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  3. Suntex Co., Ltd.
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Suntex Co., Ltd.

EstablishmentSeptember 1985
number of employees6
addressShizuoka/Izunokuni-shi/151-1 Jike
phone055-944-6600
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last updated:Mar 05, 2024
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DFI Industrial Embedded PC DFI Industrial Embedded PC
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SECO Industrial CPU Board SECO Industrial CPU Board
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AAEON industrial CPU board AAEON industrial CPU board
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DFI

DFI Industrial Embedded PC

Founded in 1981, DFI (Taiwan) is a global company that provides high-performance computing technology across the entire industrial PC industry. With DFI's innovative designs and excellent quality management systems, DFI's industrial-grade solutions optimize the embedded systems used by customers in a wide range of markets, including automation, medical, gaming, transportation, and energy, ensuring high reliability, long product life cycles, and durability.

12th Generation CPU Equipped Industrial Embedded Compact PC EC500-ADS

DFI, equipped with 12th generation CPU, supports extended temperature range, fanless operation, designed for modular embedded systems, supports 5G communication.

Features ■ Width 255.3 × Height 85 × Depth 224 mm ■ Weight (kg) 4.15 kg ■ Equipped with 12th generation CPU LGA 1700 Socket ■ 2 x DDR4 3200MHz SODIMM (up to 64GB) ■ Supports up to 4K with 3 independent display outputs (1 VGA + 2 HDMI/DP++ *auto detection) ■ 2 x GbE (RJ-45), 4 x USB 3.1 (type A), 2 x USB 2.0 (type A) ■ 6 COM (DB-9), 4 x USB 3.1 (type A), 2 x USB 2.0 (type A), 2 x GbE (RJ-45), 4 x Antenna ■ Operating temperature range -20 to 70°C (for SSD or M.2 storage) ■ Mounting method compatible with Wall Mount ■ Compatible with Windows 10 IoT Enterprise 2021 LTSC, Linux

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Atom E3900 Series Industrial Embedded PC EC700-AL

DFI, IP69K rated waterproof performance, compatible with Intel Atom E3900 series, extended temperature range, fanless operation, compact and rugged design.

Features ■ Width 217 × Height 188 × Depth 87 mm ■ Weight (kg) 4.5 kg ■ Intel Atom Processor E3900 Series ■ 4GB DDR3 Memory (Onboard) ■ Supports up to 4K resolution, independent display output (1 x HDMI or VGA) ■ Compact and highly durable, IP67/IP69K rated enclosure ■ 1 x Full-size Mini PCIe, 1 x Full-size Mini PCIe, 1 x M.2 2230 (USB2.0/PCIe) expansion slots ■ 2 COM and 2 CAN, 2 Intel GbE, 2 USB3.0, 4 x Antenna, 1 x SIM ■ Wide DC input 9–36V ■ Operating temperature range -40 to 70°C (only for E3950, E3940, E3930)

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9th/8th Generation CPU Edge AI Computer EC300-CS

DFI, equipped with 9th/8th generation CPU, AI Accelerated computing, for embedded systems, compact and fanless operation.

Features ■ Width 340.5 × Height 132 × Depth 223 mm ■ Weight (kg) 9.85 kg ■ Equipped with Coffee Lake 9th/8th generation CPU ■ Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■ AI Accelerated computing ■ Supports up to 150W GPU MXM module ■ Supports 4 x 802.3af 15W PoE ports, up to 15.4W ■ Supports maximum resolution of 4K with 3 independent display outputs (1 x VGA, 1 x HDMI, 1 x DP++) ■ 1 x Half-size Mini PCIe, 2 x Full-size Mini PCIe, 1 x M.2 B key 3042, 3052, 1 x M.2 2280 M key 2242, 2260 & 2280 expansion slots ■ 2 x RJ45 GbE, 2 x High speed full RS-232/422/485 (DB-9), 2 x RS-232/422/485 (onboard), 2 x USB 2.0 supported

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EC180-CS Industrial Embedded PC with AI Support, 9th/8th Generation CPU

DFI, equipped with 9th/8th generation CPU, AI Accelerated computing, supports 5G communication, compact and fanless operation.

