アイン Product Lineup

This document introduces the products of Ain Co., Ltd., which engages in the design, manufacturing, and sales of printed circuit boards, categorized by function. It features various types of multilayer circuit boards (resin, metal, ceramics), including thick film printed circuit boards and inner layer thick copper circuit boards (with busbars). We respond to diverse needs such as high frequency, high thermal conductivity, and dimensional stability. 【Contents】 ■ High Frequency ■ High Thermal Conductivity ■ Dimensional Stability (Low Expansion) ■ High Heat Resistance ■ High Current *For more details, please refer to the PDF document or feel free to contact us.

Our company designs, manufactures, and sells "high-frequency substrates" using various high-frequency substrate materials, tailored to performance, cost, and delivery time. The materials include fluoropolymer materials and ceramics such as alumina and aluminum nitride. We can also provide laminated substrates combining fluoropolymer substrates with standard FR-4 substrates, as well as copper-based fluoropolymer substrates with higher thermal conductivity. Additionally, we are flexible in accommodating special processing (treatments) such as "cavity structure formation," "counterbore and irregular router processing," "through-hole filling processing," and "electroplating, electroless plating." 【Examples of Achievements】 ■ Substrates for VSAT BUC and LNB (microwave) ■ Substrates for millimeter-wave radar and antennas ■ Substrates for Doppler sensors ■ Substrates for high-frequency power amplifiers ■ Optical transmission/reception units (TOSA/ROSA) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity 　→ Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity 　→ DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) 　→ Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.