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LED bar module type equipped with RGB LED SMT package on a rigid substrate.

• Other electronic parts

The LED light panel is a wall-mounted electric signboard that emits light uniformly over a large area, thanks to its high-brightness LED backlight and light guide plate. The next-generation LED light panel is energy-efficient and environmentally friendly, making it ideal for enhancing signboard spaces! Well's LED light panel has achieved an ultra-long lifespan for the LEDs by maximizing heat dissipation from the heat generated by the LEDs through a triple heat dissipation structure.

• Other electronic parts

A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment

LEDs have the characteristic that their luminous flux decreases (becomes dimmer) and their lifespan shortens as the temperature rises. Power LEDs, which are particularly used for lighting applications, consume more power and generate more heat than regular LEDs, necessitating the use of heat sinks. Well's heat sink is a product that excels in heat dissipation characteristics compared to traditional aluminum heat sinks by coating with carbon nanotubes.

• Other electronic parts

This device is a semi-automatic machine compatible with cell production that applies a moisture-proof agent and UV irradiation to the LCD panel FPC connection part and the chip.

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment

Standard indicator LEDs (bulb-type LEDs) have been primarily used with resin substrates (glass cloth epoxy substrates) due to their low heat generation. However, power LEDs used for lighting applications generate more heat, making metal-based substrates effective for improving LED performance and reliability against heat, as well as extending their lifespan due to their excellent thermal conductivity and cost performance. Well's MCCL substrate is based on a ferrous alloy with excellent heat dissipation, designed to keep the temperature rise of high-power LED elements within a certain range. By utilizing the ferrous alloy base material as a heat sink, it is possible to significantly disperse and dissipate heat generated from the LED, thereby reducing the heat generated by the LED itself and minimizing the decrease in LED lifespan. Additionally, by combining this with Well's heat sink coated with carbon nanotubes, we achieve further improvements in heat dissipation characteristics, leading to an extended lifespan for the LEDs.

• Other electronic parts

Benefits of Implementation (Examples) ○ Reduction of scrap from implementation Improved yield... Vertical launch of new products and assurance of market quality ○ Abolition of pilot chips Reduction of running costs ○ Prediction of PM maintenance timing Increased productivity

• Bonding Equipment
• Circuit board processing machine
• Other semiconductor manufacturing equipment