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Glove box Product List and Ranking from 44 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Glove box Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 神港精機 東京支店 Tokyo//Industrial Machinery
  2. アイビック・リサーチ Ibaraki//Testing, Analysis and Measurement
  3. UNICO 　　つくばフロンティア・ラボ Ibaraki//Testing, Analysis and Measurement
  4. 4 エイエルエステクノロジー Kanagawa//Testing, Analysis and Measurement
  5. 5 UNICO 　　東京技術センター(Ｔ.Ｔ.Ｃ) Tokyo//Manufacturing and processing contract
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Glove box Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Powder Artificial Gastric Juice Artificial Intestinal Juice BioWise アイビック・リサーチ
  2. Contract film deposition service for experimental and research development purposes: "ALD (Atomic Layer Deposition) Equipment" ワッティー
  3. Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device) 神港精機 東京支店
  4. SDR-type roll-to-roll sputtering device (RtoR type sputtering device) 神港精機 東京支店
  5. 5 Polyimide cure device (300mm wafer compatible clean bake device) 神港精機 東京支店

Glove box Product List

121～135 item / All 231 items

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Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.

A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Simple experimental sputtering device (SRV3100 type)

Simple experimental sputtering device (SRV3100 type)

Compact-type sputtering device exclusively for small substrate, achieving low cost with fully manual operation. Standard type for research and experiments.

Commonization of high-reliability upper models with vacuum chambers and exhaust systems. Cost reduction achieved through manual operation methods. Various components (cathodes, substrate holders, etc.) can be selected according to the type of film and purpose. The efficiency and quality of research and development work can be improved with the well-established mechanisms and stable film deposition performance.

  • Other physicochemical equipment
  • Sputtering Equipment

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Mass production vacuum soldering device (formic acid compatible type)

Mass production vacuum soldering device (formic acid compatible type)

Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.

Expanding a batch-type vacuum soldering device with a rich track record for full-scale mass production. In addition to the conventional H2 atmosphere process, support for formic acid has been added. Achieving voidless soldering with higher reliability on the mass production line. A standard device for soldering automotive power device modules. Responding to requirements with process support from in-house demo units and flexible hardware solutions.

  • Reflow Equipment
  • Annealing furnace

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Compound semiconductor deposition device (AAMF-C1650SPB type)

Compound semiconductor deposition device (AAMF-C1650SPB type)

A dedicated deposition device optimal for advanced optical devices. Achieves a smooth film surface with low-temperature, low-damage film formation. High-quality electrode films realized by hardware compatible with ultra-high vacuum.

A large-diameter cryopump has been adopted in a more compact chamber than conventional types, and ultra-high vacuum compatibility has been implemented in each mechanism of the chamber, enabling a clean high-vacuum environment. The evaporation source uses an electron gun with a water-cooled reflective electron trap, achieving low-damage film formation that prevents electron bombardment on the substrate. The well-established six-gun electron gun is compatible with the formation of multilayer film electrodes that include high-melting-point metals. It features stable deposition, eliminating substrate damage from micro-arcs and abnormalities on the film surface caused by droplets. It can also accommodate lift-off deposition according to the process and production volume. During lift-off deposition, a water-cooling mechanism from the back of the substrate compatible with thick-film electrodes allows for the formation of precious metal thick-film electrodes.

  • Evaporation Equipment

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Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)

Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)

A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.

Replacement of the atmosphere in the furnace with hydrogen reduction. Achieving low oxygen concentration and reduction atmosphere treatment that cannot be realized with an inert atmosphere using N2 through continuous processing in a conveyor furnace. Utilizing the reduction effect of the hydrogen atmosphere, it supports high-temperature soldering and continuous reduction atmosphere heat treatment that require high reliability, which cannot be addressed by conventional reflow. There is also a wealth of experience in firing various pastes. The system covers the reflow process for wafer bumps of system LSI with a CtC type compatible with 300 mm wafers. In addition to conventional soldering, brazing, and paste firing processes, it also has a proven track record in sintering bonding for next-generation bonding materials (metal nano-paste). A demonstration machine is permanently available to reliably support initial tests for various applications through to mass production.

  • Reflow Equipment
  • Annealing furnace
  • Electric furnace

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R&D Multi-Chamber Sputtering Device

R&D Multi-Chamber Sputtering Device

Specialized for responding to R&D and niche processes, a new type of multi-chamber sputtering device for small-scale production and prototyping/research and development, which is difficult with mass production equipment.

A low-cost multi-chamber sputtering system dedicated to the development of advanced thin film processes and small-scale production. It accommodates a wide range of fields with a high-efficiency cathode that excels in film thickness control and a variety of optional mechanisms. Proven in various processes, not only for Si semiconductor electrodes and wiring films but also for magnetic films, insulating films, and protective films for micro-magnetic devices and MEMS. It features the ability to equip different process chambers such as evaporation, annealing, and CVD, allowing for full custom-made production that freely connects each process chamber to a proven mainframe (transport system).

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Multi-purpose sputtering device for surface treatment, model STV6301.

Multi-purpose sputtering device for surface treatment, model STV6301.

A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.

