We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Epoxy Resin.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Epoxy Resin Product List and Ranking from 25 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

Epoxy Resin Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 田岡化学工業 Tokyo//Chemical
  3. ハルツォク・ジャパン Tokyo//Testing, Analysis and Measurement
  4. 4 null/null
  5. 5 日本材料技研 Tokyo//Resin/Plastic
Go to Company Ranking

Epoxy Resin Product ranking

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. <Embedding Resin> Epoxy Resin 'HERZOG EPO' [Free Sample] ハルツォク・ジャパン
  2. [Material] Bifunctional Epithioether Resin 'TBIS-AHSP' 田岡化学工業
  3. Acrylic rubber fine particle dispersion epoxy resin "Acryset BP Series"
  4. Cycloaliphatic epoxy "Difunctional Alicyclic Epoxy DCPD-DE" 日本材料技研
  5. 4 High purity & low chlorine epoxy resin for electronic applications

Epoxy Resin Product List

31～55 item / All 55 items

Displayed results
[Material] Bifunctional Epithioether Resin 'TBIS-AHSP'

[Material] Bifunctional Epithioether Resin 'TBIS-AHSP'

Can be used for coatings on various substrates, as well as sealing agents and adhesives for organic EL and LEDs!

This document provides information about the bifunctional episulfide resin "TBIS-AHSP." It introduces "general physical properties" such as appearance, odor, episulfide content, viscosity, and chemical substance control law. Additionally, it includes diagrams and images comparing low-temperature curing properties and high transparency with Bis-A type epoxy resins. Please take a look. [Contents] ■ General physical properties ■ Features ■ Applications *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Information] TBIS Series Products List

[Information] TBIS Series Products List

Introducing products that can be used as raw materials and modifiers for special resins (optical materials, electronic materials)!

This document includes information about the "TBIS series," such as bisphenol derivatives and acid anhydride derivatives. We introduce "epoxy resin," which features a special structure containing a fluorene skeleton, demonstrating excellent heat resistance and high transparency. Additionally, we also feature "episulfide resin," which has low odor specific to sulfur compounds and offers excellent transparency. [Contents] ■ Bisphenol derivatives ■ Acid anhydride derivatives ■ Epoxy resin ■ Episulfide resin ■ Acrylate *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Epoxy resin "EPOX MK R710/R1710"

Epoxy resin "EPOX MK R710/R1710"

Low viscosity, non-crystalline, low shrinkage, and good storage stability bisphenol E type epoxy resin!

Our company offers a special epoxy resin, 'EPOX MK R710/R1710', which is characterized by its difficulty in crystallization due to its asymmetric structure and excellent storage stability. In terms of cured properties, it is equivalent to Bis-A type and has a lower viscosity than Bis-F type, making it easy to work with and suitable for improving the filling of fillers and other materials. Additionally, it exhibits good weight change during heating and is a highly functional original epoxy resin from our company, especially in terms of long-term reliability. 【Features】 ■ Low viscosity ■ Non-crystalline ■ Low shrinkage ■ Excellent storage stability *For more details, please download the PDF or contact us.

  • Composite Materials
  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-performance epoxy resin "Alpron A Series"

High-performance epoxy resin "Alpron A Series"

We offer a lightweight filling type with a soft paste-like consistency, as well as adhesives for block construction methods and concrete molding repair agents!

Our company offers the high-performance epoxy resin "Alpron A Series." "A-1010/1010HS" is an extremely lightweight epoxy resin-based putty. It can be applied thickly to ceilings and walls without sagging or falling, and it has excellent moldability, making it easy to work with. In addition, we also offer the adhesive for block construction "A-105T/105TD," which demonstrates strong adhesion to concrete, cement mortar, iron, wood, glass, etc., and the concrete product molding repair agent "A-6050." 【Features of A-1010/1010HS】 ■ Both the base agent and hardener are lightweight, with a cured density of 0.7 ■ Can be applied thickly ■ Easy to mix the base agent and hardener in the required amounts ■ Excellent moldability and trowel cutting, providing great workability ■ Easy to nail and perform cutting processes *For more details, please refer to the PDF materials or feel free to contact us.

  • paint
  • Coating Agent
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
New Development Product: Two-Component Heat-Curing Epoxy Resin TE-7814V

New Development Product: Two-Component Heat-Curing Epoxy Resin TE-7814V

High thermal conductivity of 2.5 W/mK and high Tg of 185°C, this is a highly reliable low-viscosity epoxy resin suitable for thermal management of motors and coils.

"TE-7814V" is a two-component, heat-curing epoxy resin suitable for heat dissipation sealing applications in electronic and electrical equipment. Its low viscosity design allows it to accommodate complex component shapes, significantly improving workability and production efficiency. This product has a thermal conductivity of 2.5 W/m·K, making it effective for heat dissipation measures in electronic components that generate heat. It can be widely used in fields that require high performance, such as electronic devices and power modules. 【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Suitable for complex component shapes due to low viscosity - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices *For details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant epoxy resin liquid material 'VX-3657A/B'

High heat-resistant epoxy resin liquid material 'VX-3657A/B'

Adapted for high heat resistance! We provide liquid formulation materials used in power modules and more.

