Circuit Board Spacer SPSN Series
This is a spacer to prevent warping of the P.C. board due to the weight of the mounted components.
This product complies with the RoHS directive.
- Company:品川商工
- Price:Other
Last Updated: Aggregation Period:Dec 17, 2025~Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Dec 17, 2025~Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Dec 17, 2025~Jan 13, 2026
This ranking is based on the number of page views on our site.
31~45 item / All 219 items
This is a spacer to prevent warping of the P.C. board due to the weight of the mounted components.
This product complies with the RoHS directive.
This is a spacer for a mounting hole with a diameter of 4.0 mm.
This product complies with the RoHS directive.
This is a spacer for a mounting hole with a diameter of 3.5 mm.
This product complies with the RoHS directive.
The opening and closing of the P.C. board, as well as its ability to be held upright, are effective during inspections and maintenance.
This product complies with the RoHS directive.
This is a type of spacer that is fixed to the chassis with tapping screws.
This product complies with the RoHS directive.
Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.
The printed circuit board "TAB flexible board" supports a variety of FPCs from prototyping to mass production through R to R lines. Additionally, we conduct simulations from the circuit design stage to provide high-performance, high-quality products. All products are quality assured through automatic visual inspection and electrical testing. We possess a variety of analytical equipment to confirm quality and measure/length at each stage. We offer FPCs compliant with RoHS and made from flame-retardant materials. 【Features】 ■ Mass production of FPCs is realized through R to R ■ We have Ni (nickel)/Au (gold) electroplating equipment to achieve quality that meets customer needs ■ The structure formation of inner leads for connection points is realized *For more details, please request materials or view the PDF data available for download.
Are you having trouble procuring build-up substrates for the main board?
By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.
From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!
- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification
We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC
- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC
It is a flexible substrate, FPC, flexible circuit board with noise reduction structure.
This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.
Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC
We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.
This is a practical device for understanding the characteristics of differential and integral circuits.
This is a practical device for understanding the characteristics of differential and integral circuits using resistors and capacitors. It can be stacked and stored with other practical devices. Customization is also possible upon request.
This is a practical device for measuring the input and output circuits and frequency characteristics of a transistor amplifier circuit, in order to understand the characteristics and operation of the amplifier circuit.
This is a training device for measuring the input and output circuits and frequency characteristics of a transistor amplifier circuit, designed to understand the characteristics and operation of the amplifier circuit. It can be stacked and stored with other training devices. Customization is also possible upon request.
Leave the design and production of control circuits for speed, position, angle, pressure, temperature, and power supply to us.
Our company specializes in the design, development, and manufacturing of control circuit equipment. We have numerous achievements particularly in areas necessary for control, such as drive, feedback, computation, power supply, display, operation, and interface. By enhancing safety, performance, and reliability, we strive to ensure that our customers can use our products with greater peace of mind. Please feel free to consult us with any requests. 【Business Areas】 ■ Circuit Design ■ PCB Design ■ Software Development ■ Analysis and Consulting ■ Verification, Evaluation, and Testing ■ Enclosure Design and Manufacturing *For more details, please download the PDF or feel free to contact us.
Standard materials: Galapagos substrate, paper phenol, composite.
We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship within the shortest possible working days of 1 day. For more details, please contact us or refer to our catalog.