We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Netron sputtering equipment.
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Netron sputtering equipment Product List and Ranking from 16 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Netron sputtering equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. ハルツォク・ジャパン Tokyo//Testing, Analysis and Measurement
  3. 真空デバイス 本社 Ibaraki//Pharmaceuticals and Biotechnology
  4. 4 ティー・ケイ・エス Tokyo//Electronic Components and Semiconductors
  5. 5 コメット Ibaraki//Other manufacturing

Netron sputtering equipment Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
  2. Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  3. HPC-20 Fully Automatic Osmium Coater 真空デバイス 本社
  4. 4 Magnetron sputtering device for high-precision optical filter film deposition ティー・ケイ・エス
  5. 5 Ultra-compact Magnetron Sputtering Device MSP-mini 真空デバイス 本社

Netron sputtering equipment Product List

31~33 item / All 33 items

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Combinatorial Magnetron Sputtering System CMS-3200

A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.

The "CMS-3200" is a three-component combinatorial magnetron sputtering device that supports binary and ternary combinatorial composition gradient film deposition. The effective area is an equilateral triangle with a side length of 25mm. It is designed to use 2-inch wafers as standard substrates, allowing for integration into post-processing steps such as patterning and etching, enabling high throughput not only for film deposition but also for analysis. 【Features】 ■ Supports binary and ternary combinatorial composition gradient film deposition ■ Effective film deposition area: equilateral triangle with a side length of 25mm ■ Equipped with three 2-inch magnetron sputter cathodes ■ Can accommodate up to six RF and DC power supplies in three sets ■ Recipe editing and fully automated combinatorial film deposition using LabView *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Easy discharge operation! Compact design with automatic matching for RF power supply.

The "FRS-HG Series" is a multi-source simultaneous magnetron sputtering device equipped with dual-source/three-source simultaneous sputtering capabilities for research and development. Despite being a fixed type, it features a compact and stylish design. There are three film source introduction ports available, allowing for the installation of film sources that can synergize with sputtering, such as sputtering cathodes and arc plasma deposition sources. 【Features】 - Compact and stylish design despite being a fixed type - Auto-matching is employed for the RF power supply, making discharge operation easy - Simultaneous film deposition with two or three sources allows for fine-tuning of thin film functions and performance *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment

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Sputter Source "Ultra High Vacuum Compatible Magnetron DC Sputter Source"

It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.

This sputter source is a general-purpose compact magnetron sputter source compatible with ultra-high vacuum. Since the entire body is bakeable, it allows for film formation with minimal impurities even with highly reactive targets. 【Features】 - Ultra-high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra-high vacuum - Baking up to 300°C is possible by removing the magnet - The target is fixed with a retainer, allowing for quick replacement of the target - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.

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