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A space-saving tabletop ultrasonic fine processing machine equipped with a high-speed, high-precision spindle.
It operates on an all AC 100V power supply, so it can be installed in laboratories, experimental rooms, offices, and more.
![[Prototype Acceptance in Progress] Examples of Laser Microfabrication Applications](https://image.mono.ipros.com/public/product/image/e60/2000156206/IPROS6108904142426905709.jpg?w=280&h=280)
We will respond to your prototype requests with cutting-edge laser microfabrication technology, providing high-quality processing that includes three-dimensional shapes.
Hikari Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the general agent in Japan. We have introduced 3D-Micromac's picosecond laser microprocessing equipment within Hikari Corporation. With this cutting-edge laser microprocessing equipment, we will respond to your prototype requests. We achieve high-quality processing for hole drilling, cutting, and marking, regardless of the material being processed. 【Application Examples】 ■ Metals: Micro hole processing, fine groove processing, thin film removal, marking, fine engraving, fine cutting ■ Ceramics, Glass, etc.: Fine engraving, fine cutting, marking, micro hole processing, laser lift-off ■ Resins: Micro hole processing, fine cutting, fine groove processing, coating removal For more details, please contact us or refer to our catalog.
[Laser Micromachining Examples] Hole Processing Examples for Ceramic, Stainless Steel Plates, and Polyimide
Introducing three examples of micro-hole processing! You can also view processing photos from the left. ■ Hole processing of Φ1 mm in ceramic It can be seen that a vertical hole without taper has been made in a 1 mm thick ceramic (AlN). Additionally, there is no thermal impact, resulting in very clean edges. ■ Inverted taper hole processing This is a cross-section view of the hole processing results. Holes were processed in a 1 mm thick stainless steel plate. The photo shows the results of laser processing from left to right. The taper is controlled, resulting in an inverted taper on the laser emission side of the hole. ■ Hole processing of polyimide This is the laser entry side. Holes with a diameter of 25 µm have been processed. The edges are very clean, and there is almost no thermal impact. The material is 25 µm thick polyimide. This is applied to inkjet nozzles, processing over 1,000 holes per head. For more details on various examples of laser processing, please download and view "Case Studies on the Introduction and Problem Solving of Laser Microprocessing Machines Vol. 1" from the link below.
[Laser Micromachining Examples] Polyimide, Ultra-Fine Hole Machining, and Hole Machining Examples on Stainless Steel
Here are three examples of micro hole processing! You can also view processing photos from the left. ■ Hole processing of polyimide This is the laser emission side in the left photo. The reverse taper (the hole diameter on the emission side is larger than that on the incident side) is controlled at 13°. Positioning accuracy of ±250 nm and repeatability of ±250 nm have been achieved. ■ Ultra-fine hole processing A hole of approximately Φ10 µm was processed using a laser on a metal plate with a thickness of 100 µm. There is no thermal impact, resulting in a very clean round hole. Such high aspect ratio laser microprocessing is also possible. ■ Hole processing on stainless steel This is hole processing on 100 µm thick stainless steel SUS430. A fine hole with a diameter of Φ35 µm can be processed using a laser. It is also possible to create a mesh structure with multi-hole processing without distortion due to heat. For more details on various examples of laser processing, please download and view "Laser Microprocessing Machine Introduction & Problem Solving Case Collection Vol. 1" from the link below.
[Laser Micromachining Examples] Mesh processing of stainless steel, dimple processing on brass.
Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Mesh Processing of Stainless Steel We created a mesh structure by machining through holes with a diameter of Φ30µm at a pitch of 50µm in stainless steel SUS430 with a thickness of 100 µm. The number of holes exceeds 80,000. The processing speed is 0.25 seconds per hole. It is possible to arrange the holes in a staggered pattern, as well as in a grid layout as shown in the photo. Additionally, larger area mesh processing is also possible. Since we are scanning the laser spot to create holes, we can achieve various shapes of holes, including round, elongated, square, and triangular holes. ■ Dimple Processing on Brass This processing involves arranging stop holes with a diameter of Φ30µm and a depth of 15µm at a pitch of 40µm. The laser can process not only through holes but also stop holes. We can produce more than 30 dimples per second. The pitch and depth can be freely set. While some lasers cannot process brass, 3D-Micromac has the know-how to process it based on years of experience. *For more details on various other examples, please download and view "Laser Fine Processing Machine Introduction & Problem-Solving Case Study Collection Vol. 1" from the link below.
