Ideal for sensor encapsulation! Hot melt molding
Suitable for sealing and protecting sensors. Cost reduction is also possible through multiple units. Compatible with hot melt materials both domestically and internationally.
Our company specializes in "hot melt molding," which involves low-pressure injection of thermoplastic resin into molds to enhance the protective performance of electronic components. We can use hot melt materials from both domestic and international sources, and we can accommodate various product specifications. We also offer multi-cavity molding, contributing to cost reduction. (Please consult us regarding shapes and sizes.) The high degree of freedom in shape and the ability to shorten molding time are additional benefits. 【Features】 ■ One-component, solvent-free, environmentally friendly ■ Suitable for sensor encapsulation ■ Maximum moldable size: 200×140×10mm ■ Minimum moldable size: 7×5×2.5mm *For more details, please refer to the materials. Feel free to contact us with any inquiries.
- Company:中谷産業
- Price:Other