5G-compatible printed circuit boards and FCCL using atmospheric pressure plasma devices.
Direct bonding technology and electroless plating pretreatment to reduce transmission loss!
We contribute to the manufacturing processes of printed circuit boards and FCCL for 5G and 6G using atmospheric pressure plasma devices. Our "Precise" system separates the plasma generation unit from the processing unit (downstream type), allowing us to impart functional groups and hydroxyl groups to the surface primarily through molecular bonding without damaging the processing area. This enables direct adhesion to liquid crystal polymers (LCP) and fluorine resins while maintaining a smooth surface. Since our plasma treatment focuses on molecular bonding, it allows for processing without any damage to the surface or scientific damage from UV light and other effects of plasma. We are conducting sample work on damage-free direct adhesion to various films. According to our experimental data, the adhesion strength achieved is over 9N/cm (Cu/LCP). The adhesion strength on Ni surfaces can be improved by arranging amine groups on the surface. These treatments can be easily achieved by changing the added gases.
- Company：イー・スクエア
- Price：Other
