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Bonda Product List and Ranking from 25 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 キヤノンマシナリー Shiga//Industrial Machinery
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Bonda Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  2. Latest wire bonder with wire monitoring function
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Bonda Product List

1～15 item / All 108 items

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Epoxy die bonder

Epoxy die bonder

Easy epoxy bonding is possible.

A machine that easily performs epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy materials (adhesives) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.

  • Other painting machines

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor of West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a significant track record of deliveries to government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel

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Semiconductor assembly equipment Wire Bonder FB-900

Semiconductor assembly equipment Wire Bonder FB-900

Further evolved, speed and stability.

This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.

  • Other semiconductor manufacturing equipment

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Ultrasonic flip chip bonder

Ultrasonic flip chip bonder

Ultrasonic flip chip bonder

A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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Aluminum wire bonder/ribbon bonder ASTERION

Aluminum wire bonder/ribbon bonder ASTERION

"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.

The K&S manufactured wire bonder and ribbon bonder ASTERION adopts the latest beltless direct drive motion system, significantly improving productivity (UPH) compared to conventional models, and is a new type of wire bonder with enhanced newly added features. ASTERION has expanded the bonding area, incorporated advanced pattern recognition, and strengthened tight process control. This has improved high productivity, bond quality, and reliability. The enlarged bonding area accommodates various applications and reduces line integration costs. 【Features】 <Productivity> - The expanded bonding movable range (300mm x 300mm) shortens index/loading time. - Enhanced pattern recognition improves MTBA. - Cycle time reduction through pattern recognition with a new mode and direct drive motion system. <Performance> - Minimal frame movement and increased frame rigidity reduce the vibration of the machine during operation. - Repetitive accuracy of bond positioning. - Improved process stability.

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  • Other processing machines
  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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High-precision multi-die bonder flip chip bonder

High-precision multi-die bonder flip chip bonder

Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]

The "FALCON Series" is a die flip chip die bonder that offers a lineup of devices tailored to user needs, ranging from manual to automatic specifications. We can manufacture die flip chip bonders according to your company's required specifications by combining various options. We can propose devices suitable for your specifications, including heating mechanisms, high-load bonding, wafer pickup, and chip flipping functions. Additionally, there are higher models that can accommodate fully automatic specifications with attachments like conveyors, and since these are our own products, we can flexibly respond to your desired customization specifications. 【Features】 ■ Operability Achieves smooth XY stage operability using a joystick. Basic operations can be completed easily with the joystick, providing simple operation specifications. ■ Load Control Supports applications requiring advanced load control through program operation by a motor (Z-axis resolution in micrometers) and VCM control (optional). ■ Software User interface design that does not require a manual. User-friendly specifications that allow for easy setting of bonding parameters and recognition program creation. *For more details, please download the PDF materials.

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  • Bonding Equipment

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12-inch wafer compatible high-speed high-precision twin dispense die bonder

12-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup

  • Bonding Equipment

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LED package compatible die bonder

LED package compatible die bonder

Ideal for handling all types of LED packages.

◆Minimize the space between the mount and preform, prevent changes over time, and reduce unnecessary movements. ◆Direct transport of substrates, support for workpiece thickness, support for large substrates (optional), and carrier compatibility. ◆Support for larger and modular lighting substrates, offering a variety of bonding patterns and recognition patterns. ◆Facilitate work data input to reduce changeover time. ~Changeover time: 60 minutes (hardware 15 minutes, setup 45 minutes)~

  • Other semiconductor manufacturing equipment

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Fully Automatic Wafer Bonder XBS200

Fully Automatic Wafer Bonder XBS200

Fully automatic wafer bonder for mass production, compatible with various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components.

【Features】 ■ Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. ■ Compatible with wafers and substrates ranging from 100mm to 200mm in diameter, and stacking thicknesses up to 6mm. ■ Achieves high-precision post-bond alignment accuracy through the combination of a high-precision bond aligner module XBS200 and an innovative transport mechanism. ■ Control of the bonding environment through vacuum or gas atmosphere control.

  • Sensors
  • Memory

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Tabletop Wire Bonder "Full Manual HB05"

Tabletop Wire Bonder "Full Manual HB05"

Profiles can store up to 20 programs! Suitable for simple wiring tasks.

The "Full Manual HB05" is a full manual type tabletop wedge-ball combined wire bonder that prioritizes cost above all else. It features a liquid crystal display, with the bond profile shown digitally, and can store up to 20 programs in memory. Additionally, the wire feed function and movable clamp make wire handling tasks easy. 【Features】 ■ Focused on price with minimal functions ■ Suitable for simple wiring tasks ■ Ideal for prototype development with both wedge bond and ball bond capabilities ■ Excellent cost performance ■ Easy operation with liquid crystal display and wire feed function *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines

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Tabletop wire bonder "Thick wire semi-auto HB30"

Tabletop wire bonder "Thick wire semi-auto HB30"

This is a thick line wedge bonder that can be utilized in prototype development scenes with its light footwork and excellent operability.

The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Ultrasonic Wire Bonder REBO-9

Ultrasonic Wire Bonder REBO-9

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

  • Other semiconductors

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High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.

  • Bonding Equipment

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Manual Flip Chip Bonder CB-505 Athlete FA Model

Manual Flip Chip Bonder CB-505 Athlete FA Model

Manual flip chip bonder suitable for small-scale production and various experiments.

The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Bonding Equipment

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Tabletop Flip Chip Bonder CB-200 Athlete FA Model

Tabletop Flip Chip Bonder CB-200 Athlete FA Model

Space-saving semi-auto FC bonder compatible with 100[V] power supply.

The "CB-200" is suitable for small-scale and multi-variety production. Its highly versatile device concept accommodates various packages (※1) and various bonding processes (※2). ※1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ※2 ACF, ACP, NCF, NCP, ultrasonic, etc.

  • Bonding Equipment

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