ユーシー・ジャパン Product Lineup

This is the latest comprehensive catalog from UC Japan Co., Ltd., which has been developing domestic specifications in collaboration with major semiconductor manufacturing equipment manufacturers in Japan, building trust and a proven track record. As a leading global company in ultrasound with a strong reputation, we solve ultrasound-related issues! We are expanding our business in the global market and have a robust support system in various countries! *Currently, we are offering the comprehensive catalog for free!* [Contents (excerpt)] ■ Wire bonders for semiconductor manufacturing (from UC Technology) ■ Ultrasonic plastic welding machines / cutters (from Rinko Ultrasonics) ■ Ultrasonic powder sieving machines / ultrasonic hoppers (from Artec Ultrasonics) ■ Main features of ultrasonic oscillators / ultrasonic transducers 　　　　　　　　　　　　　　　　　　　　　and more *For more details, please refer to the catalog or feel free to contact us.*

Equipped with a servo press that efficiently transmits ultrasonic energy to the workpiece and an oscillator from RINCO with excellent ultrasonic control functions. It suppresses deformation and slipping of the base material during joining, preventing cracks and disconnection troubles. Additionally, if you want to realize your company's ideals rather than standard products, consultations are welcome. We will support you while sharing know-how for each customer's application, so modifications and program adjustments are also accepted. 【Features】 ■ Settings can be adjusted according to material characteristics ■ Customization and program modifications are possible ■ Support available for overseas deliveries *For more details, please refer to the PDF materials or feel free to contact us.

The ultrasonic metal bonding machine 'USDB' is an ultrasonic metal bonding machine that achieves high-speed cycle operation, high-speed data transfer, and high-precision position control. The servo motor press pressure control with a one-axis rigid structure realizes ultra-fine position accuracy and high-speed load tracking, providing stable ultrasonic energy addition and dramatically improving processing reproducibility. The new Ethernet/IP connection simplifies the operation management of automated lines and converts all bonding results into big data. 【Features】 - Processing assembly accuracy, operational precision, and ultrasonic control that ensure the ultrasonic vibration energy during bonding is reliably transmitted to the workpiece. - High reliability in position accuracy (1µm) achieved through the rigidity of the distinctive one-piece frame structure. - Original program that realizes high-speed load tracking (stable load) against load fluctuations during bonding. - Easy setting operations enabled by the simple screen MMI (man-machine interface) with a color touch panel. - Unique ultrasonic control method for applications sensitive to frequency and impedance fluctuations. - Protective circuit program included to prevent failures of the ultrasonic oscillator and servo due to overloads. - Excellent bonding reproducibility that allows for easy reading of processing behavior from bonding data waveforms and performing multiple regression analysis of the data.