弘輝テック Product Lineup

The "SELBO-III" is a high-quality selective soldering machine that enables flexible configurations. It allows for a random layout configuration of up to 10 modules (e.g., 2 Fluxers, 2 Preheaters, 6 DIP Tanks). With easy switching of the transport direction, you can rearrange the line layout without purchasing new equipment. 【Features】 - A non-stop system that allows maintenance during production to improve operational efficiency. - Co-developed with DynaTron, the Freedom software for creating soldering programs. - Inlet and outlet conveyor units. - Capable of mounting either a two-fluid nozzle or an air jet nozzle. - Rapid heating lamp heaters enable a reduction in preheating time. *For more details, please feel free to contact us.

"Freedom" is a program creation system that generates soldering programs based on CAD data standards, automatically optimizing preheating/spray time and soldering paths. It automatically selects nozzle diameter and operation from the board layout information. It can automatically check for interference based on the clearance between the nozzle and surrounding components. 【Features】 ■ Soldering path optimization ■ Profile creation ■ Component interference check ■ Component library function *For more details, please refer to the PDF document or feel free to contact us.

The "EQS-350" is an inline standard type point soldering device. It controls the necessary amount of solder, thermal capacity, and time for each soldering point, allowing for optimal "soldering conditions" to be set. Using the "dedicated software" (O/P), images captured by a scanner and Gerber data from PCB design can be displayed to generate a "soldering" program. 【Features】 ■ High quality ■ Simplification of NC software creation ■ Improved productivity through the expansion of the "soldering tank module" *For more details, please refer to the PDF materials or feel free to contact us.

The EQSS-350SD is a space-saving inline model point soldering device. By adding an expansion unit to the "solder pot module," production efficiency is improved. The adoption of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. 【Features】 ■ By setting the maximum substrate size of 350mm horizontally, the length of the spray and preheating dip device is reduced to 1600mm (excluding the feeder conveyor) for space-saving. ■ The addition of an expansion unit to the "solder pot module" improves production efficiency. ■ The use of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. ■ Production management (traceability) supports quality control. *For more details, please refer to the PDF materials or feel free to contact us.

The "GFL-350N" is a lead-free nitrogen soldering device with an open dome structure that does not have a curtain, accommodating component heights of up to 100mm. It supports model switching and traceability through two-dimensional codes and other means. The nitrogen dome is equipped with a mist collection and clean substrate cooling mechanism. 【Features】 ■ Open dome structure without a curtain, accommodating component heights of up to 100mm ■ Stable low oxygen concentration with a dome internal pressure adjustment structure at the entrance and exit ■ Jet flow mechanism that reduces solder dross generation and suppresses solder hole occurrence ■ The warpage prevention unit for the solder bath section operates externally without opening the dome (optional) *For more details, please refer to the PDF document or feel free to contact us.

The "LMFS-400" is a soldering device that can handle processes from partial dip to full dip using a 4-axis peel-back mechanism. By adopting a high-performance (low pressure, fine particle) spray nozzle, it achieves a coating efficiency of over 70% and good through-hole fill. After soldering, cooling fans are placed in two locations: the descending lifter section and the bottom return conveyor section. 【Features】 ■ Spray Fracture ■ Preheating ■ Soldering ■ Cooling ■ Monitor *For more details, please refer to the PDF document or feel free to contact us.

The "SOFR-400" is an overflow-type automatic soldering machine that allows for the selection of four DIP methods. The production method can be chosen between inline compatibility and cell production compatibility (return back). In the peel-back DIP method, four electric cylinders are used, allowing for peel-back at angles of up to 4 degrees. 【Features】 ■ Four DIP methods can be selected ■ N2 supply is conducted simultaneously from four locations: the substrate transport section and the side of the solder tank, creating an N2 curtain that covers the solder surface ■ The production method can be chosen between inline compatibility and cell production compatibility (return back) ■ Compact design achieves space-saving *For more details, please refer to the PDF materials or feel free to contact us.

The collaborative project "MUSUBI," which hosts the Implementation and Assembly Process Technology Exhibition, has established an "experimental lab" in the Kansai region, not just a showroom, with seven equipment manufacturers. We invite you to bring your circuit boards to the lab and conduct verifications and experiments using the manufacturers' products. 【Hiroki Tech Showroom Equipment】 ■ Desktop Point Jet Soldering Device ■ Desktop Point Flux Application Device ■ All-in-One Point Jet Soldering Device *For more details, please refer to the PDF materials or feel free to contact us.

Koki Tech Co., Ltd. will be exhibiting at the "38th Internepcon Japan Electronics Manufacturing and Packaging Exhibition" held at Tokyo Big Sight. The exhibition will take place over three days from January 24 (Wednesday) to January 26 (Friday), 2024, and our booth will be located at "East 1E4-48." We will showcase equipment such as the far-infrared combined hot air circulation reflow oven "VFR-408N" and the inline selective soldering machine "SELBOIII." 【Event Overview】 ■ Date: January 24 (Wednesday) to January 26 (Friday), 2024 ■ Venue: Tokyo Big Sight ■ Booth Number: East 1E4-48 *For more details, please refer to the PDF document or feel free to contact us.