Features ■ Width 250 × Height 180 × Depth 76 mm ■ Weight (kg) 5 kg ■ Equipped with 9th/8th generation CPU ■ 1 DDR4 2400/2666MHz (up to 64GB) ■ AI Accelerated computing ■ Supports up to 60W GPU MXM module ■ Maximum resolution 4K compatible with 5 independent display outputs (4 x DP, 1 x DP/HDMI) ■ 2 x RS232/RS422/RS485, 4 x GbE, 4 x USB 3.1 Gen2, 4 x SMA for 5G module, 2 x SMA for WiFi module ■ M.2 M key 2242/2280 slot H310: PCIe Gen2 x1 Q370: PCIe Gen3 x4, SATA3.0 ■ M.2 B key 3052 slot H310: SATA 3.0 Q370: PCIe Gen3 x1, USB 3.2 Gen1 ■ M.2 E key 2230 slot H310: USB 2.0, PCIe Gen2 x1 Q370: USB 2.0, PCIe Gen3 x1

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DT200-CS Industrial Embedded PC with AI Support, 9th/8th Generation CPU

DFI, equipped with 9th/8th generation CPU, AI accelerated computing, supports 5G communication, slim design.

Features ■ Width 320 × Height 220 × Depth 87 mm ■ Weight (kg) 5 kg ■ Compatible with Intel Core i7-9700E/i7-9700TE/i5-9500E/i5-9500TE/i3-9100/i3-9100TE/i7-8700/i7-8700T/i5-8500/i5-8500T/i3-8100/i3-8100T/Intel Pentium G5400/Intel Celeron G4900 Processor ■ 1 DDR4 2400/2666MHz (up to 64GB) ■ AI Accelerated computing ■ Supports up to 115W GPU MXM module ■ Supports maximum resolution of 4K with 5 independent display outputs (4 x DP, 1 x HDMI) ■ 1 x M.2 M key supports 2242/2280, 1 x M.2 E key supports 2230 ■ 1 x M.2 B key supports 3052 5G cellular module ■ Compatible with Windows 10 IoT Enterprise 64-bit, Linux

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Ryzen Embedded R1000 Ultra Compact PC EC90A-GH

Equipped with Ryzen Embedded R1000, Radeon Vega 3 Graphics, fanless operation, supports palm-sized form factor.

Features ■ Width 112.29 × Height 80 × Depth 56.2 mm ■ Weight (kg) 700g ■ Equipped with AMD Ryzen Embedded R1000 series ■ DDR4 memory reduced to a maximum of 4GB/8GB ■ Single Channel DDR4 2400MHz ■ Built-in graphics functionality of Radeon Vega 3 Graphics ■ 1 x Full-size Mini PCIe expansion slot ■ Supports maximum resolution 4K with 2 independent display outputs (2 x Micro HDMI) ■ 1 x GbE, 1 x USB 3.1 Gen2, 2 x Micro HDMI 1.4 ■ (Option 1) Supports 1 x 8-bit DIO, 1 x SMBus, (Option 2) 2 x RS-232 ■ Compatible with Windows 10 IoT Enterprise 64-bit, Linux

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Elkhart Lake CPU Embedded PC ED700-EHL

DFI, compatible with Intel Atom x6000 series, extended temperature support, fanless operation, supports 5G Sub-6 module.

Features ■ Width 72 × Height 172 × Depth 118.2 mm ■ Weight (kg) 1.5 kg ■ Intel Atom x6000 Series, Intel Celeron J6412/J6413 ■ 4GB/8GB DDR4 Memory (onboard) + One DDR4 SODIMM (up to 32GB) ■ 1 independent display output (1 x VGA) ■ 1 x M.2 2230 (USB/PCIe), 1 x M.2 3042/3052 (USB 3.0/PCIe) (with dual SIM) expansion slot ■ 4 x GbE (RJ-45), 2 x RS-232/422/485, 2 x COM, 4 x USB 3.1, 2 x USB 2.0 ■ Wide DC input 9–36V ■ Supports extended temperature -40–60°C (supported by Intel Embedded Series)

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Atom E3900 series embedded PC for automotive EC700-AL

DFI, for in-vehicle use, compatible with Intel Atom E3900 series, extended temperature support, fanless operation, compact and rugged design.

