名東電産 List of Products and Services

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

• Contract manufacturing

Do you have any requests such as wanting to flow more current than a standard board while keeping temperature rise to a minimum, or not wanting to increase the size of the board too much? At Meito Electric, as a board manufacturer, we assist in the development of thick copper boards tailored to your needs by considering the line/space during pattern design, the current values flowing through through-holes, selecting copper thickness, and choosing high heat dissipation materials and layer counts. 【Do you have any of the following requests?】 ■ Want to reduce bus bars on the board ■ Want to form power circuits and control circuits on the same board ■ Want to dissipate heat from components to prevent failures 　and more *For detailed information on thick copper, please download the PDF or feel free to contact us.

• Contract manufacturing

At Meito Electric Industry, we handle not only heat dissipation substrates such as metal base substrates (aluminum base substrates, copper base substrates, etc.) but also special-purpose substrates for LED lighting circuit boards. We respond to your requests from material selection to manufacturing methods tailored to your applications. 【Do you have any of the following requests?】 ■ We want to use high thermal conductivity materials to suppress the temperature rise of circuits (conductors) and components. ■ We would like to attempt a prototype that combines high heat dissipation resin with metal. ■ We want to create long substrates... and more. *For details on the substrates we can accommodate, please refer to the PDF materials or contact us directly.

• Circuit board design and manufacturing
• LED Module

The PTFE IVH substrate is a non-through IVH substrate made from polytetrafluoroethylene material. Our company manufactures composite multilayer substrates composed of bonded dissimilar materials. (We also produce various other types of substrates.) IVH and BVH structures using composite materials such as Teflon + FR-4 and PPE + FR-4 are possible. We can also bond copper and aluminum with substrate materials or multilayer substrates, and we can develop our processing technology to create custom substrates that meet your requirements. 【Substrate Specifications】 ● Bonded material thickness: 0.1t and above ● Line space: 100/100μm, intersection ±50μm ● Surface treatment: water-soluble heat-resistant flux, lead-free solder leveling, Au flash, etc. *For more details, please refer to the PDF document or contact us directly.

• Printed Circuit Board
• Circuit board design and manufacturing

"Aluminum core substrate" is a suitable substrate when you want to improve heat dissipation throughout the substrate while also reducing weight compared to copper core substrates. 【Features】 ● Excellent thermal conductivity ● Industry's highest dielectric breakdown voltage ● Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF materials or contact us directly.

• LED Module

In the miniaturization of products, enhancing the thermal dissipation of the substrate is essential. Heat sinks are used to improve thermal conductivity, but they take up extra space, which contradicts the goal of miniaturization. Meito Electric specializes in processing that improves the thermal dissipation of substrates by using aluminum and copper as conductors. ★ We have a proven track record in various fields, including automotive substrates and LED substrates! We are currently offering technical materials related to improving substrate thermal dissipation for free! These materials also include the advantages and disadvantages of substrates made from copper and aluminum. *If you would like the technical materials, please feel free to download them or contact us.

• Contract manufacturing

Meito Electric Co., Ltd. is involved in the electric and electronic machinery and equipment automotive manufacturing industry, which has undergone significant and diverse transformations. The printed circuit boards and other products handled by Meito Electric have also made great advancements in technology, quality, and quantity. Since its establishment, the company's philosophy in manufacturing has been to "create the best possible products" and to adhere to "quality-oriented" management, which has led to the accumulation of trust from our business partners and stable transactions to this day. 【Business Activities】 - Manufacturing, processing, and sales of printed circuit boards and nameplates - Processing and sales of electrical insulation materials, plastic molded products, and various related materials - Press processing and sales of general metal materials - Processing, assembly, and sales of electrical machinery, automotive parts, and other related components - Manufacturing of precision press molds and jigs, among others For more details, please contact us or download our catalog.

• Printed Circuit Board
• Circuit board design and manufacturing
• Contract measurement

"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.

• Printed Circuit Board
• Circuit board design and manufacturing

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

• Printed Circuit Board
• Circuit board design and manufacturing

At Meito Electric Co., Ltd., we manufacture and sell printed circuit boards such as "side-plated substrates," "dissimilar material laminated substrates," and "cavity substrates." The "side-plated substrate" achieves a shielding effect by applying plating treatment to the outer edge surface of the substrate. The "dissimilar material laminated substrate" allows for combinations tailored to your needs, such as laminating high-frequency materials with epoxy resin. The "cavity substrate" can be produced more easily than structures that embed electronic components into the substrate. 【Features】 ○ Side-plated substrate: → Half through-holes can be formed on the side surface → Plating can also be formed around the entire circumference of the substrate's side surface ○ Dissimilar material laminated substrate: → Various sizes are available to accommodate small quantities of diverse multilayer workpieces → Supports surface treatments such as heat-resistant flux, lead-free solder leveling, and gold plating ○ Cavity substrate: → Enables low-profile modules *For more details, please refer to the PDF document or contact us directly.

