Suntex Co., Ltd. List of Products and Services

Features ■ NXP i.MX 6 Family, equipped with ARM Cortex-A9 processor ■ Dedicated 2D/3D graphics processor ■ Wi-Fi add-on module; up to 28 GPI/Os; CAN Bus ■ Onboard DDR3L up to 2GB ■ OS Linux/Yocto/Android ■ Operating temperature -40 to 85℃ ■ Dimensions 110 x 86.5 mm (4.5” x 3.7”)

Features ■ Equipped with i.MX 6Solo/6DualLite/6Dual/6Quad/6Quad/6Dual processors ■ Onboard DDR3L up to 2GB ■ miniPCI-e slot; CAN Bus; Wi-Fi add-on module ■ Dedicated 2D/3D graphics processor ■ OS: Linux ■ Operating temperature: 0 to 70°C ■ 80 x 67 mm (3.15” x 2.64”)

Features ■ Equipped with NXP i.MX6SX SoloX, Single core Cortex-A9 @1GHz + Cortex-M4 core @227MHz processor ■ Integrated graphics Vivante GC400T, 2D and 3D HW accelerators ■ Up to 2x FastEth; optional WiFi + BT LE ■ Onboard DDR3L up to 1GB ■ OS Linux/Yocto ■ Operating temperature -40 to 85℃ ■ 89.5 x 87 mm (3.52” x 3.43”)

Features ■CPU i.MX 8QuadMax: 2x ARM Cortex-A72 + 4x ARM Cortex-A53 + 2x Cortex-M4F i.MX 8QuadPlus: 1x ARM Cortex-A72 + 4x ARM Cortex-A53 + 2x Cortex-M4F ■Supports 2x Gigabit Ethernet interfaces ■Equipped with 2x graphic accelerators: Vivante GC7000/XSVX, GC7000Lit EVSX QuadMax and QuadPlus ■Onboard LPDDR4-1600 up to 8GB ■OS: Wind River Linux/Yocto/Android ■Operating temperature: -40 to 85℃ ■146 x 102 mm (5.75” x 4.02”)

Features ■CPU NXP i.MX 8X family SoCs: Dual or Quad ARM Cortex-A35 Cores + 1x Cortex M4F core for real-time processing • NXP i.MX8 QuadXplus, 4x ARM Cortex-A35 Cores + 1x Cortex M4F core for real-time processing • NXP i.MX8 DualXplus, 2x ARM Cortex-A35 Cores + 1x Cortex M4F core for real-time processing ■2x GbE; miniPCI-e slot; 1x USB3.0; 2x USB 2.0; expansion header ■GC7000Lite with up to 16 execution units ■onboard LPDDR4-1200 up to 4GB ■OS Linux ■Operating temperature -40 to 85℃ ■146 x 102 mm (3.5” form factor)

Features ■ NXP i.MX 8M Family, based on ARM Cortex-A53 MPCore + Cortex-M4 core platform ■ Integrated graphics Vivante GC400T, 2D and 3D HW accelerators ■ WiFi AC/a/b/g/n + BT LE 5; M.2 WWAN slot; M.2 modem micro SIM slot ■ Onboard DDR3L up to 2GB ■ OS Linux/Android ■ Operating temperature -40 to 85°C (only for boards without WiFi module) ■ Dimensions: 101.6 x 147 mm (4” x 5.78”)

Features ■ NXP i.MX 8M Mini Family equipped with Arm Cortex-A53 cores + general purpose Cortex-M4 400MHz processor ■ Supports GC320 2D graphics accelerator + GCNanoUltra 3D 2D graphics accelerator ■ Up to 2x GbE; optional Wi-Fi; up to 2x RS-232 or RS-485 or CAN; optional LTE Cat4 modem with SIM slot or eSIM ■ Onboard LPDDR4-3000 up to 4GB ■ Supports LVDS Single/Dual channel, eDP, MIPI-CSI camera connector ■ Compatible with OS Yocto/Android ■ Operating temperature -40 to 85℃ ■ Dimensions 146x102 mm (3.5” form factor)