[Laser Microprocessing Examples] Examples of Y-shaped and C-shaped hole processing, and grooved round hole processing.
Introducing four machining examples related to precision shape cutting! You can also view processing photos from the left. ■ Y-shaped hole machining Holes can be drilled into stainless steel plates thicker than 500 µm while controlling the taper. This is from the laser entry side. The processing time was 100 seconds. 3D-Micromac excels at machining irregular holes while controlling the taper. ■ C-shaped hole machining The hole shape is completely customizable. This shows the laser exit side. We respond to strict dimensional tolerance requirements with precise laser processing. It is gaining attention as an alternative to wire electrical discharge machining (EDM). ■ Y-shaped hole machining Y-shaped holes are being machined into a 500 µm thick stainless steel plate. This is a SEM photo from the laser entry side. The groove width is 50 µm. The edges are sharp. ■ Grooved round hole machining We are machining round holes with grooves. It is possible to cut out freely shaped designs like this. It has received high praise as a highly productive device. For more details on various other examples, please download and view "Laser Microprocessing Machine Introduction & Problem-Solving Case Collection Vol. 1" from the link below.
We have a variety of laser processing machines available!
This catalog is a comprehensive catalog of Delphi Laser Japan Co., Ltd., which primarily engages in equipment sales, equipment development, laser processing, and maintenance in the Japanese market. It features various laser processing equipment, including "ultra-short pulse laser fine processing equipment" used for high-quality fine hole drilling, "ultraviolet laser fine processing equipment," and "ceramic substrate laser processing equipment." We offer a wide range of products that can be used for various applications. [Contents] ■ Ultra-short pulse laser ultra-fine processing equipment ■ Ultraviolet laser fine processing equipment-D ■ Ultraviolet laser fine processing equipment-S ■ Ceramic substrate laser processing equipment ■ Light guide plate dot equipment, etc. *For more details, please refer to the catalog or feel free to contact us.
For processing such as glass drilling, glass scribing, hard material groove processing, and Si scribing!
Our laser microprocessing machine, the 'LP Series', is a device capable of high-speed processing over a wide area, thanks to the combination of a galvanometer scanner and a high-precision XY stage. With the incorporation of a coaxial observation system, it allows for high-resolution processing observation. Additionally, it can accommodate various types of laser oscillators. 【Features】 ■ High precision, high-speed processing, and high value-added processing ■ Compatible with laser oscillators suitable for processing purposes ■ XY stage processing, galvanometer scanning processing, and combined XY stage/galvanometer processing ■ Customization options tailored to processing applications ■ Suitable for both experimental processing applications and production equipment *For more details, please download the PDF or feel free to contact us.
It is a compact excimer laser micromachining device that can be installed on a tabletop.
By using an excimer laser, which operates at ultraviolet wavelengths, excellent processing quality can be achieved. It is effective for processing polymer resins, thin films, metal films, and glass materials.
Excimer laser fine processing equipment LB1000/1500
Compatible with small to large excimer lasers, fixed reduction projection magnification of 4 to 18 times, customizable devices with a variety of options. 【Features】 ○ Customization possible with a variety of optical system options ○ Easy installation and modification of options as needed ○ Reduction projection magnification can be set between 4 and 18 times ○ Observation system with real-time monitoring ○ User-friendly operation with multifunctional software ○ Dedicated options can be remotely controlled from a PC ○ Standard 200×200mm XY stage ○ Compatible regardless of the size or manufacturer of the excimer laser ○ Usable with excimer lasers already owned ● For more details, please contact us or download the catalog.
Ultrasonic fine processing machine that achieves high quality through the integration of ultrasonic vibration.
