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Bonda Product List and Ranking from 22 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

Bonda Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. null/null
  3. ヘッセ･メカトロニクス･ジャパン Tokyo//Industrial Machinery
  4. 4 テクノアルファ Tokyo//Electronic Components and Semiconductors
  5. 5 null/null
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Bonda Product ranking

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
  2. Fasford Technology "SiP Bonder (DB830plus+)" ファスフォードテクノロジ
  3. ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  4. 4 High-speed fully automatic fine wire bonder 'BJ855' ヘッセ･メカトロニクス･ジャパン
  5. 4 ASMPT's ultra-high precision flip chip bonder 'NANO Pro' 兼松ＰＷＳ

Bonda Product List

61～90 item / All 96 items

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Texas Corporation Business Introduction

Texas Corporation Business Introduction

Thoroughly manage the situation and take action based on the guidelines to "raise" it.

Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.

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Die Bonding for Hoop Frame 'DBD4200R'

Die Bonding for Hoop Frame 'DBD4200R'

Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!

Die Bonder for Hoop Frame "DBD4200R" Compatible with small chips starting from 0.15mm. 【Specifications】 ■ Joining process: Eutectic/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bond accuracy (XY): +/-35μm ■ Bond accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Maximum width supported: Up to 78mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.25 seconds/chip (Eutectic), depending on various conditions ■ Transport method: Roller transport ■ External dimensions: 1,740x1,150x1,185mm ■ Weight: 1,000kg ■ Major options: Rotary bond head, uncoiler, cutter, wafer map, post-bond recognition, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
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Daibond for Tanzaku Frame 'EBD4350S'

Daibond for Tanzaku Frame 'EBD4350S'

Tanzaku frame double-sided adhesive, compatible with both epoxy and DAF, suitable for fast-drying paste.

The "EBD4350S" die bonder for short strips is an epoxy die bonder compatible with fast-drying paste. 【Specifications】 ■ Joining process: Epoxy/DAF/dual-use machine specifications ■ Chip size: □0.15~3.0mm ■ Bond accuracy (XY): +/-35μm, +/-25μm (when using backside recognition) ■ Bond accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible workpieces: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches, disco ring or expand ring ■ Machine cycle time: 0.35 seconds/chip, depending on various conditions ■ Transport method: Gripper transport ■ External dimensions: 1,680x1,135x1,645mm ■ Weight: 1,300kg ■ Major options: Rotary bond head, backside recognition, up-down mechanism, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
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Fasford Technology "SiP Bonder (DB830plus+)"

Fasford Technology "SiP Bonder (DB830plus+)"

Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.

The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.

  • Bonding Equipment
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ASMPT's ultra-high precision flip chip bonder 'NANO'

ASMPT's ultra-high precision flip chip bonder 'NANO'

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

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  • Bonding Equipment
  • Bonda

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ASMPT manufactured flip chip bonder/die bonder AFCPlus

ASMPT manufactured flip chip bonder/die bonder AFCPlus

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

  • Bonding Equipment
  • Bonda

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ASMPT manufactured flip chip bonder - Novaplus

ASMPT manufactured flip chip bonder - Novaplus

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

  • Bonding Equipment
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MPP Corporation's "Manual Wire Bonder iBond5000 Series"

MPP Corporation's "Manual Wire Bonder iBond5000 Series"

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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ASMPT AD830Plus Epoxy Die Bonder

ASMPT AD830Plus Epoxy Die Bonder

The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.

The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

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ASMPT manufactured die bonder Photon Pro

ASMPT manufactured die bonder Photon Pro

Multi-Wafer Handling Die Bonder (Auto)

The company's equipment is a die bonder that achieves high precision and high throughput for mass production.

  • Bonding Equipment
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ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

Multi-chip die bonder

The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)

  • Chip type LED
  • Laser Components
  • diode
  • Bonda

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Notice of Participation in "SEMICON JAPAN 2023"

Notice of Participation in "SEMICON JAPAN 2023"

Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

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Dai Bonder "MEGA"

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
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Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.

  • Bonding Equipment
  • Bonda

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Ultra High Precision Bonder FDB210P

Ultra High Precision Bonder FDB210P

It is a super high-precision die bonder optimized for mass production of optical devices.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.

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Dia Attach System

Dia Attach System

Supporting the ever-evolving semiconductor applications!

We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.

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Flip chip bonder, semi-automatic flip chip bonder.

Flip chip bonder, semi-automatic flip chip bonder.

High-precision bonding machine with ±5μm accuracy

The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).

  • Steel
  • Bonda

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FC/COG/COF Bonder Market Analysis Report 2005

FC/COG/COF Bonder Market Analysis Report 2005

FC/COG/COF Bonder Market Analysis Report 2005

With the expansion of FC implementation, the FC bonder market is experiencing rapid growth. An analysis is provided regarding the market, manufacturer shares, and application adoption status for various types of FC bonders, including COG, COF, ultrasonic FC, general-purpose FC, and mounter-type FC bonders.

  • Bonding Equipment
  • LCD display
  • Printed Circuit Board
  • Bonda

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[Research Material] Global Market for Semiconductor Assembly Process Equipment

[Research Material] Global Market for Semiconductor Assembly Process Equipment

Global Market for Semiconductor Assembly Process Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT

This research report (Global Semiconductor Assembly Process Equipment Market) investigates and analyzes the current status and outlook for the global market of semiconductor assembly process equipment over the next five years. It includes information on the overview of the global semiconductor assembly process equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly process equipment. It also includes the market share of major companies in semiconductor assembly process equipment, product and business overviews, and sales performance.

  • Other services
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