Features ■ Processor based on NXP i.MX 6 Family with ARM Cortex-A9 cores ■ GC320 & GC355 2D accelerator + GC2000 3D accelerator ■ 2x 100MbE, up to 3x USB, 2x RS232, RS485, CAN ■ Onboard 1GB DDR3L ■ LVDS Single/Dual Channel connector, HDMI interface, 1x CAN (ISO/DIS 11898) ■ eMMC: 4 GB MLC, SD slot: 4 bit MMC/SDIO/SD/SDHC ■ 2x 100Mb Ethernet mPCIe (half size) socket for modems or WiFi/BT ■ 1x USB 2.0 OTG micro-AB, up to 2x USB 2.0 Type-A ■ 2x RS-232, RS-485, 1x speaker (connector) ■ OS Yocto ■ Size 159x18x80mm

Features ■ NXP i.MX 6 Family, equipped with ARM CORTEX-A9 processor ■ GC320 2D accelerator + GC880 3D accelerator ■ 1x 100MbE, 2x USB, 2x RS232, RS485, CAN ■ onboard 1GB LPDDR4 ■ 2D graphics accelerator ■ OpenGL ES 2.0 3D graphics accelerator with a shader ■ 18-bit parallel RGB interface ■ 1x 100MbEthernet, 1x USB 2.0 OTG micro-AB, 1x USB 2.0 Type-A ■ 1x speaker (connector), 2x RS-232, RS-485, 1x CAN (ISO/DIS 11898)

Features ■ Rockchip RK3399, ARM Cortex-A72 ■ 4-Core Mali-T860MP4 GPU ■ Onboard LPDDR4 up to 4GB ■ OS Linux Yocto/Android ■ Operating temperature -20 to 85℃ ■ Dimensions: 146 x 102 mm (3.5” form factor)

Features ■ AMD Ryzen Embedded V1000 and R1000 processors ■ AMD Radeon Vega GPU with up to 11 Compute Units ■ 2x GbE; M.2 WWAN and WLAN slots; 2x USB3.0; 2x USB 2.0; 8x GPI/Os ■ 2x DDR4-2400 ECC maximum 32GB ■ OS Win10/Linux Ubuntu ■ Operating temperature -40 to 85℃ ■ Dimensions: 146 x 102 mm (3.5” form factor)

Features ■ NXP i.MX 6 Family, based on ARM CORTEX-A7 processor: i.MX6ULL 792 MH ■ onboard 512MB DDR3L ■ 24-bit parallel RGB interface ■ 1x 100MbE, 2x USB, RS232, RS485, CAN ■ Operating temperature 0 to 60°C ■ 113.0 x 18.0 x 47.0 mm

Features ■ NXP i.MX 6 Family, ARM Cortex-A9 ■ onboard 1GB DDR3L ■ LVDS Single/Dual Channel connector ■ HDMI interface ■ 1x 100MbE, up to 2x USB, 2x RS232, RS485, CAN ■ Operating temperature 0 to 60°C ■ 159.0 x 18.0 x 80.0 mm

Features ■ NXP i.MX 6 Dual up to 1 GHz; based on ARM Cortex-A9 cores ■ onboard 2GB DDR3L ■ 100MbE, USB, RS232, CAN, MDB ■ GC320 & GC355 2D accelerator + GC2000 3D accelerator ■ LVDS Single/Dual Channel connector ■ HDMI interface ■ Operating temperature 0～60℃ ■ 160.0 x 18.0 x 95.0 mm

Features ■ N-series Intel Pentium and Celeron SOCs ■ Integrated Graphics, three independent display support ■ 2x GbE; CIR sensor; 8x GPI/Os ■ 2x DDR3L-1600 maximum 8GB ■ OS Win10/8.1/7/Linux/Yocto ■ Operating temperature 0 to 60°C ■ 101.6 x 101.6 mm (4” x 4”)

Features ■ Intel Atom X Series, Intel Celeron J/N Series, and Intel Pentium N Series ■ 2x GbE; M.2 WWAN and WLAN slots; CIR sensor; 2x I2C; 8x GPI/Os ■ Integrated Intel HD Graphics 500 series controller ■ Onboard LPDDR4 up to 8GB ■ OS Win10/Yocto/Linux ■ Operating temperature -40 to 85℃ ■ 101.6 x 101.6 mm (4” x 4”)

