Reduce damage to delicate electronic components! Enables increased productivity and allows for lightweight and compact designs.
Nakatani's "Hot Melt Molding" significantly improves productivity compared to potting molding.
With injection molding alone, not only is the curing time shorter, allowing for reduced production time, but the need for curing equipment is also eliminated, which reduces production space. Additionally, the thin-walled molding does not require exterior, thus reducing material usage and enabling overall cost reduction.
Furthermore, being a solvent-free one-component system, it is harmless, odorless, and environmentally friendly, making it an ecological and economical new technology.
【Features】
■ Molding temperature: 180℃ to 250℃
■ Molding pressure: 3 to 50 kgf/cm²
■ Reduces damage to components
■ Thin-walled molding and no exterior required for material reduction
■ Saves both time and space
*For more details, please refer to the PDF document or feel free to contact us.