"VX-3657A/B" is a liquid epoxy resin formulation designed to meet the high heat resistance requirements associated with the advancement and miniaturization of electronic products. Due to its characteristics of high heat resistance, high fluidity, and low stress, it is applicable in power modules and similar applications. Additionally, because of its low linear expansion and low shrinkage rate, it is also used for high heat-resistant substrate encapsulation. 【Physical Property Data (Partial)】 ■ Curing Conditions ・100℃×1h + 180℃×2h ■ Glass Transition Temperature ・200℃ ■ Linear Expansion Coefficient α1 ・14ppm *For more details, please refer to the PDF document or feel free to contact us.

  • plastic
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Low viscosity, thick section casting high transparency epoxy resin GM-9050

Low viscosity, thick section casting high transparency epoxy resin GM-9050

Pouring and sealing - from the production of clear parts to completion.

- Epoxy resin suitable for thick casting (up to 5 cm) - Slow yellowing due to aging - Low viscosity with long flowability, and bubbles are less likely to remain at normal pressure - At room temperature (23°C), flowability decreases in 3 to 6 hours and hardens in 1 to 2 days - Curing speed can be adjusted with heat treatment (not exceeding 50°C)

  • plastic
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
New epoxy resin development <Sample available>

New epoxy resin development <Sample available>

We are developing products to respond flexibly to the individual needs of our customers. Please feel free to contact us first.

If you are currently having trouble with resin, please feel free to contact us. We want to increase manufacturing efficiency, so we hope for faster curing. We are developing products that meet customer requests as much as possible, such as wanting resins with properties like heat resistance and weather resistance. If you are looking for epoxy resins for applications like bonding, molding, or laminating but cannot find suitable off-the-shelf products, or if you are searching for alternatives due to the discontinuation of the products you are currently using, please do not hesitate to reach out to us.

  • Chemicals
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Low viscosity laminated epoxy resin ER-2181×EH-2182

Low viscosity laminated epoxy resin ER-2181×EH-2182

It is a low-viscosity, transparent epoxy resin for laminating. Due to its low viscosity, it is easy to apply and impregnate, and it undergoes initial curing overnight, with the cured material exhibiting heat resistance.

- The curing speed is fast, and if the temperature is above 10°C, initial curing will occur overnight (in 16 hours). - Compared to other resins, epoxy resin has better curing shrinkage, wettability, and mechanical strength. - Due to its low viscosity, application with brushes or rollers and impregnation into non-woven fabrics is easy. - By curing with heat at high temperatures, a more heat-resistant cured product can be obtained. - A transparent cured product is achieved. - It is a low yellowing type with good weather resistance. *Samples are available upon request.

  • Chemicals
  • Other polymer materials
  • glue
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
TE-7820FR3 for electronic devices

TE-7820FR3 for electronic devices

High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.

In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
TE-7820FR3 for semiconductors

TE-7820FR3 for semiconductors

High Tg, flame retardant, improved copper adhesion! Ideal for power device encapsulation.

In the semiconductor industry, particularly in fields that require high reliability, the performance of encapsulation materials for power devices is crucial. To withstand temperature changes and vibrations, and to ensure long-term reliability, excellent heat resistance, flame retardancy, and high adhesion to substrates are essential. TE-7820FR3 has been developed to address these challenges and enhance the performance and reliability of power devices. 【Application Scenarios】 - Power modules - Semiconductor packages 【Benefits of Implementation】 - Improved thermal, electrical, and mechanical performance - Assurance of long-term product reliability

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Market Report] Global Molding Materials Market

[Market Report] Global Molding Materials Market

The global molding materials market is expected to reach 17.16 billion USD by 2031.

The global molding materials market is expected to experience significant growth, with revenues reaching $10.6 billion in 2022. According to recent market research, the market is projected to expand at a compound annual growth rate (CAGR) of 5.5% during the forecast period from 2022. By 2031, it is estimated to ultimately reach $17.16 billion. Molding materials, known for their excellent properties, are versatile composites that are seeing increased demand across various industries, including automotive, electrical, industrial, electronics, and aerospace. Molding materials are composites formulated from a blend of silica, epoxy resins, phenolic resins, polyesters, pigments, and other additives. These compounds exhibit a range of properties such as high strength, heat resistance, corrosion resistance, and dimensional stability. As a result, molding materials are widely used in the manufacturing of parts and products that require durability, reliability, and precision. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Epoxy resin

Epoxy resin

This is an introduction to the epoxy resins handled by Sankyo Chemical Co.

If you have any questions regarding the explanation below, please feel free to contact us.

  • others
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Toughening and fatigue resistance improvement of epoxy resin and epoxy resin-based composites.

Toughening and fatigue resistance improvement of epoxy resin and epoxy resin-based composites.

Learn about the mechanisms for improving the toughness of composite materials using epoxy resin and enhancing the fatigue properties of epoxy resin!