Features ■ Rockchip PX30 processor, 4x Cortex-A35 cores ■ Mali-G31 GPU ■ 10/100 Ethernet; 4x USB 2.0 ports; M.2 Key E Slot for WiFi + BT modules; miniPCI-e slot for modems; up to 2x RS-232 + 1x RS-485 + 1x CAN + 4x UARTs ■ onboard DDR3L up to 4GB ■ OS Linux Yocto/Android ■ Operating temperature -20 to 85℃ ■ Dimensions: 146 x 102 mm (3.5” form factor)

Features ■ NXP i.MX 8M Mini Family ■ Wifi/BT, 1x GbE, up to 2x USB 2.0, HDMI, Mini PCIe ■ GC320 2D accelerator + GCNanoUltra 3D accelerator ■ Onboard LPDDR4 up to 8GB ■ OS Win10 IoT/Debian/Yocto/Android ■ Operating temperature -40 to 85℃ ■ 95.0 x 73.0 x 20.0 mm

Features ■NXP i.MX 8M Mini Family ■Wifi/BT, 1x GbE, 1x 100MbE, up to 3x USB, 2x RS232, RS485, CAN ■GC320 2D accelerator + GCNanoUltra 3D accelerator ■on Board LPDDR4 memory ■Operating temperature 0 to 60°C ■159.0 x 18.0 x 80.0 mm

Features ■ AMD Ryzen Embedded V1000B family ■ GPU AMD Radeon VEGA with up to 8 Compute Units, DirectX 12 supported H.265 (10-bit) decode and 8-bit video encode, VP9 decode, 4 independent displays supported ■ 1x GbE; 2x USB3.0; 2x USB3.1 Gen2; Slot M.2 Socket 1 Key E 2230 for optional Wi-Fi/BT combo ■ 2x DDR4-2400 ECC, maximum 32GB ■ OS Win10/Linux ■ Operating temperature 0 to 70°C ■ Size 120x120mm

Features ■ NXP i.MX 6 Family, equipped with ARM CORTEX-A9 processor ■ 1x 100MbE, 2x USB, RS232, RS485, CAN ■ GC320 2D accelerator + GC880 3D accelerator ■ onboard 1GB DDR3L ■ Operating temperature: 0°C to 60°C ■ Dimensions: 113.0 x 18.0 x 47.0 mm

Features ■ Intel 8th gen. Core/Xeon and 9th gen. Core/Xeon/Pentium/Celeron CPUs ■ 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 port (PCI-e x16 mechanical slot); VPU High Speed Connector with 4x USB 3.1 + 2x PCI-ex4 ■ Intel UHD Graphics 630/P630 architecture, supports up to 3 independent displays ■ 2x DDR4-2666/4x DDR4-2444 ECC maximum 128GB ■ Supported OS: Win10/Linux ■ Operating temperature: -40 to 85℃ ■ Dimensions: 170x170 mm

Features ■ Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors ■ 2x GbE with precision time protocol IEEE 1588, M.2 WWAN and WLAN slots, dual SuperSpeed USB 10Gbps Standard-A connector ■ Integrated Intel Gen11 UHD Graphics controller, up to 32 Execution Units ■ Onboard LPDDR4-3200 up to 16GB ■ Dimensions: 100 x 72 mm (3.93” x 2.83”)

Features ■ Intel Atom X Series, Intel Celeron J / N Series, and Intel Pentium N Series (formerly Apollo Lake) processors ■ 2x GbE; M.2 WWAN and WLAN slots; 8x GPI/Os ■ Integrated Intel HD Graphics 500 series controller with up to 18 Execution Units ■ Up to 8GB LPDDR4 memory ■ Dimensions: 100 x 72 mm (3.93” x 2.83”)

Features ■ Intel Atom E3800 family (formerly Bay Trail) SoCs ■ 1x DDR3L-1333 ECC up to 8GB ■ Integrated Intel HD Graphics controller ■ 2x GbE; Half miniPCI-e slot; 8x GPI/Os ■ Dimensions: 72 x 100 mm (2.83” x 3.93”)

Features ■AMD Embedded G-Series SoC ■1xDDR3-1600 up to 8GB ■Embedded AMD HD RADEON GPUs - HD8000 series ■Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V ■Dimensions: 72 x 100 mm (2.83” x 3.94”)

