Circuit Board Spacer SPSN Series
This is a spacer to prevent warping of the P.C. board due to the weight of the mounted components.
This product complies with the RoHS directive.
- Company:品川商工
- Price:Other
Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.
31~60 item / All 219 items
This is a spacer to prevent warping of the P.C. board due to the weight of the mounted components.
This product complies with the RoHS directive.
This is a spacer for a mounting hole with a diameter of 4.0 mm.
This product complies with the RoHS directive.
This is a spacer for a mounting hole with a diameter of 3.5 mm.
This product complies with the RoHS directive.
The opening and closing of the P.C. board, as well as its ability to be held upright, are effective during inspections and maintenance.
This product complies with the RoHS directive.
This is a type of spacer that is fixed to the chassis with tapping screws.
This product complies with the RoHS directive.
Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.
The printed circuit board "TAB flexible board" supports a variety of FPCs from prototyping to mass production through R to R lines. Additionally, we conduct simulations from the circuit design stage to provide high-performance, high-quality products. All products are quality assured through automatic visual inspection and electrical testing. We possess a variety of analytical equipment to confirm quality and measure/length at each stage. We offer FPCs compliant with RoHS and made from flame-retardant materials. 【Features】 ■ Mass production of FPCs is realized through R to R ■ We have Ni (nickel)/Au (gold) electroplating equipment to achieve quality that meets customer needs ■ The structure formation of inner leads for connection points is realized *For more details, please request materials or view the PDF data available for download.
Are you having trouble procuring build-up substrates for the main board?
By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.
From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!
- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification
We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC
- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC
It is a flexible substrate, FPC, flexible circuit board with noise reduction structure.
This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.
Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC
We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.
This is a practical device for understanding the characteristics of differential and integral circuits.
This is a practical device for understanding the characteristics of differential and integral circuits using resistors and capacitors. It can be stacked and stored with other practical devices. Customization is also possible upon request.
This is a practical device for measuring the input and output circuits and frequency characteristics of a transistor amplifier circuit, in order to understand the characteristics and operation of the amplifier circuit.
This is a training device for measuring the input and output circuits and frequency characteristics of a transistor amplifier circuit, designed to understand the characteristics and operation of the amplifier circuit. It can be stacked and stored with other training devices. Customization is also possible upon request.
Leave the design and production of control circuits for speed, position, angle, pressure, temperature, and power supply to us.
Our company specializes in the design, development, and manufacturing of control circuit equipment. We have numerous achievements particularly in areas necessary for control, such as drive, feedback, computation, power supply, display, operation, and interface. By enhancing safety, performance, and reliability, we strive to ensure that our customers can use our products with greater peace of mind. Please feel free to consult us with any requests. 【Business Areas】 ■ Circuit Design ■ PCB Design ■ Software Development ■ Analysis and Consulting ■ Verification, Evaluation, and Testing ■ Enclosure Design and Manufacturing *For more details, please download the PDF or feel free to contact us.
Standard materials: Galapagos substrate, paper phenol, composite.
We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship within the shortest possible working days of 1 day. For more details, please contact us or refer to our catalog.
The thinnest flexible substrate with a total thickness of 100μ is possible. Halogen-free options are also available.
Like one-sided flex, we have a variety of materials in stock. The thinnest option allows for a total thickness of 100μ for flex PCBs, and of course, we can also accommodate halogen-free requirements. For more details, please contact us or refer to our catalog.
Mold cost 0 yen! Cut initial costs to manufacture flexible substrates cheaply and quickly!
At K2, we do not create molds or Thomson molds (Victoria molds) for small lot production of flexible printed circuits, which generally allows us to respond to the time-consuming flexible circuit manufacturing with short lead times. Since there are no costs for creating molds, we can significantly reduce the initial costs, making our prices attractive. Furthermore, this method allows for individual correction of each circuit board, providing the advantage of high quality. 【Features】 ■ Flexible circuit board mold cost: 0 yen ■ Short lead times ■ High quality *For more details, please refer to the PDF document or feel free to contact us.
Accurate technical advice is possible! By introducing advanced equipment, we can accommodate a wide range of specialized substrates.
Our company is capable of handling a wide range of special substrates by creatively utilizing various equipment available in-house, starting with advanced DI (Direct Imaging) equipment. Additionally, since over 90% of our staff are full-time employees, we have accumulated extensive knowledge and know-how regarding substrates by inheriting past experiences, enabling us to provide accurate technical advice to our customers. Please feel free to consult us regarding any special substrates. 【Special substrates we can handle】 ■ Build-up substrates ■ Heat dissipation substrates ■ Impedance control substrates ■ Rigid-flex and multilayer flex substrates ■ Cavity substrates ■ Fine patterns *For more details, please refer to the PDF document or feel free to contact us.
[Demo unit available for loan] An introductory teaching material for contact sequence control! Learn with a practical unit and text that covers the basic components and circuits!
