Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 44 items
Slab-type solid-state laser fine processing equipment IS / BX / HD series
Edgewave Inc. 【Features】 ○ Output: IR 100W, Green 40W ○ Short pulse: 5–10ns ○ Beam shape: Gaussian, square, line ○ Glass substrate straight hole processing ● For more details, please contact us or download the catalog.
This is an introduction to examples of processing techniques for ultra-fine metal pipes, including one-sided through-hole machining, porous machining, slitting, groove machining, spiral groove machining, and notch machining.
It has become possible to perform various fine processing on thin, ultra-fine metal pipes that were previously unable to be processed due to deformation from external forces with contact tools and thermal effects with conventional thermal processing lasers. By using a rotating mechanism, it is possible to carry out processing in all rotational directions.
Processing is possible with a lightweight, high-precision machine! A compact-sized ultrasonic micro-machining device.
The "US-DT-30N" is a compact ultrasonic fine processing machine. It is capable of processing with a repeatability of ±0.005mm and positioning accuracy of 0.03mm, making it a lightweight, high-precision machine. Ultrasonic fine processing is suitable for machining hard and brittle materials as well as difficult-to-machine materials. Our ultrasonic technology will solve your problems. 【Features of Ultrasonic Processing】 ■ Quality Improvement By finely breaking brittle materials during processing, it minimizes damage to the workpiece, enabling high-quality machining. ■ Cost Reduction By shortening processing time and reducing machining resistance, the tool life is extended, leading to cost savings. ■ Deep Hole Machining By using an ultrasonic processing machine, deep hole machining of hard and brittle materials or difficult-to-machine materials is achieved, which is not possible with other methods. *If you have any requests, we can accommodate even a production quantity of one per year. *For more details, please refer to the PDF document or feel free to contact us.
鉄鋳物筐体で安心の高剛性。精度本位の微細加工に最適な小型微細加工機です。
◆精度を求めるならこの1台 剛性の高い鉄鋳物を筐体に採用。小径穴や細溝などの微細加工をより高速に、より精度よく行うことができます。 高品位な精度が求められる加工に最適な1台です。 【事例】 ■アルミナセラミック形状加工 ■ジルコニアセラミック穴あけ（φ90μm穴） ■アルミ球面加工 ■アクリル形状加工及び微細穴加工（φ100μm） ■パイレックスガラス溝幅100μm ◆加工内製化 ◆引張試験片加工機用にも
From research and development to mass production! This compact NC machining machine can perform genuine machining, such as spherical processing, micro-hole processing, and fine groove processing, even in limited spaces!
◆Wide Range of Processing Applications Compatible with a wide variety of materials, from resins and metals to brittle materials like glass and silicon, as well as ceramics! Suitable for research and development purposes, and can also be used as a mass production machine. The effective stroke is a reassuring 240×250×100mm. With a full cover design, wet processing is possible on a tabletop. ◇AC100V Power Supply That Can Be Used Anywhere The biggest feature of the Micro MC series is its convenience. It is compact and powered by AC100V, making it easy to install anywhere, ideal for low-cost equipment investment. 【Examples】 ■ Microreactor channel groove processing ■ Acrylic shape processing, fine hole processing ■ Aluminum spherical surface processing ■ Alumina ceramic shape processing ■ In-house processing ■ Tensile test specimens
Micro-machining of brittle materials is also possible! A micro-machining machine that balances a compact design with high performance!
The "Micro MC Series" is a compact microprocessing machine primarily designed for R&D applications. It operates on AC100V power supply (domestic), allowing it to be installed in limited spaces, and, unlike typical small processing machines, it supports both dry and wet processing as standard. It is ideal for low-cost equipment investment for a wide range of processing needs. Custom-made devices can also be proposed according to your requirements and budget. 【Features】 ■ Compact design of the housing ■ High performance ■ Supports both dry and wet processing ■ Ideal for low-cost equipment investment ■ Compatible with various materials, including ceramics and metals ◆ Examples For in-house processing and tensile test specimen processing machines Feel free to contact us!