• Printed Circuit Board
• Circuit board design and manufacturing

At Meito Electric Co., Ltd., we conduct characteristic impedance measurements for printed circuit board wiring using TDR measurements with test coupons. With the acceleration of data transmission, issues such as transmission loss of digital signals and waveform distortion due to reflections are becoming a concern. Therefore, it is particularly important to match the characteristic impedance, which is one of the factors affecting transmission characteristics. 【Benefits】 ○ By matching the impedance → Signal loss is reduced → Efficient transmission can be achieved For more details, please contact us or download the catalog.

• Printed Circuit Board
• Circuit board design and manufacturing
• Contract measurement

"MS Processing (Miracle Shaving Processing)" is a press processing method that improves the punchability of the substrate edge surface by using two types of special molds. It achieves an edge finish equivalent to router processing and can reduce burrs and debris on the substrate edge surface to nearly zero. If you are troubled by burrs or debris on the substrate edge surface, please consult us. 【Benefits of MS Processing】 - Reduces foreign matter generated on the substrate edge surface to a level comparable to router processing. - Can be more cost-effective than router processing for production volumes exceeding a certain shot count. - Can also suppress the generation of foreign matter due to heating after flow and reflow. For more details, please contact us or download the catalog.

• Printed Circuit Board
• Circuit board design and manufacturing

"PEN Film" is a transparent circuit film that allows for the creation of circuit patterns using transparent resist and copper foil. Surface treatment is also available as an option. The compatible product sizes are TD: 380mm and MD: 340–510mm. Please consult us for other specifications. 【Representative Characteristics】 ○ Thickness of transparent film (including adhesive layer): 110μm ○ Thickness of copper foil: 12μm ○ Total light transmittance: 85.47% (Condition JISC7135) For more details, please contact us or download the catalog.

• Printed Circuit Board
• Circuit board design and manufacturing

Meito Electric Co., Ltd. started processing and selling electrical insulation materials in 1967 and began manufacturing and selling printed circuit boards in 1983. The range of products we handle is widely used in applications such as automotive, communication equipment, housing-related, and industrial machinery, among others. We would like to introduce our main equipment that seeks higher precision. 【Main Equipment】 ○ Design Department: Design Room, Laser Plotter Room ○ Third Factory: NC Drill, NC Router ○ Shimizu Factory: Desmear Line, Copper Plating Line ○ Second Factory: Exposure Room, Etching Line, AOI Inspection Room, Screen Printing Machine For more details, please contact us or download the catalog.

• Printed Circuit Board
• Circuit board design and manufacturing
• Contract measurement

At Meito Electric, we offer a wide variety of high-frequency materials such as Teflon substrates, BT resin materials, and PPE materials. We provide high-quality, high-precision products with stable quality for various applications, including antenna substrates and circuit boards for communication devices. For more details, please refer to our catalog or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

Meito Electric Industry primarily handles a significant number of automotive circuit boards, and we deliver high-quality and high-precision products through a focus on quality management systems, including ISO standards. We will continue to strive daily for quality improvement, with a motto centered on quality. For more details, please refer to our catalog or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing
• Other Auto Parts

At Meito Electric, we handle products in various fields such as telecommunications, housing, and gaming. Our product range is diverse, responding to customer needs with high-quality products from special substrates and heat dissipation substrates to standard rigid substrates, all provided with flexible support. For more details, please refer to our catalog or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

• Circuit board design and manufacturing
• LED Module

Meito Electric Industry offers a wide variety of materials, including various plastic materials, laminated boards, film materials, tape materials, etc. With our in-house mold processing technology, we deliver high-precision products without burrs. For more details, please refer to our catalog or feel free to contact us.

• Processing Contract

In the "Metal Materials Processing Division" of Meito Electric, we offer a variety of metal materials such as phosphor bronze, stainless steel, and brass. We manufacture high-precision products using our in-house pressing technology and progressive dies for components like terminals and switch parts. For more details, please refer to our catalog or feel free to contact us.

• Processing Contract
• Other metal materials

Nameplates (name plaques) were traditionally made by printing on brass or aluminum plates and then cutting them out to create products. However, today, they are more commonly made by printing on plastic sheets or by adding color to molded plastic products or engraving them with lasers. The nameplates processed at Meito Densan are mainly screen printed on plastic sheets from the front or back, and they produce translucent nameplates that illuminate the text when a light source is applied from behind. Their main applications include use in automotive switch knobs, torque converters, air conditioners, and more. For more details, please refer to our catalog or feel free to contact us.

• Processing Contract
• plastic

The precision press molds manufactured by Meito Electric are based on extensive experience and accumulated technology, which pulse through the various products produced by our company. The quality of mold technology directly relates to the quality of the products and also affects costs. The durability of the molds is an important factor as it impacts both quality and cost. Our company produces a range of challenging molds, including press molds for printed circuit boards, progressive press molds for metal materials, compound molds for electrical insulation materials, and molds for punching plastic sheets, all of which have received high praise and trust for their "quality and durability." For more details, please refer to our catalog or feel free to contact us.

• Processing Contract
• Press Dies

Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.

• LED Module