An ideal practical kit for education and training in the basics of relay sequence control. The practical unit is equipped with essential elements for relay sequence control, such as switches, lamps, and relays, and comes with a subtext and a collection of circuit diagrams. An explanatory DVD can also be added as an option. By wiring and realizing the operations indicated in each task, participants will deepen their understanding of control technology by gradually tackling more complex controls. ◎ A practical unit composed of essential elements for relay sequence control ◎ A curriculum that builds knowledge step by step from basic circuits to ON/OFF, AND/OR, self-holding, etc. ◎ Ministry of Health, Labour and Welfare certified teaching material (No. 40128) ◎ Experience the actual creation of circuits from wire preparation to wiring ◎ Maximum effectiveness in education and training when used in conjunction with the explanatory DVD ■ The following curriculum is included: ◎ Basic circuits ◎ ON circuits ◎ AND circuits ◎ OR circuits ◎ Motor drive circuits ◎ Forward and reverse motor circuits ◎ Basic electromagnetic relay circuits ◎ Self-holding circuits ◎ Circuits using limit switches ◎ Additional circuits for manual functions ◎ Interlock circuits for manual and automatic ◎ Drive circuits for two motors ◎ Motor interlocking circuits ◎ Circuits using electronic timers
Since it can be configured to send and receive packets via PPP, it will be useful not only during development but also for maintenance after shipment.
"Tasuki U" is a USB communication cable that connects two CPUs via USB. Depending on the settings, you can plug in the USB to directly connect a virtual terminal or configure it to send and receive packets via PPP, making it useful not only during development but also for maintenance after shipment. For more details about other products, please contact us. 【Features】 ■ Connects to Tera Term without procedures ■ File transfer capability ■ Can connect using PPP procedures *For more information, please refer to the PDF document or feel free to contact us.
Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.
We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling process ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.
Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.
We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It allows for the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Allows for the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.
The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.
The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and more. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, etc. *For more details, please refer to the PDF document or feel free to contact us.
Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!
We would like to introduce our "Function Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate, enabling the provision of copper-thick hybrid circuit boards through continuous wiring. By forming unevenness through step formation in part of the circuit, we can provide height adjustment of mounted components and functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.
Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.
The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used for several bends or bending during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between boards, all suitable for several bends. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.
Finishing the embedded wiring of the implementation board with skilled manual work! Achieving short delivery times.
Our company handles everything from the production of cables and harnesses to the storage and assembly wiring into enclosures. We can procure all the necessary components for embedding. It's okay if the wiring method has not been decided yet. Feel free to leave the branching proposals to us. Additionally, everything from circuit board mounting to enclosure processing, assembly, and wiring is completed in our factory, allowing for shortened delivery times. 【Features】 ■ In-house stock of a wide variety of cables ■ Assistance in creating your original products ■ Drawing creation (tracing) service *For more details, please refer to the PDF materials or feel free to contact us.
Leave the drawing production to us! We also handle the procurement of surrounding accessories.
We accept orders for enclosure manufacturing. We can handle additional processing of accessory items such as panel sheets and plastic molded products, accommodating both prototypes and custom items from just one unit. In addition, we design and manufacture not only electronic circuits but also surrounding accessories such as enclosures and components simultaneously. These processed products can also be ordered individually, helping to reduce costs further. 【Features】 ■ Low-cost molded product processing ■ Creation of drawings based on the customer's appearance image and product specifications ■ High-quality processing capabilities ■ A wide variety of materials and colors for printed panel sheets *For more details, please refer to the PDF materials or feel free to contact us.
High quality and flexible delivery times! We continuously promise stable service.
We offer PCB assembly services. Equipped with facilities specialized for prototyping and small-batch, high-variety production. We also support mass production with batch-type high-speed mounters and in-circuit testers. In addition to chip components, we can also assemble multi-pin ICs such as BGA and QFP, as well as complex-shaped parts. Please feel free to contact us with your requests. 【Features】 ■ Quality manufacturing incorporating traditional methods with 100% in-house production ■ A resident inventory of approximately 28,000 types and 5.6 million items ■ RoHS2 compliance investigation services to support customers' ongoing production plans ■ Short delivery times realized through process management and setup ■ Specialization in prototyping and small-batch, high-variety production *For more details, please refer to the PDF materials or feel free to contact us.
No reliance on online shopping sites! Proud of our inventory, procurement capabilities, and information gathering skills.
We provide parts procurement services. Our in-house inventory includes a full range of standard components such as chip resistors, capacitors, ICs, connectors, diodes, and inductors. We will also search for parts that are not in stock or are difficult to obtain. Additionally, we offer a support service for bill of materials that resolves issues concurrently with A/W design, eliminating factors that could impact the schedule and proposing compatible or alternative parts. 【Features】 ■ A large number of procurement sources built over many years ■ Bill of materials support service ■ Abundant reel inventory (quantity, procurement capability, information gathering ability) ■ Prepared based on the principle of "as much as needed, when needed" *For more details, please refer to the PDF document or feel free to contact us.
No need for a complete specification! We will gather your requests and develop and produce the final product.
We offer development and manufacturing of circuit boards. We handle debugging, hardware verification, inspection fixture manufacturing, operation confirmation (specification matching), aging, and enclosure assembly. Additionally, we may also verify areas with limited track records, such as newly added features, in advance. We compile customer requests and proceed with development and manufacturing towards the final product. 【Service Contents】 ■ Debugging ■ Hardware Verification ■ Inspection Fixture Manufacturing ■ Operation Confirmation (Specification Matching) ■ Aging and Enclosure Assembly *For more details, please refer to the related links or feel free to contact us.