TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)
Are you having trouble with the difficult micro-drilling of glass when manufacturing glass core substrates or TGVs? The micro-drilling of glass using LIDE technology = LIDE method allows for the generation of holes through a laser modification followed by an etching process, achieving a safe method without micro-cracks or chipping. If you are hesitant to purchase equipment, we also offer contract processing services, so please feel free to contact us.
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basic information
Device name: LPKF Vitrion M 5000 Gen2 Maximum processing glass size: 510mm x 515mm Maximum glass thickness: t1.1mm (before etching treatment) Processable shapes: round holes, square holes, step processing, etc. Target materials: general transparent glass
Price information
Separate consultation.
Delivery Time
Applications/Examples of results
TGV Core substrate Cavity processing Predice processing etc.
Detailed information
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Device appearance
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Glass processing process image
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The narrow pitch, high-density TGV array clearly demonstrates the high positional accuracy and precision of the LIDE process, achieving high roundness without defects such as cracks.
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Cutting surface of the TGV's high-density pattern. A typical hourglass shape. The smoothness of the TGV wall enhances the adhesion between metal and glass.
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Manual loading image. There are also devices that can connect to the EFEM.
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LIDE processing example
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LIDE processing example
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Processing examples (half cuts are also possible)
Line up（1）
| Model number | overview |
|---|---|
| LPKF Virtion M 5000 Gen2 |
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Company information
Our company name, BRUX, is derived from the German word "Bruecke," which means "bridge." As the name suggests, we strive to be a bridge connecting technology between Japan and the world, leveraging our extensive experience in international trade and the technical support we continuously accumulate to be of service to everyone.
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