Features ■ Width 180 × Height 33 × Depth 127.8 mm ■ Weight (kg) 700g ■ Intel Atom Processor E3900 Series ■ DDR3L-1866 memory (onboard) + 1 SODIMM (up to 8GB) ■ Maximum 4K resolution support, independent display output (1 DP/HDMI combo + 1 DP/VGA) ■ 1 x Full-size mSATA, 1 x Full-size Mini PCIe, 1 x M.2 (2230 E Key) expansion slot ■ 4 COM and 4 Intel GbE + 2 USB or 2 Intel GbE + 4 USB ■ Wide DC input 9–36V ■ Operating temperature range -40–70°C

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Atom E3900 Series Embedded PC for Automotive VC230-AL

DFI, for automotive use, compatible with Intel Atom E3900 series, E-mark (E13) certification, extended temperature support, fanless operation.

Features ■ Width 180 × Height 50 × Depth 121.2 mm ■ Weight (kg) 1 kg ■ Intel Atom Processor E3900 Series, BGA 1296 ■ 1 DDR3L 1600/1866MHz SODIMM (up to 8GB) ■ Maximum 4K resolution support, 2 independent display outputs (1 x HDMI, 1 x DVI-I) ■ 1 x Full-size Mini PCIe, 1 x Full-size Mini PCIe, 1 x Half-size Mini PCIe expansion slots ■ 1 x CAN 2.0, 2 x GbE (RJ-45), 1 x RS-232/422/485 (DB9-M), 2 x USB 2.0 (type A), 2 x USB 3.0 ■ Wide DC input 9–48V ■ Operating temperature range -40 to 70°C

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11th Generation CPU Industrial Embedded Compact PC EC70A-TGU

DFI, for embedded systems, Tiger Lake 11th generation Intel Core processor, fanless feature, palm-sized.

Features ■ Width 181.6 × Height 57 × Depth 118.4 mm, 1.23 liters ■ 11th generation Tiger Lake Core i7/i5/i3 CPU, fanless operation ■ 8GB DDR4 onboard + DDR4 SODIMM x 1 (up to 32GB) ■ 3 display outputs: 2 HDMI (4k@30Hz), 1 VGA (2K@60Hz) ■ 2 M.2 expansion slots (5G compatible M.2 Bkey 3042/5052 5G-NR module) ■ GPU: Intel Iris Xe Graphics for i7/i5 processors, Intel UHD Graphics for i3/Celeron processors ■ 1 M.2 2280 M key (PCIe x4) NVMe SSD ■ Rich I/O: 4/3/2 GbE, 6/4/2 USB3.1, 4 COM (1 DIO) ■ Extended temperature support -20 to 60°C (when equipped with extended temperature SSD) ■ Wide DC input 9 to 36V

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7th/6th Generation CPU Industrial Fanless Compact PC EC70A-SU

DFI, designed for embedded systems, equipped with 7th/6th generation Intel Core processors, featuring fanless functionality, and compatible with palm-sized dimensions.

Features ■ Width 181.6 × Height 57 × Depth 118.4 mm ■ Fanless 7th/6th generation Intel Core i7/i5/i3 CPU ■ 2 x GbE (RJ-45), 4 x COM, 4 x USB 3.0 (type A), 1 x HDMI, 1 x VGA ■ 1 x Full-size Mini PCIe, 1 x Half-size Mini PCIe ■ Wide power supply 15~36V ■ Operating temperature -20 to 60℃ (extended temperature SSD/RMA use, with airflow) ■ Supports Windows 7 (32/64-bit), Windows 8.1 (64-bit), Windows 10

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Industrial Embedded Compact PC EC543-CS with 9th/8th Generation CPU

DFI, equipped with 9th/8th generation CPU, extended temperature support, fanless operation, designed for embedded systems with modular design, supports 4 PoE.