This package is a reliable option entrusted to professionals, ensuring quality maintenance at a great value under appropriate conditions. Our skilled staff, equipped with advanced skills and extensive knowledge, will carry out the maintenance. We will conduct diagnostic maintenance at a great package price. Please feel free to contact us when you need our services. 【Features】 ■ Maintenance by professionals ■ Great package pricing ■ High-quality genuine parts ■ Advance notice for regular inspections *For more details, please refer to the PDF document or feel free to contact us.

The "IPH (Induction Heating Preheat Function)" is based on proven heating nitrogen (N2) and point flow methods, and combined with induction heating (IH) preheating, it can efficiently heat and solder patterns and electrodes with large thermal capacities. With heated N2, through-hole ups that typically take time can be completed in a short period. It avoids insufficient heating, reduces solder temperature bath temperatures, and allows for transition to small-diameter nozzles. 【Features】 ■ Heats (generates heat) the patterns or electrode leads that need to be heated ■ IPH On/Off settings and On time can be configured for each step ■ Significantly reduces thermal stress on surrounding components *For more details, please refer to the PDF materials or feel free to contact us.

The "ULTIMA series" is easy to handle and designed for tabletop use. It addresses the shortage of manual soldering workers and quality instability by replacing them with automated soldering equipment. (Method) Flux application (SPZ) → Preheating (PHS) → Soldering (TRZ) *Material handling is done by the operator. Automation of flux application from manual to automated, reduction of flux liquid volume through uniform application, quality improvement, and labor saving are possible. To accommodate increased production, adding a soldering tank (TRZ) allows for easy and cost-effective solutions. *There are many cases where one operator can handle up to the maximum soldering tank capacity (depending on the circuit board). Please feel free to contact us when you need assistance. 【Features】 ■ High-efficiency flux application under optimal conditions ■ Easy numerical management with OP digital flow display ■ Preheating device (PHS) available for reducing soldering time and effective for solder rise ■ A variety of nozzles necessary for soldering can be selected ■ Stable soldering quality, quality improvement, and labor saving are possible *For more details, please refer to the PDF materials or feel free to contact us.

The "VFR Series" is a reflow oven that utilizes a special far-infrared panel heater and hot air circulation system. It minimizes flux adhesion inside the oven, achieving extended maintenance periods. It also allows for mist recovery with a special filter (the filter can be reused after cleaning). Please feel free to contact us when you need assistance. 【Features】 ■ Special far-infrared panel heater and hot air circulation system ■ Minimizes flux adhesion inside the oven, extending maintenance periods ■ Mist recovery with a special filter (the filter can be reused after cleaning) *For more details, please refer to the PDF document or feel free to contact us.

The "SELBOIII Series" is an inline selective soldering device that can add modules according to production volume. It improves soldering quality and reduces solder defects. Additionally, the optional substrate warpage correction function prevents nozzle contact. It also features various functions such as an air jet nozzle and a selective soldering bath. 【Features】 ■Improves soldering quality and reduces solder defects ■Supports labor-saving and automation in an inline format ■Can add modules according to production volume ■Layout changes possible with modular configuration ■Non-stop maintenance system (optional) *For more details, please refer to the PDF document or feel free to contact us.

Koki Tech Co., Ltd. will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo" held at Tokyo Big Sight. We plan to showcase a total of six pieces of equipment, including the "VFR-408N," which reduces flux cleaning, and the innovatively designed "ULTIMA-TRZ." We look forward to your visit. 【Exhibition Overview】 ■ Exhibition: 39th NEPCON Japan Electronics Development and Manufacturing Expo ■ Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 - 17:00 ■ Location: Tokyo Big Sight, East Hall 1 ■ Booth Number: East 1E4-2 ■ Admission Fee: Free (Pre-registration required) *For more details, please download the PDF or feel free to contact us.

This catalog introduces the products handled by Koki Tech Co., Ltd. It features various products such as "SpROBO," which applies flux efficiently under optimal conditions, and "NEO-L," which integrates a spray fluxer and solder pot into one unit. Details about each product's specifications and features are included, so please make use of this information when selecting products. [Contents] ■ Selective Soldering Series (Desktop/All-in-One) ■ Selective Soldering Series (Inline) ■ Wave Soldering Series ■ Far Infrared Combined Hot Air Circulation Reflow Oven VFR Series ■ Other Lineup ■ Peripheral Equipment *For more details, please download the PDF or feel free to contact us.

