We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for PCB Design Service.
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PCB Design Service Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

PCB Design Service Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 電子ブロック機器製造 Aichi//Industrial Electrical Equipment
  2. 岩崎通信機 Tokyo//Industrial Electrical Equipment
  3. スクリーンプロセス Kanagawa//others
  4. 4 BREXA Technology（旧社名：アウトソーシングテクノロジー） Tokyo//others
  5. 4 産電子工業 本社 Gunma//Industrial Electrical Equipment
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PCB Design Service Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Electronic Circuit Training Device 'YD-5Dx' 電子ブロック機器製造
  2. Logic Circuit Training Device ITF-02A 岩崎通信機
  3. Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate スクリーンプロセス
  4. 4 Surface-Enhanced Raman Scattering (SERS) Measurement Substrate "Wavelet" ニデック コート本部
  5. 4 Printed Circuit Board Next Generation Outline Press Processing 'MS Processing' 名東電産

PCB Design Service Product List

16～30 item / All 219 items

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Surface-Enhanced Raman Scattering (SERS) Measurement Substrate "Wavelet"

Surface-Enhanced Raman Scattering (SERS) Measurement Substrate "Wavelet"

A substrate that enhances the detection power of Raman scattered light! Measurements can be performed even in aqueous solutions and organic solvents.

The substrate for surface-enhanced Raman scattering (SERS) measurements, "Wavelet," is a SERS measurement Au nanorod array substrate. It is created using a dynamic oblique deposition method that achieves high reproducibility without the use of expensive processes such as etching or lithography. The resulting surface features a strongly anisotropic elongated nanoparticle structure, and the effect of plasmon resonance associated with these Au elongated nanoparticles enhances the Raman scattering of adsorbed particles. 【Features】 - Enhances the detection capability of substances with weak Raman scattering light that are difficult to detect. - Measurements can be conducted in aqueous solutions and organic solvents. For more details, please contact us or download the catalog.

  • Circuit Board Inspection Equipment
  • Other measurement, recording and measuring instruments

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Optical design contracting

Optical design contracting

We accept optical design for transparent materials (glass, resin, rubber)! You can trust us with just the design.

Our company offers "optical design contracting." From the development of "lamp caps for lighting" to "ASA COLOR LED" and "ASA COLOR LENS," we leverage the experience and achievements we have cultivated over many years in the lighting field to solve our customers' problems. We not only provide optical design for lenses but also accept design requests related to mounting shapes. 【Main Design Achievements (Partial)】 ■Shapes - Aspherical lenses - Fly-eye lenses - Fresnel lenses - Cylindrical lenses - Freeform lenses *For more details, please refer to the PDF document or feel free to contact us.

  • lens
  • Processing Contract
  • Other contract services

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[Case Study] Adoption of JTAG Testing for LTE Measurement Device Inspection

[Case Study] Adoption of JTAG Testing for LTE Measurement Device Inspection

High-performance, high-quality measurement supported by JTAG boundary scan testing!

We would like to introduce a customer who has implemented "JTAG Boundary Scan Testing" for the inspection of LTE measurement devices. By adopting this product, it has become possible to reliably detect solder defects and pattern defects that cannot be identified through X-ray inspection using electrical testing. Additionally, systems that combine large-scale FPGAs and DDR memory were unable to identify defective areas during functional testing, making feedback to the manufacturing line difficult. However, by adopting this product, we were able to improve manufacturing quality. 【Case Study】 ■ Anritsu Corporation - Engaged in the field of information and communication, providing measurement solutions globally. ■ Challenges - Unable to identify defective areas during functional testing, making feedback to the manufacturing line difficult. *For more details, please refer to the catalog or feel free to contact us.

  • Testing Equipment and Devices

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[Case Study] Adoption of JTAG Testing for Inspection of Implementation Boards

[Case Study] Adoption of JTAG Testing for Inspection of Implementation Boards

Identify defective areas of BGA-mounted boards at the pin level to improve manufacturing quality!