Features ■ Width 255.3 × Height 195 × Depth 224 mm ■ Weight (kg) 5.4 kg ■ Equipped with 9th/8th generation CPU LGA 1151 Socket ■ 2 x 260-pin DDR4 2400/2666MHz SODIMM (up to 64GB) ■ Supports up to 4K with 3 independent display outputs: 1 VGA + 2 HDMI/DP++ (auto detection) ■ EC543-CS6G86E-Q: 2 x GbE (RJ-45), 4 x PoE, 4 x USB 3.1 (Gen.2), 2 x USB 2.0 ■ EC543-CS6G86-Q: 6 x GbE (RJ-45), 4 x USB 3.1 (Gen.2), 2 x USB 2.0 ■ EC543-CS6881-Q: 2 x GbE (RJ-45), 4 x USB 3.1 (Gen.2), 2 x USB 2.0 ■ EC543-CS98A1-Q: 2 x GbE (RJ-45), 4 x USB 3.1 (Gen.2), 4 x USB 3.1 (Gen.1) ■ Compatible with Windows 10 IoT Enterprise 64 Bit and Linux

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Fanless Edge AI Computer for Railways RC300-CS

DFI, equipped with 9th/8th generation CPU, AI Accelerated computing, fanless operation, certified to railway standard EN50155.

Features ■ Width 340.5 × Height 132 × Depth 223 mm ■ Weight (kg) 9.85 kg ■ Equipped with Coffee Lake 9th/8th generation CPU ■ Chipset Intel Q370 Chipset ■ Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■ AI Accelerated computing ■ Supports up to 115W GPU MXM module ■ Supports 4 x 802.3af 15W PoE ports, up to 15.4W ■ Supports maximum resolution of 4K with 3 independent display outputs (1 x VGA, 1 x HDMI, 1 x DP++) ■ 1 x Half-size Mini PCIe, 2 x Full-size Mini PCIe, 1 x M.2 B key 3042, 3052, 1 x M.2 2280 M key 2242, 2260 & 2280 expansion slots ■ Supports 2 x RJ45 GbE, 2 x RS-232/422/485 (DB-9), 4 x USB 3.0, 2 x USB 2.0 ■ Mounting method Wall Mount

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Fanless Edge AI Computer for Automotive VC300-CS

DFI, equipped with 9th/8th generation CPU, AI Accelerated computing, fanless operation, supports extended temperature range.

Features ■ Width 340.5 × Height 132 × Depth 223 mm ■ Weight (kg) 9.85 kg ■ Equipped with Coffee Lake 9th/8th generation CPU ■ Chipset Intel Q370 Chipset ■ Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■ Supports up to 150W GPU MXM module ■ Supports 4 x 802.3af 15W PoE ports, up to 15W ■ Maximum resolution 4K compatible with 3 independent display outputs (1 x VGA, 1 x HDMI, 1 x DP++) ■ 1 x Half-size Mini PCIe, 2 x Full-size Mini PCIe, 1 x M.2 B key 3042, 3052, 1 x M.2 2280 M key 2242, 2260 & 2280 expansion slots ■ Supports 2 x RJ45 GbE, 2 x High speed full RS-232/422/485 (DB-9), 2 x RS-232/422/485, 4 x USB 3.0, 2 x USB 2.0 ■ Mounting method Wall Mount

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10th Generation CPU Equipped Embedded PC for Automotive VC500-CMS

DFI, Comet Lake 10th generation CPU, E-Mark R10 certification, fanless operation, supports extended temperature.

Features ■ Width 235 × Height 87.5 × Depth 221 mm ■ Weight (kg) 5.5 kg ■ Equipped with Comet Lake 10th generation CPU ■ Chipset Intel Q470E/W480E/H420E Chipset ■ 2 Channel DDR4 (up to 64GB) ■ 2 x swappable 2.5" SATA, 1 x M.2 2280 M Key (2242, 2260, 2280, NVME SSD) ■ Supports 4 x 802.3af 15W PoE ports (up to 15.4W) or 2 x 10G SFP+ ports ■ Maximum resolution 4K support with 3 independent display outputs (1 x HDMI, 2 x DP) ■ Wide DC input 9–50V, controlled by ignition key ■ Compatible with Windows 10 IoT Enterprise RS5, Linux Ubuntu 20.04