【Efficiency & Space-saving & High Precision】Significantly reduce the cycle time for additional processing! Machining is possible for all materials, including brittle materials!!
◆If you're looking for precision, this is the machine for you. The upper camera recognizes alignment marks, allowing for positioning through image processing. Processing can be easily combined with etching, blasting, photolithography, etc., without being affected by the shape of the workpiece. The takt time for additional processing can also be significantly reduced. It is capable of processing all materials, from resins and ceramics to metals, glass, and brittle materials like silicon!! 【Examples】 ■ Alumina ceramic shape processing ■ Zirconia ceramic drilling (φ90μm holes) ■ Aluminum spherical surface processing ■ Acrylic shape processing and fine hole processing (φ100μm) ■ Pyrex glass groove width 100μm ◆ Also for tensile test specimen processing machines.
Ultra-precise microfabrication is possible for delicate biological samples, transparent materials, and thin films.
It specializes in processing that maximally utilizes the characteristics of femtosecond lasers, enabling precise microfabrication on delicate biological samples, transparent materials, thin films, and all kinds of materials. In recent years, it has also been anticipated as a new biological molecular scalpel, applying photon craft technology to delicate biological samples without causing damage to surrounding tissues or cells.
Achieving long-term high precision maintenance! A high-speed micro-machining machine that has further evolved with various improvements.
"Android II" is an ultra-high-precision high-speed machining machine that pursues a processing accuracy of ±1μm or less. Improvements have been made to minimize displacement to the extreme even under high-speed machining conditions, achieving even higher precision processing. Additionally, it has been refined in response to further requests from customers. [Features] ■ Enhanced thermal deformation countermeasures (Active H.I.S) ■ Cooling of the guide carriage ■ Automatic detection of spindle saturation ■ Reduced warm-up time, shortening non-processing time ■ User-friendly cutting fluid nozzle with adjustable direction *For more details, please refer to the PDF document or feel free to contact us.
Reduction of spindle runout with a dedicated spindle! A high-precision high-speed micro-machining machine that pursues cutting beauty.
The "CEGA-SS 300" is a high-precision, high-speed micro-machining machine equipped with an advanced thermal separation system, Advanced H·I·S control. It features a 5-axis configuration that achieves an extreme fusion of XYZ high-precision 3-axis positioning capability and additional 2-axis indexing accuracy. The synergistic effect of a stable feed mechanism and a frame structure designed for high-precision long-term maintenance promises a higher level of machining surface quality. 【Features】 ■ Reduction of spindle runout with a newly developed dedicated spindle ■ Adoption of an evolved thermal separation system ■ Significant suppression of thermal displacement of the machine body ■ Stable feed mechanism ■ Frame structure for high-precision long-term maintenance *For more details, please refer to the PDF document or feel free to contact us.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Glass with ITO film Film thickness: 90nm / Removal width: approximately 20μm / Pattern size: approximately 5mm x 5mm At Higashi-Nari Electro Beam Co., Ltd., we utilize precision laser processing for fine drilling, cutting, groove processing, and more. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resin materials. Please feel free to consult with us. [Features] ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Drilling of holes less than 100μ For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Cutting width: approximately 40μm / Remaining width: approximately 50μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for precision processing, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can work with a variety of materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. [Features] ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production of one piece to mass production.
Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Cutting width: approximately 40μm / Remaining width: approximately 20μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for microfabrication, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. The materials we can work with include various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins, among others. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for precision hole drilling and micro cutting processing, from prototype production to mass production.
Material: Tungsten Plate thickness: 50μm / Hole diameter: φ (phi) 300μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for precision processing, offering services such as fine hole drilling, cutting, and groove processing. You can choose from various laser wavelengths (IR, SHG, THG). We can work with a wide range of materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: SKD11 Processing diameter: φ (phi) 30μm / Processing depth: 15μm / Processing pitch: 50μm / Number of processes: Approximately 360,000 locations At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for micro-machining, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of burr generation in metals ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μ For more details, please contact us or download the catalog.
