ユーシー・ジャパン Product Lineup

Transducer for Ball Bonders ■〈ST Type Transducer〉 The ST type ultrasonic transducer is a standard ultrasonic transducer for ball bonders that Uthe Technology has been supplying stably for many years. ■〈ST-LE Type Transducer〉 The ST-LE type transducer is an ultrasonic transducer that enables fine-pitch wire bonding, which has become particularly important in recent years. ■〈B Type Transducer〉 The latest ultrasonic transducer for ball bonders, confidently delivered by Uthe Technology. 〈ST Type Transducer〉 ■〈PT Type Transducer〉 The PT type ultrasonic transducer is a standard ultrasonic transducer for wedge bonders that Uthe Technology has been supplying stably for many years. ■〈PT-LE Type Transducer〉 The PT-LE type ultrasonic transducer is an ultrasonic transducer that enables fine-pitch wire bonding, which has become particularly important in recent years. ■〈W Type Transducer〉 The latest ultrasonic transducer for wedge bonders, confidently delivered by Uthe Technology.

In recent years, the demands for ultrasonic bonding with various materials and fine pitch bonding have become complex and diversified. We provide reliable solutions for all of these needs. 【Features】 We offer a variety of types. ○ ST Type Transducer Standard ultrasonic transducer for pole bonders ○ ST-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ B Type Transducer Latest ultrasonic transducer for pole bonders ○ PT Type Transducer Standard ultrasonic transducer for wedge bonders ○ PT-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ W Type Transducer Latest ultrasonic transducer for wedge bonders ● For more details, please contact us or download the catalog.

It is developed targeting chip sizes from 0.15mm to 5mm. 【Features】 - The tip of the ultrasonic transducer is designed to allow for the attachment of a collet. - Capable of accommodating various chip sizes without replacing the transducer. - Frequency: 60kHz - Option: Cartridge heater For more details, please contact us or download the catalog.

It is developed targeting chip sizes from □3mm to □10mm. 【Features】 ○ The tip of the ultrasonic transducer is designed to allow for the attachment of a collet. ○ Capable of accommodating various chip sizes without replacing the transducer. ○ Frequency: 60kHz ○ Option: Cartridge heater ● For more details, please contact us or download the catalog.

This is a notification from UC Japan Co., Ltd. regarding the "Custom Specification Special Order Transducer Dual Frequency Ultrasonic Transducer." 【Features】 - A unique ultrasonic transducer that allows the use of two resonant frequencies, 65kHz and 135kHz, with a single unit, pioneering in the industry. - It enables instantaneous switching between bonding in the 60kHz range, which typically requires the replacement of the ultrasonic transducer, and bonding in the 130kHz range (high frequency) without needing to replace the transducer. - It can accommodate a variety of applications, such as bonding at 130kHz for the 1ST and bonding at 60kHz for the 2ND. For more details, please contact us or download the catalog.

This is a notice from UC Japan Co., Ltd. regarding the "Custom Specification Special Order Transducer Wideband Frequency Compatible Ultrasonic Oscillator." 【Features】 ○ Capable of switching rapidly between 65/135kHz (1st/2nd bond) ○ Select appropriate parameters from 16 different profiles ○ Equipped with a fully automatic tracking function controlled by CPU ● For more details, please contact us or download the catalog.

This is the latest comprehensive catalog from UC Japan Co., Ltd., which has been developing domestic specifications in collaboration with major semiconductor manufacturing equipment manufacturers in Japan, building trust and a proven track record. As a leading global company in ultrasound with a strong reputation, we solve ultrasound-related issues! We are expanding our business in the global market and have a robust support system in various countries! *Currently, we are offering the comprehensive catalog for free!* [Contents (excerpt)] ■ Wire bonders for semiconductor manufacturing (from UC Technology) ■ Ultrasonic plastic welding machines / cutters (from Rinko Ultrasonics) ■ Ultrasonic powder sieving machines / ultrasonic hoppers (from Artec Ultrasonics) ■ Main features of ultrasonic oscillators / ultrasonic transducers 　　　　　　　　　　　　　　　　　　　　　and more *For more details, please refer to the catalog or feel free to contact us.*