The "ULTIMA-NEO-L Smart" is a selective soldering device that has achieved miniaturization compared to the conventional model NEO-L. The reduction in size has led to a 10% decrease in power consumption. The spray and solder pot have been consolidated into one unit, improving convenience. Additionally, easy data creation is possible (anyone can do it). It can be equipped with the new feature "Preheating Unit IPH" (optional). 【Specifications (excerpt)】 ■ Device dimensions: 1150(L)×1250(W)×1050(H)mm ■ Board size: 50(W)×50(L) to 380(W)×460(L)mm ■ Maximum board weight: 2kg ■ Component height: Upper 50mm, Lower 25mm (or less) ■ Air supply volume: 0.4-0.5MPa 50L/min *For more details, please download the PDF or feel free to contact us.

We would like to introduce our tabletop selective soldering series, 'ULTIMA-TRZII/SPZII'. The board thickness ranges from 0.8 to 2.0 mm, and the nozzle is a two-fluid nozzle with an inner diameter of φ2 to 20 mm (standard specification) / air jet (optional). Please feel free to contact us when you need assistance. 【Specifications of ULTIMA-TRZII (excerpt)】 ■ Equipment dimensions: W620×D940×H442(mm) [for reference] ■ Power supply: Single-phase AC200V±5% 4kVA ■ Equipment weight: Approximately 120kg [for reference] ■ Notes: Nitrogen supply rate (reference value) 25L/min (0.4 to 0.5MPa) *For more details, please download the PDF or feel free to contact us.

Koki Tech Co., Ltd. will be exhibiting at the 'JISSO PROTEC 2025 (26th Assembly Process Technology Exhibition)' held at Tokyo Big Sight. This exhibition is a comprehensive showcase of electronic component assembly technology. Advanced technologies related to electronic component assembly, which are essential for the electronics society, will be gathered in one place. We plan to showcase our all-in-one selective soldering machine model "NEO-L Smart (with IPH)" among others. We understand you are busy, but we kindly ask for your visit. 【Exhibited Equipment】 ■ All-in-one selective soldering machine model "NEO-L Smart (with IPH)" ■ Infrared and hot air circulation reflow oven "VFR-408N" ■ Desktop selective soldering machine "ULTIMA-TRZ" ■ Desktop selective spray machine "ULTIMA-SPZ" ■ Doctor Palette ■ Inline selective soldering machine "SELBO III" *For more details, please download the PDF or feel free to contact us.

At the "KOKI TEC ASIA Exhibition Hall," you can verify soldering quality using reflow soldering, post-process soldering inspection, inline and tabletop selective soldering equipment. We offer operational training, soldering quality improvement, and maintenance (solder pot overhaul) training. Location: 5 minutes by car from BTS Udomsuk Station in Bangkok, located on Udomsuk Soi 31. 【Our Services】 ■ Manufacturing of automatic soldering equipment ■ After-sales service/training ■ Experiments (temperature profiles, soldering quality verification)/training (overhaul procedures, soldering teaching program creation procedures) *For more details, please download the PDF or feel free to contact us.

Koki Tech Co., Ltd. will be exhibiting at "JISSO PROTEC 2026 (27th Assembly Process Technology Exhibition)" held at Tokyo Big Sight. We plan to showcase the "Soldering Equipment SELBO III," which integrates inspection technology into traditional soldering equipment, aiming to reduce soldering defects to an absolute minimum and achieve process improvement. At this exhibition, we will also display and demonstrate soldering equipment and inspection machines equipped with new methods. We sincerely look forward to your visit. 【Event Overview】 ■ Date: June 10 (Wed) - 12 (Fri), 2026, 10:00 AM - 5:00 PM ■ Venue: Tokyo Big Sight ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (about a 7-minute walk) - Yurikamome, Tokyo Big Sight Station (about a 3-minute walk) ■ Our Booth: East Hall 1, 1A-28 *For more details, please refer to the related links or feel free to contact us. *The main image is a photo of our exhibition booth from 2025.

The "FLOX-350" is an external flux wave soldering device equipped with a high-efficiency motor and an excellent preheating system. It features a direct drive plate mount structure, specially manufactured stainless steel chain drive, and uniquely designed aluminum alloy guide rails, making it robust and highly durable. Additionally, the transport system employs a segmented floating structure that effectively prevents deformation of the guide rails, ensuring stable operation over the long term. 【Features】 ■ External flux type for high safety and easy maintenance ■ Excellent preheating system with a high-efficiency motor ■ Stable transport with a special transport design ■ Foreign object drop prevention with a high-efficiency exhaust hood *For more details, please download the PDF or feel free to contact us.

The "SELEX-400" is an inline selective soldering device capable of high-precision control and solder volume management, as well as soldering in an N2 atmosphere. The minimum application diameter is 3mm. Compared to conventional full-area spraying, throughput efficiency has improved. Additionally, by combining upper and lower heaters, a uniform temperature distribution across the entire circuit board has been achieved. 【Features】 ■ Stable quality with high-precision flux application ■ Independent parameter settings at each point enabled by high-efficiency preheating combinations (lower infrared, upper hot air, optional) ■ Supports online/offline editing ■ Real-time monitoring of soldering conditions throughout the entire process *For more details, please download the PDF or feel free to contact us.