The ultrasonic machine is a processing device that combines a rotational motion of up to 8000 min⁻¹ with ultrasonic vibrations of 40,000 times per second, specifically designed for diamond tools. It has achieved precise and fine processing of high-hardness brittle materials such as ceramics, glass, and single crystal silicon, which were difficult to process conventionally. ● Compatible with high-hardness brittle materials Processing of high-hardness brittle materials and new materials such as glass, single crystals (silicon, sapphire, etc.), and cemented carbide is possible. ● Achieves high productivity It allows for extended tool life and significant reduction in processing time. ● Achieves high-quality processing With positioning accuracy of 0.004 mm and repeatability of ±0.001 mm, this high-precision machine integrates ultrasonic vibrations to ensure high quality. ● Quiet & Clean Processing at low rotational speeds generates no noise, and the processing coolant is used in low pressure and small amounts, preventing splatter and providing a comfortable working environment.
【Efficiency & Space-saving & High Precision】Significantly reduce the cycle time for additional processing!
◆If you seek precision, this is the machine for you. The upper camera recognizes alignment marks, allowing for positioning through image processing. Processing can be easily combined with etching, blasting, photolithography, and more, without being affected by the shape of the workpiece. The takt time for additional processing can also be significantly reduced. ◇AC100V power supply that can be used anywhere The greatest feature of the Micro MC series is its convenience. It is compact and powered by AC100V, expanding installation options and making it suitable for low-cost capital investment.
Repeat accuracy ±3μm! Ideal for precision machining of brittle materials such as acrylic and glass. A popular tabletop NC micro-machining machine with high versatility. *Exhibited at the Machine Elements Technology Exhibition.
The "Desktop NC Micro Machining Machine Micro MC-2" features an attractively compact design with the smallest footprint in its class. It is rare for a desktop model to achieve high precision, allowing for fine machining of brittle materials such as glass and acrylic. This makes it ideal for the fine groove processing of microreactors essential for cell culture and the small-diameter hole processing of micro-well plates. Powered by AC100V, it is compact enough to be installed in various locations and is suitable for low-cost capital investment. The MC-2 comes standard with DNC functionality, enabling processing of 3D data without concern for size limitations. Additionally, it supports both dry and wet processing as standard. 【Examples】 ■ Microreactor channel groove processing ■ Acrylic shape processing, fine hole processing ■ Aluminum spherical surface processing ■ Alumina ceramic shape processing * It is also used for in-house processing and tensile test specimen machining.
Reduce nano-level vibrations and errors! Ultra-high precision micro-machining machine equipped with a special static pressure spindle.
The "P12-C genesis" is a super high-precision high-speed micro-machining machine equipped with the main axis of a hydrostatic spindle "Vassallo-9." The cutting edge is in a state of suspension, reducing nano-level vibrations and errors. The drive system uses a horizontally opposed mounting linear motor for all axes. The cover is self-supporting, preventing the transmission of vibrations from external disturbances. 【Features】 ■ Reduces nano-level vibrations and errors with non-contact cutting edges ■ Adopts a variable flow oil hydrostatic guide surface ■ Ideal placement of the center of gravity and drive point ■ Lightweight moving parts: use of new material C3 ■ Enlarged monitor (15 inches) for improved visibility compared to conventional machines *For more details, please refer to the PDF document or feel free to contact us.
Achieving a high-dimensional fusion of precision, silence, and responsiveness! A small-diameter micro-machining machine capable of fully automated continuous operation.
The "MEGA-VII Series" is a high-precision, high-speed small-diameter micro-machining machine equipped with a thermal separation system H.I.S control. It features a 5-axis configuration that achieves the ultimate fusion of XYZ high-precision 3-axis positioning capability and additional 2-axis indexing accuracy. With an automatic work exchange system that has an exchange accuracy of ±1μm (proven value), it enables completely unmanned continuous operation. 【Features】 ■ Equipped with a thermal separation system H.I.S control ■ 5-axis configuration ■ Automatic work exchange system with an exchange accuracy of ±1μm (proven value) ■ Capable of completely unmanned continuous operation *For more details, please refer to the PDF document or feel free to contact us.
