawa//Industrial Machinery
- null/null
- ファインテック日本 Tokyo//Industrial Electrical Equipment
- 4 テクノアルファ Tokyo//Electronic Components and Semiconductors
- 5 カイジョー ODM事業部 Tokyo//Industrial Electrical Equipment
Bonda Product ranking
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
- ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder
- Wafer-level bonders enabling alternative processes for Cu pillars.
- MPP Manual Wire Bonder iBond 5000 Series 兼松ＰＷＳ
- 4 ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
- 5 ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
Bonda Product List
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Oxygen-free binder
Oxygen, flux, stress-free! Achieving oxygen concentration below 100 ppm without a cover.
We would like to introduce our "Oxygen-Free Bonder." It achieves an oxygen concentration of 100 ppm or lower without a cover. An oxygen concentration meter can be installed to continuously monitor the oxygen levels. The microscope is a three-eyed type stereo microscope, capable of external monitor output. 【Features】 - Oxygen concentration on the main stage (device working position) is below 100 ppm. - An oxygen concentration meter can be installed for continuous monitoring. - The nitrogen flow rate supplied can be adjusted using a flow meter. - Maximum flow rate is 30 L/min, with a scale of 1 L increments. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：後島精工
- Price：Other
BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.
- Company：ヘッセ･メカトロニクス･ジャパン
- Price：Other
Manual and Automatic Bonding Device 'BJ653'
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.
- Company：ヘッセ･メカトロニクス･ジャパン
- Price：Other
Texas Corporation Business Introduction
Thoroughly manage the situation and take action based on the guidelines to "raise" it.
Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.
- Company：テクサス
- Price：10 million yen-50 million yen
Die Bonding for Hoop Frame 'DBD4200R'
Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!
Die Bonder for Hoop Frame "DBD4200R" Compatible with small chips starting from 0.15mm. 【Specifications】 ■ Joining process: Eutectic/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bond accuracy (XY): +/-35μm ■ Bond accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Maximum width supported: Up to 78mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.25 seconds/chip (Eutectic), depending on various conditions ■ Transport method: Roller transport ■ External dimensions: 1,740x1,150x1,185mm ■ Weight: 1,000kg ■ Major options: Rotary bond head, uncoiler, cutter, wafer map, post-bond recognition, etc. *For more details, please refer to the catalog or feel free to contact us.
- Company：テクサス
- Price：Other
Daibond for Tanzaku Frame 'EBD4350S'
Tanzaku frame double-sided adhesive, compatible with both epoxy and DAF, suitable for fast-drying paste.
The "EBD4350S" die bonder for short strips is an epoxy die bonder compatible with fast-drying paste. 【Specifications】 ■ Joining process: Epoxy/DAF/dual-use machine specifications ■ Chip size: □0.15~3.0mm ■ Bond accuracy (XY): +/-35μm, +/-25μm (when using backside recognition) ■ Bond accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible workpieces: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches, disco ring or expand ring ■ Machine cycle time: 0.35 seconds/chip, depending on various conditions ■ Transport method: Gripper transport ■ External dimensions: 1,680x1,135x1,645mm ■ Weight: 1,300kg ■ Major options: Rotary bond head, backside recognition, up-down mechanism, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.
- Company：テクサス
- Price：10 million yen-50 million yen
![[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.](https://image.mono.ipros.com/public/product/image/6f4/2000239395/IPROS03001692673784456856.png?w=280&h=280)
[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.
Bonding position accuracy of 0.5µm!
In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.
- Company：ファインテック日本
- Price：Other
High-precision flip chip bonder 'femto2'
Fully automatic high-precision die bonding machine
The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*
- Company：ファインテック日本
- Price：Other
High-precision, high-function flip chip bonder: sigma
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.
The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.
- Company：ファインテック日本
- Price：Other
Multipurpose Die Bonder / Flip Chip Bonder "pico 2"
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.
The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.
- Company：ファインテック日本
- Price：Other
Fasford Technology "SiP Bonder (DB830plus+)"
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.
- Company：ファスフォードテクノロジ
- Price：Other
ASMPT's ultra-high precision flip chip bonder 'NANO'
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.
- Company：兼松ＰＷＳ
- Price：Other
ASMPT manufactured flip chip bonder/die bonder AFCPlus
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.
- Company：兼松ＰＷＳ
- Price：Other
ASMPT manufactured flip chip bonder - Novaplus
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ
- Company：兼松ＰＷＳ
- Price：Other