We would like to introduce a customer who adopted "JTAG boundary scan testing" for failure analysis of BGA-mounted boards. After the introduction of our product, sufficient quality assurance can be achieved even for high-density printed circuit boards equipped with numerous BGA packages. 【Case Study】 ■ Saksa Tech Co., Ltd. Production Technology Department - Manufacturing focused on business phones and IC card reader-related products ■ Challenges - Unable to sufficiently establish test pins due to the large number of BGAs - Unable to adequately identify the cause of defects through functional testing - X-ray inspection cannot determine BGA open failures *For more details, please refer to the catalog or feel free to contact us.

  • Testing Equipment and Devices

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[Case Study] Adoption of JTAG Testing for Tascam Products Inspection

[Case Study] Adoption of JTAG Testing for Tascam Products Inspection

JTAG boundary scan testing that improved reliability in the early stages of development!

We would like to introduce a case study of a customer who adopted "JTAG boundary scan testing" in the production line of their in-house developed products. For devices compatible with JTAG that are packaged in BGA format, the basic wiring checks are confirmed through JTAG testing before being handed over to the firmware team for boards that consist of DSP (CPU) + RAM + ROM. This approach eliminates wasted development time due to defects in board or component implementation, thereby improving development efficiency. [Case Study] ■ TEAC Corporation, Audio Equipment Division - Development and sales of audio equipment ■ JTAG testing is conducted from the prototype stage to enhance development efficiency. *For more details, please refer to the catalog or feel free to contact us.

  • Testing Equipment and Devices

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[Case Study] Achieving Quality Assurance for BGA Assembly by Adopting JTAG Testing

[Case Study] Achieving Quality Assurance for BGA Assembly by Adopting JTAG Testing

Feedback the statistical data of BGA defects to manufacturing!

We would like to introduce a case study of a customer who identified defective areas on a BGA implementation board using "JTAG boundary scan testing." By utilizing this product, it became possible to pinpoint the locations of BGA implementation defects at the pin level. A cross-sectional analysis conducted with a microscope on the pins where defects occurred revealed that the cause of the implementation defects was due to the soldering areas being exposed to high temperatures for an extended period. Additionally, by reviewing the temperature management of the solder reflow process, we were able to improve the implementation quality of the board. [Case Study] ■ Oki Electric Communication Systems Co., Ltd. - Mechatronics and electronics design and production contract services ■ Quality assurance of BGA implementation using JTAG testing *For more details, please refer to the catalog or feel free to contact us.

  • Testing Equipment and Devices

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Supports boards with BGA! 【JTAG Test Application Case Collection】

Supports boards with BGA! 【JTAG Test Application Case Collection】

This is a collection of case studies on JTAG testing that led to improvements in quality and enhancements in testing scope.

JTAG boundary scan is a testing method that allows for easy implementation testing of boards with BGA components. It has various advantages, and I believe we can gain insights from the case studies. [Case Studies] - Azbil Corporation: Reduced untested areas with JTAG testing, providing peace of mind to customers! - Anritsu Corporation: JTAG testing supports high-performance and high-quality measurements! - Oki Electric Communication Systems: Achieved BGA implementation assurance through JTAG testing. - Konica Minolta Electronics: Established a consistent and advanced inspection system for high-density implementations. - Saksa Tech: Improved manufacturing quality by pinpointing defects on BGA boards at the pin level. - TEAC Corporation: Enhanced reliability in the early stages of development with JTAG testing. *The company names mentioned in the case studies are as they were at the time permission was granted for the introduction.*

  • Circuit Board Inspection Equipment

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Diagonal comb-shaped electrode substrate

Diagonal comb-shaped electrode substrate

Limited quantity for shipment! Line & Space 4μm/10.5μm

We would like to introduce the "Diagonal Comb Electrode Substrate" handled by EHC Corporation. This is a test substrate with an ITO pattern that has a tilt of 15° and a line and space of 4μm/10.5μm. It is a limited quantity product. The glass substrate material is EAGLE-XG, and the substrate glass size is 30x35x0.7mm. The electrode material is ITO, and the electrode film thickness is 70nm. 【Specifications】 ■ Glass substrate material: EAGLE-XG ■ Substrate glass size: 30x35x0.7mm ■ Electrode material: ITO ■ Electrode film thickness: 70nm ■ Electrode line width: 4μm ■ Electrode space: 10.5μm *For more details, please download the PDF or feel free to contact us.

