ムルチバック・ジャパン Company Overview

Deep drawing packaging not only wraps products but also leads to a reduction in packaging material usage, increased efficiency in the packaging process, improved usability of products, and expansion of sales methods and applications. In this seminar, we will introduce various possibilities that packaging can create, such as material reduction, productivity improvement, extended shelf life, and enhanced product value, based on unique deep drawing packaging examples from around the world. This seminar is recommended for those looking for insights on reviewing packaging specifications, differentiating in the sales area, and developing new products. September 25, 2026 (Friday) 15:00–15:20 Online (Teams) ＼This is a free 20-minute seminar. Please feel free to join!／ *We apologize, but participants from competing companies are not allowed to attend. Thank you for your understanding.

Multivac Japan will showcase packaging examples (package samples) for industrial products at TOKYO PACK 2026. The booth is located directly in front of the entrance to Hall 8 East. It is positioned immediately upon entering Hall 8 and is easily accessible from the seminar venue. At the venue, we will display packaging examples for metal processing parts, automotive parts, bearings, cutting tools, semiconductor-related components, and electronic parts. We will introduce packaging methods tailored to product characteristics and transportation conditions, including vacuum packaging, skin packs, moisture-proof and dust-proof packaging, and high-moisture-proof aluminum packaging. For challenges such as "only manual work remains in the packaging process," "want to stabilize packaging quality," "want to reduce cushioning materials and packaging supplies," and "want to reduce quality risks during overseas transportation," our dedicated staff will propose optimal packaging specifications while viewing product samples. We offer a one-stop proposal that includes not only packaging machines but also packaging materials and packaging technologies. If you are considering solutions for challenges in industrial product packaging, such as labor reduction, quality improvement, logistics efficiency enhancement, and environmental considerations, please visit the Multivac Japan booth directly in front of the entrance to Hall 8 East. Our dedicated staff is always available to consult on industrial product packaging.

The "Deep Draw Packaging Machine," a packaging solution using functional films, is suitable for packaging delicate electronic components due to its features such as static electricity prevention, moisture resistance, dust protection, and cushioning effects. It is also used for vacuum packaging various electronic components and circuit boards, as well as for packaging adhesives and ink cartridges. ■ Electronic devices requiring complete dust protection are safeguarded by advanced packaging technology and functional films. ■ Optimal-sized packaging reduces packaging material and saves space during transportation and storage, leading to cost reduction. ■ The introduction of automatic packaging machines is a significant measure to address labor shortages. What is the "Deep Draw Packaging Machine"? It uses custom-made molds tailored to the shape of the products and components being packaged to thermally form functional films. After the workpieces are inserted, vacuum extraction or gas replacement is performed, and the package is sealed with heat sealing before being cut and dispatched. At Multiback Japan, we listen to our customers' needs regarding "pack shape," "desired characteristics," "environment during transportation, storage, and sales," and "planned production quantities." Our specialized packaging department determines the material and thickness of test packaging, and we conduct sample packaging tests using the deep draw packaging machine. Please check the product catalog for more details!