Lecturer Professor Hajime Kishi, Department of Environmental Energy Engineering, Graduate School of Engineering, Hyogo Prefectural University (Formerly worked at Toray Industries, Inc. Composite Materials Research Laboratory) Target Audience: Company representatives interested in epoxy resins, composite materials, and CFRP Venue: Kawasaki City Educational and Cultural Center, Room 3【Kanagawa, Kawasaki City】 Access: 12-minute walk from JR or Keikyu Line Kawasaki Station Date and Time: November 30, 2011 (Wednesday) 13:00-16:30 Capacity: 30 people *Please apply early as there may be a rush of applications. Participation Fee: 【Early Bird Discount Price】46,200 yen (tax included, including text costs) for up to 2 people from one company *Limited to Tech-Zone members who apply by November 16. Membership registration is free. *After November 16, the regular price will be 49,350 yen (tax included, including text costs) for up to 2 people from one company.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical and Reference Books
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
What is epoxy resin?

What is epoxy resin?

Advanced materials with selectable characteristics such as transparency and flexibility! They have a three-dimensional mesh structure!

"Epoxy resin" is a type of engineering plastic classified as a thermosetting resin. Due to its cured structure having a three-dimensional network, it is known to be harder and more chemically stable compared to other common organic resins. The cured material has a good balance of heat resistance, adhesion, and insulation, and it is considered a cutting-edge material because properties such as transparency and flexibility can also be selected. [Features] ■ Classified as a thermosetting resin ■ Cured structure has a three-dimensional network ■ Cured material has a good balance of heat resistance, adhesion, and insulation ■ Properties such as transparency and flexibility can also be selected *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Epoxy resin 'EPOX MK SR35K/SR3542'

Epoxy resin 'EPOX MK SR35K/SR3542'

Rubber-modified solid epoxy resin with excellent film elongation and film-forming properties.

We offer a solid epoxy resin with improved flexibility and impact resistance, known as 'EPOX MK SR35K/SR3542', which is formulated with modified rubber. In addition to the rust prevention and chemical resistance properties of epoxy resin, it excels in film elongation and film formation due to rubber modification. Please feel free to contact us if you have any inquiries. 【Basic Physical Properties】 ■Flexural Strength: 114 MPa ■Flexural Modulus: 4890 MPa ■Growth Rate: 20% ■TG: 94℃ *For more details, please download the PDF or contact us.

  • Composite Materials
  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
General-purpose potting resin TE-6302 low viscosity/high strength product

General-purpose potting resin TE-6302 low viscosity/high strength product

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

  • スクリーンショット 2021-06-16 163558.jpg
  • Other polymer materials
  • Other consumables
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Inspection jigs and model epoxy resin Teradite

Inspection jigs and model epoxy resin Teradite

These are epoxy resin products that can be used for inspection jigs and models. They include gel coats, backing, casting, laminating, workable resins, release agents, and more.

This is a list of our company's brand epoxy resin "Teradite" for two-component mixed epoxy resin used for tooling. It is usually in stock, so you can purchase it in small quantities. *Contents of the document* ■ For vacuum, pressure, and RIM molding surface gel coat ■ For heat-resistant laminating and heat-resistant backing ■ For general casting for pattern models and jigs ■ For gel coat for precision inspection jigs ■ For sand backing and laminating (available for summer and winter) ■ Workable resin for master models ■ Release agent (MO-7) For more details, please check the "PDF Download" at the bottom.

  • Other polymer materials
  • Resin mold
  • plastic
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Other electronic parts
  • glue
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
TE-7814V for semiconductor packaging

TE-7814V for semiconductor packaging

Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.

In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
TE-7814V for Robot Precision Equipment

TE-7814V for Robot Precision Equipment

Improving the reliability of robotic precision equipment with high thermal conductivity and high Tg.

In the robot precision equipment industry, high operational accuracy and long lifespan are required. In particular, precise electronic components face the risk of performance degradation and failure due to heat generation. The TE-7814V addresses these issues with its high thermal conductivity, enhancing the reliability of the equipment. 【Application Scenarios】 - Electronic circuit boards for precision robots - Sensor modules - Actuators 【Benefits of Implementation】 - Suppression of malfunction due to thermal runaway - Extension of equipment lifespan - Achievement of stable operation

  • Other polymer materials
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Research Material] Global Market for Epoxy Resin E-44

[Research Material] Global Market for Epoxy Resin E-44

World Market for Epoxy Resin E-44: Single Component, Two Component, Multi Component, Paints & Coatings, ...

This research report (Global Epoxy Resin E-44 Market) investigates and analyzes the current status and outlook for the global market of epoxy resin E-44 over the next five years. It includes information on the overview of the global epoxy resin E-44 market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include single-component, two-component, and multi-component, while the segments by application focus on paints & coatings, composites, and construction. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of epoxy resin E-44. It also includes the market share of major companies in the epoxy resin E-44 sector, product and business overviews, and sales performance.

  • Other services
  • Epoxy Resin

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Related Categories of Epoxy Resin

IPROS Services
COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.