  • 2.PNG
  • Printed Circuit Board

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Custom power supply design contracting

Custom power supply design contracting

We provide support for custom power supply development, including circuit design, PCB design, and prototype evaluation!

"What should I do about the power supply?" "There's no power supply that fits the product!" In such cases, please consult WTI. We support everything from circuit design, PCB design, to prototype evaluation. We will design a custom power supply that fits perfectly. 【Elements of Power Supply Design】 ■ PCB Design ■ Specification Review ■ Structural Design ■ Various Evaluations ■ Circuit Design ■ Prototype Support *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Embedded system design service

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Op-Amp Circuit Board PX1010

Op-Amp Circuit Board PX1010

You can assemble circuits without wiring!!

The op-amp board "PX1010" can accommodate two 8-pin dual op-amps or one 14-pin quad op-amp, allowing for the easy construction of many basic op-amp circuits by simply placing circuit components in the appropriate positions, much like a jigsaw puzzle. The compatible op-amp packages are DIP with a pin pitch of 2.54 mm or SOP with a pin pitch of 1.27 mm. In addition to axial and radial components, 1608 chip components can also be used for other circuit parts. There is a sister product, the universal board "PX0001" for single DIP op-amps.

  • Printed Circuit Board

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China-Russia Bank

China-Russia Bank

Specialized service for manufacturing medium-sized PCBs of 1 to 5 square meters.

In this service, we have clearly defined "1 to 5 square meters" as the medium lot. If it falls within this manufacturing range, we can produce medium lot PCBs with short lead times, high quality, and low prices. You can easily diagnose whether it qualifies as a medium lot PCB, so please give it a try.

  • Printed Circuit Board

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Universal Electronics Co., Ltd. Production Plan

Universal Electronics Co., Ltd. Production Plan

We will respond to any requests!

Leveraging the experience we have cultivated since our establishment, we respond to the diverse needs of our customers. We believe that by meeting and talking with our customers in person, we can truly understand their needs and create what they desire.

  • others

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Creative Design Circuit Diagram Editor

Creative Design Circuit Diagram Editor

We provide comprehensive solutions for system LSI.

By respecting individuals and building a corporate culture of mutual trust, we aim to harness their abilities to the fullest, create valuable technologies and products, and contribute to society and culture.

  • Other semiconductors

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Single-sided copper base board

Single-sided copper base board

Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Base Single-Sided Board" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs, thanks to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services ranging from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements

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Arrow Industries for special substrates (metal substrates, heat dissipation substrates, UV protection substrates)

Arrow Industries for special substrates (metal substrates, heat dissipation substrates, UV protection substrates)

Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.

<Heat Dissipation Measures with Special Substrates> - Metal (Copper/Aluminum) Bump Substrate A substrate that utilizes the metal bump areas, which remain after etching a copper plate, for heat dissipation. The structure connects heat sinks of UV-LEDs, high-brightness LEDs, and high-power semiconductors directly to the metal bump areas, allowing heat to escape efficiently. - Water-Cooled Flow Path Circuit Substrate A high heat dissipation substrate that integrates a water-cooled heat sink directly onto a metal base substrate. This is effective in situations where standard heat sinks are insufficient for heat dissipation, or for devices like UV-LEDs that have poor conversion efficiency and require essential thermal management. <UV Protection Substrates for UV-LEDs> - Hybrid Substrate A hybrid substrate developed to prevent degradation of connectors due to ultraviolet light, combining a copper base substrate with a glass-epoxy substrate. By partially forming through-holes, it allows for component mounting, such as connectors, on the back side while still being a metal base substrate, thus preventing degradation of components from ultraviolet light. - Inorganic Resist Coated Substrate An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, designed for long-term reliability. It is applied to the substrate as a measure against degradation from UV light and as a high-reflectivity material.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • LED lighting

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