This is a dry surface treatment device that efficiently performs various coatings on three-dimensional shaped parts and molded products made of resin, glass, metal, etc. It can form thin films of various materials such as metals and ceramics over the entire surface. Features: ◎ Full surface film formation on three-dimensional shaped parts ◎ Coating of the inner surfaces of cups and tumblers using a special mechanism ◎ Naturally derived dry hydrophilic coating (plasma lava coating) ◎ Compatible with a wide range of applications from electronic substrates to resin decorations

  • Sputtering Equipment
  • Glass
  • fiber

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Conveyor-type transport bar far-infrared conveyor furnace

Conveyor-type transport bar far-infrared conveyor furnace

Place the workpiece on the bar that is laid horizontally and transport it while irradiating with far infrared rays.

This is the optimal method when you want to minimize the contact area between the workpiece and the transport device.

  • Drying Equipment
  • Electric furnace

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Conveyor-type belt hot air circulation conveyor furnace

Conveyor-type belt hot air circulation conveyor furnace

It is a conveyor that dries workpieces with hot air.

The transportation method will be designed according to your needs, including mesh belts (SUS/plastic), chain bar transport, takt feeding, and multi-row options.

  • Drying Equipment
  • Electric furnace

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Conveyor-type automatic shutter takt conveyor furnace

Conveyor-type automatic shutter takt conveyor furnace

Equipped with insulated shutters at the entrance and exit of the conveyor.

This method is ideal when you want to minimize hot air or when the processing time of the work is long.

  • Drying Equipment
  • Electric furnace

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ICP etching equipment for compound semiconductor processes

ICP etching equipment for compound semiconductor processes

ICP etching equipment for compound semiconductor processes

The RIE-330iPC is a multi-wafer processing etching device for compound semiconductor processes that employs an inductively coupled plasma (ICP) discharge method. 【Features】 ○ Compatible with large trays of Φ330mm Up to 27 pieces for Φ2-inch wafers, 17 pieces for Φ2.5-inch wafers, 12 pieces for Φ3-inch wafers, 7 pieces for Φ4-inch wafers, and 3 pieces for Φ6-inch wafers can be processed simultaneously. ○ By adopting the new SSTC (Symmetrical Shielded Tornado Coil) electrode as the ICP source, it enables high selectivity and excellent uniformity in etching over large areas. ○ Allows for low-damage processes at low bias (below -100V). ○ Stable etching conditions can be achieved through temperature control of the substrate stage and the inner walls of the reaction chamber. ○ A turbo molecular pump is also used in the load lock chamber, providing a more stable process.

  • Etching Equipment
  • Wafer processing/polishing equipment

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ICP etching equipment RIE-800iPC/RIE-400iPC

ICP etching equipment RIE-800iPC/RIE-400iPC

Introducing a full-scale production device equipped with a vacuum cassette chamber, offering excellent process reproducibility and stability.

The "RIE-800iPC/RIE-400iPC" is an ICP etching device that boasts stability for continuous processing of 25 SiC trench-shaped wafers. It can efficiently and stably apply high RF power (over 2 kW), achieving good uniformity. Additionally, by adopting an exhaust system directly connected to the reaction chamber, it realizes a wide process window from low flow and low pressure to high flow and high pressure. 【Features】 <RIE-800iPC> ■ Supports maximum Φ8” wafers ■ Uses inductively coupled plasma for discharge ■ Equipped with a vacuum cassette chamber, excelling in process reproducibility and stability ■ Optimizes the distance between the wafer and plasma to ensure good in-plane uniformity ■ Integrates TMP (Turbo Molecular Pump) and high-frequency power supply for easy replacement *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Experimental sputtering device

Experimental sputtering device

Equipped with a simple yet φ3-inch target magnetron cathode and a wide-range turbo molecular pump with a capacity of 200 L/s.

● Price: 5 million yen (including tax) ● φ3 inch target, 1 molybdenum cathode ● RF 300W power supply, with automatic matching box ● Gas system: 1 system (up to 3 systems available as an option), adjustable via mass flow controller ● Capable of sputtering insulators such as oxides. ● Option to install a substrate heater available. ● Simple structure that is easy to use while eliminating unnecessary components. ● Space-saving dimensions: 800W × 600L × 900H.

  • Company：ヤシマ
  • Price：1 million yen-5 million yen
  • Plasma surface treatment equipment
  • Organic EL
  • Sputtering Equipment

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Mobile Lab Space

Mobile Lab Space

Highly acclaimed! Introducing the foldable simple glove box.

A lightweight and portable folding glove box. The front fully opens for easy access, and putting on and taking off gloves is simple. Basic gas replacement is also possible.

  • Other powder equipment

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Vacuum glove box with gas circulation purification system

Vacuum glove box with gas circulation purification system

Achieve an environment with oxygen and moisture concentration below 1 ppm!

By connecting to the gas circulation purification device, it can be used in an environment with both oxygen and moisture concentrations below 1 ppm. After evacuating the main body of the glove box, it is possible to replace the gas, allowing for the creation of a high-purity gas atmosphere in a short time. The pass box can also be vacuum gas replaced, enabling the transfer of items while maintaining the internal atmosphere. Additionally, it is equipped with a sliding table, making it easy to handle items. A power outlet is standardly equipped inside, allowing for easy integration of equipment such as balances. There is ample space without waste, making it easy to introduce equipment into the interior.

  • Other laboratory equipment and containers
  • Glove box

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