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10th Generation AI, Embedded PC for Automotive VC500-CMS-MXM

DFI, Comet Lake 10th generation CPU, E-Mark certification, extended temperature, supports wide power supply, AI accelerated

Features ■ Equipped with Comet Lake 10th generation CPU ■ Chipset: Intel Q470E/W480E/H420E Chipset ■ 2 Channel DDR4 (up to 64GB) ■ 2 x swappable 2.5" SATA, 1 x M.2 2280 M Key (2242, 2260, 2280) ■ Supports 4x 802.3af 15W PoE ports (up to 15.4W) ■ Wide DC input 9–48V, controlled by ignition key ■ Compatible with Windows 10 IoT Enterprise RS5 and Linux Ubuntu 20.04

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NXP i.MX8M equipped industrial vehicle PC VC900-M8M

Equipped with NXP i.MX8M, introduced xCarbon, fanless design, supports extended temperature range, built-in 6-axis IMU, supports 1 CAN and 4x COM.

Features ■ Width 220 × Height 122 × Depth 43 mm ■ Weight (kg) 1.9 kg ■ Equipped with NXP i.MX8M ■ 2GB/4GB LPDDR4 onboard ■ Built-in 6-axis IMU (3 Accelerometers + 3 Gyroscopes) ■ Introduction of VicOne's automotive network security solution - xCarbon ■ Supports maximum resolution of 4K with 3 independent display outputs (1 x VGA, 1 x HDMI, 1 x DP++) ■ 1 x M.2 2242/3042 B Key, 1 x M.2 2230 E Key expansion slots ■ Supports 1 GbE, 4 COM, 1 CAN Bus, 2 USB 3.0, 1 Micro USB ■ Supports extended temperature range of -20 to 70°C ■ Supports wide DC input of 9~36V (ACC/IGN function) ■ Mounting methods: DIN-Rail Mount, Wall Mount ■ Compatible with Yocto Linux 2.5, Android 9.0 (optional)

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Industrial Embedded Compact PC ES220F-CS with 9th/8th Generation CPU

DFI, extended temperature support, fanless design, 2x Intel GbE, 4x USB 3.1, 2x USB 2.0, supports 2x COM.

Features ■ Width 175 × Height 69.4 × Depth 120 mm (1 Storage: 1 x M.2 SSD) ■ Width 175 × Height 90.4 × Depth 120 mm (3 Storage: 1 x M.2 SSD + 2 x 2.5” bay) ■ Weight (kg) 3.5 kg (1 Storage), 3.8 kg (3 Storage) ■ Equipped with 9th/8th generation CPU L ■ 2 x 260-pin DDR4 2666MHz SODIMM (up to 64GB) ■ Supports maximum resolution 4K with 2 independent display outputs (2 x HDMI) ■ Supports 2 x Intel GbE, 4 x USB 3.1, 2 x USB 2.0, 2 x COM ■ Operating temperature range -20 to 60°C (cTPU 15W) ■ Mounting method supports Wall Mount, VESA mount 75x75/100x100 cm (optional) ■ Compatible with Windows 10 IoT Enterprise 2019 LTSC + RS5, Windows 10 Professional

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EC500-CS Industrial Embedded Compact PC with 9th/8th Generation CPU

DFI, equipped with 9th/8th generation CPU, extended temperature support, fanless operation, designed for modular embedded systems, supports 5G communication.

Features ■ Width 255.3 × Height 85 × Depth 224 mm ■ Weight (kg) 4.15 kg ■ Equipped with 9th/8th generation CPU LGA 1151 Socket ■ 2 x 260-pin DDR4 2400/2666MHz SODIMM (up to 64GB) ■ Supports up to 4K Q370/C246: 3 independent display outputs 1 VGA + 2 HDMI/DP++ (auto detection) H310: 2 independent display outputs 1 VGA + 1 HDMI/DP++ (auto detection) ■ 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0 (Q370/C246 only) ■ Supports extended temperature range -20 to 70°C (for SSD or M.2 storage) ■ Mounting method: Supports Wall Mount ■ Compatible with Windows 10 IoT Enterprise 2021 LTSC, Linux

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