Real-time monitoring system for semiconductor packaging process anomalies
Benefits of Implementation (Examples) ○ Reduction of scrap from implementation Improved yield... Vertical launch of new products and assurance of market quality ○ Abolition of pilot chips Reduction of running costs ○ Prediction of PM maintenance timing Increased productivity
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basic information
Our system uses multivariate analysis methods to analyze abnormal predictions in the semiconductor assembly process in real-time. We provide a wide range of support, from monitoring the normal operation of equipment to production and quality management applications for semiconductor assembly manufacturers.
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Applications/Examples of results
Application ○ For equipment manufacturers: - Abnormality prediction of equipment, maintenance timing prediction, pre-shipment inspection applications (such as measurement deviation inspection) ○ For semiconductor assembly manufacturers: - Yield management, quality control, equipment operation management, process management, etc.
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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