Features ■ Intel Xeon D-1700 processors ■ 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI ■ Up to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC, up to 128GB

Features ■ 8th Gen Core/Xeon (Coffee Lake) & 9th Gen Core/Xeon/Celeron CPUs (Coffee Lake Refresh) ■ Gigabit Ethernet, 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel UHD Graphics 630/P630 architecture, up to 48 Execution Units ■ Two DDR4 SO-DIMM Slots supporting DDR4-2666 ECC Memory, up to 64GB

Features ■ 8th generation Intel Core and Celeron 4000 series processors (formerly Whiskey Lake) with 15W TDP ■ 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Intel UHD Graphics 620 / 610 ■ 2×DDR4 SO-DIMM slots (supports up to 64GB of DDR4-2400 memory)

Features ■ COM Express Basic Size Type 6 ■ Intel 6th and 7th Generation Core/Xeon CPU ■ 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel HD Graphics 530/P530/630/P630 ■ 2x DDR4 So-DIMM slots

Features ■ COM Express Basic Size Type 6 ■ Intel Haswell family CPU ■ 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Integrated Intel HD Graphics 4600 ■ 2x DDR3L-1600 maximum 16GB

Features ■ COM Express 3.0 Basic Size Type 6 ■ Intel Atom X, Intel Celeron J/N, Intel Pentium N series processors ■ 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Intel HD Graphics 500 series controller with up to 18 execution units ■ 2x DDR3L SO-DIMM slots (supports DDR3L-1866 non-ECC memory)

Features ■ Compatible with COM Express Compact Type 6 ■ Intel Atom E3800 and Celeron family (formerly Bay Trail) ■ 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Intel Integrated HD Graphics 4000 series controller ■ 2x DDR3L SO-DIMM slots (up to 8G)

Features ■ COM Express R3.0 Type 7 Basic equipped with AMD EPYC Embedded 3000 ■ 4x USB 3.1; 24x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Supports up to 128GB of ECC DDR4-2666 memory with 4 DDR4 SO-DIMM slots

Features ■ Embedded Ryzen V Series V2000FP6 platform equipped with "Zen2" CPU and Radeon GPU core ■ 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen3 ■ Integrated AMD Radeon GPU with up to 7 computing units ■ Two DDR4 SO-DIMM slots supporting up to 64GB of DDR4-3200 ECC and non-ECC memory ■ Adopts COM Express Compact Type 6 module

Features ■ Adopts COM Express Compact Type 6 module ■ 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Supports AMD Radeon Vega GPU DirectX 12 with up to 11 computing units ■ Supports up to two DDR4 SO-DIMM slots for DDR4-3200 ECC memory

Features ■ Adopts COM Express Compact Type 6 module ■ 4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3 ■ Equipped with AMD Radeon Vega GPU with three computing units ■ Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory

Features ■ AMD built-in 3rd generation R series SOC or G series SOC-I ■ 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ AMD Radeon 3rd -Generation Graphics Core Next (GCN) ■ Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

Features ■ Equipped with NXP i.MX 8 application processor ■ 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; supports boot select signal ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-3200 memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

Features ■ Equipped with NXP i.MX 8M application processor ■ Supports 1x USB 3.0; 4x USB 2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-2400 memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

Features ■ Equipped with single-core, dual-core, and quad-core (ARM Cortex-A9 core) ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard DDR3L with a maximum of 2GB memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto

Features ■ Equipped with single and dual-core Lite (ARM Cortex A9 core) ■ Supports Fast Ethernet; GPI/O ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard with up to 1GB DDR3L memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto

Features ■ Supports NXP i.MX 8M Mini Family / i.MX 8M Nano Family ■ Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2 x UART; optional CAN; 5 x USB 2.0; supports 1 PCI-e x1 ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard DDR4-2400 with a maximum of 4GB memory ■ Operating temperature 0 to 60℃ (optional: -30℃ to 85℃) ■ Dimensions: 40 x 70 mm (μQseven, 1.57” x 2.76”) ■ OS Linux/Yocto

Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

Features ■ Equipped with NXPi.MX8M application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, 2x USB 3.0 ■ Integrated GPU that supports multi-display ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android