[Case Study] Cleaning to Prevent Foreign Matter Adhesion in the Molding Process!
Cleanliness to prevent foreign matter adhesion in the molding process!
During the test production phase of production preparation, there was an issue where foreign substances adhered to the conductive cases (for semiconductor chip transport) during injection, making dust on the surface of the cases noticeable. Additionally, due to processing in a warehouse without air conditioning, there was a need to improve the working environment for the workers. Issues: 1. We want to eliminate static electricity from the products. 2. We want to reduce defects caused by uneven coating.
- Company:蒲田工業
- Price:Other