アユミ工業 List of Products and Services

The "Fluxless Reflow Device RF Series" can perform reflow under reduced pressure without using flux. Compared to conventional reflow processes that use flux, it eliminates the need for flux application and cleaning processes, reducing costs by approximately 50% and allowing for a reduction in installation space to about one-third. Additionally, it can reduce CO2 emissions generated during flux cleaning by about 30%, contributing to a decrease in environmental impact. Furthermore, due to the vacuum process, it can be processed without voids. For more details, please download the catalog or contact us.

• Vacuum Equipment
• Wafer processing/polishing equipment
• Reflow Equipment

We have achieved wafer bonding that provides bulk fracture strength at room temperature. We cater to a range of bonding equipment from research and development to mass production. Our technology is used in a wide variety of fields, including wafer-level packaging and 3D integration. For development purposes, we offer a series of research-grade surface activation bonding devices, ranging from those with focused functions for activation treatment and bonding to those equipped with high-precision alignment and analysis capabilities. For mass production, we provide equipment designed for bonding substrates such as silicon and compound semiconductors after activating the bonding surfaces under ultra-high vacuum conditions. This process allows for bonding at room temperature without the use of sealing materials. For more details, please download the catalog or contact us.

• Vacuum Equipment
• Wafer processing/polishing equipment

The bonding device is a machine that joins wafers together using adhesives such as UV resin. It consists of a weighting and bonding chamber, an alignment mechanism, a bonding area inspection mechanism, and an angle deviation inspection mechanism. Additionally, it can be connected to a glove box for pre-treating substrates in an inert atmosphere. Depending on customer needs, it is possible to select the necessary functions from these mechanisms to configure the device. For more details, please download the catalog or contact us.

• Vacuum Equipment
• Wafer processing/polishing equipment

Ayumi Industries produces high-quality components for vacuum devices, accelerators, and electronic and physical engineering-related equipment. Our representative products include vacuum sealing devices, liquid crystal injection devices, and anode bonding devices, as well as industrial equipment starting with automation and labor-saving devices for semiconductors, vacuum-related parts, and various vacuum components for large synchrotron facilities. In addition to standard devices, we also design and manufacture various vacuum devices tailored to customer needs. We also produce flanges, valves, and other components used in vacuum devices. For more details, please download our catalog or contact us.

• Vacuum Equipment
• Public Testing/Laboratory

Ayumi Industries aims to contribute to society by maintaining a global perspective, constantly focusing on the cutting edge of the times, anticipating the needs for new technologies, research, development, and manufacturing systems, and engaging in self-improvement. In this rapidly changing era, we accurately analyze information and respond to the needs of the global market while striving for technology and product development that is also environmentally friendly. Based on five pillars: "Development," "Processing and Manufacturing," "Products," "Information," and "Control," we will continue to be a company that contributes to society while always keeping an eye on the forefront of the times. For more details, please download our catalog or contact us.

• Vacuum Equipment

●This is an optimal system for the development of next-generation MEMS devices and semiconductor packaging. ●It performs high-precision alignment and weight application in ultra-high vacuum. ●It allows for the bonding of dissimilar materials by directly bonding without heating the substrate. ●It is compatible with load lock systems and cluster systems.

• Other semiconductor manufacturing equipment

It can apply a maximum pressure of 1500 kg to an 8-inch wafer and heat it up to a maximum of 1100°C. It is also compatible with ultra-high vacuum.

• Other processing machines
• Other semiconductor manufacturing equipment

The mask alignment mechanism achieves nano-order alignment using a fine motion piezo XY table and a coarse motion stepping motor XYΘ table.

• Hydraulic Equipment

With its unique heater, it is possible to hermetically seal a large amount of work in a vacuum or any gas atmosphere. It can be heated up to MAX 900°C (with an option for over 1000°C). The unique heating method allows for good temperature distribution.

• Hydraulic Equipment

Inline LCD injection device: Compatible with MAX 21-inch panels. This mass production equipment enables stable production of high-quality LCDs by performing inline injection in the pressure range from high vacuum (10-7 Torr) to 5 kg/cm².

• Hydraulic Equipment

Continuous card-type exhaust device for PDP/FED: Safety measures have been implemented for the turbo molecular pump panel using a special card transport system, achieving a temperature uniformity of ±5°C (on the panel surface).

• Hydraulic Equipment

This is a device characterized by performing reflow under reduced pressure using formic acid without the use of flux. 【Features】 ○ No need for flux application or cleaning processes. ○ Approximately 50% cost reduction is possible, and the installation space can be reduced to about one-third. ○ It can contribute to reducing environmental impact by decreasing CO2 emissions generated during flux cleaning by about 30%. ● For more details, please contact us or download the catalog.

• Reflow Equipment

This is the catalog of Ayumi Industrial Co., Ltd.

• Other processing machines

Batch processing achieves low dew point. High-precision alignment can be performed in the atmosphere or in a vacuum. Changing the conditions of the joining atmosphere is easy. Since only the necessary parts are heated, distortion is minimal during joining. There is no variation between rods, resulting in good yield. Automation of operations allows for labor savings.

• Hydraulic Equipment