Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.
<Heat Dissipation Measures with Special Substrates>
- Metal (Copper/Aluminum) Bump Substrate
A substrate that utilizes the metal bump areas, which remain after etching a copper plate, for heat dissipation. The structure connects heat sinks of UV-LEDs, high-brightness LEDs, and high-power semiconductors directly to the metal bump areas, allowing heat to escape efficiently.
- Water-Cooled Flow Path Circuit Substrate
A high heat dissipation substrate that integrates a water-cooled heat sink directly onto a metal base substrate. This is effective in situations where standard heat sinks are insufficient for heat dissipation, or for devices like UV-LEDs that have poor conversion efficiency and require essential thermal management.
<UV Protection Substrates for UV-LEDs>
- Hybrid Substrate
A hybrid substrate developed to prevent degradation of connectors due to ultraviolet light, combining a copper base substrate with a glass-epoxy substrate. By partially forming through-holes, it allows for component mounting, such as connectors, on the back side while still being a metal base substrate, thus preventing degradation of components from ultraviolet light.
- Inorganic Resist Coated Substrate
An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, designed for long-term reliability. It is applied to the substrate as a measure against degradation from UV light and as a high-reflectivity material.
- Company:アロー産業
- Price:Other