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We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

When designing modules that use high-power optical semiconductors, such as UV LEDs, a suitable wiring board for implementation is necessary. Our company proposes appropriate wiring boards considering various materials and structures for each requirement. We can also handle the design and manufacturing of wiring boards, as well as the modularization (implementation). ★ You can view detailed materials summarizing photos, structural diagrams, cross-sections, and achievements of "Thermal Countermeasures and Wiring Boards" from the "PDF Download." 【Contents】 ■ DPC Boards (Boards using plating methods) Comparison with thick film and thin film methods is also explained. ■ Copper Base Wiring Boards with Posts (High Thermal Conductivity Wiring Boards) Directly conducts heat from heat-generating components to the base material. ■ Metal Base Wiring Boards (High Thermal Conductivity Wiring Boards) Supports everything from standard aluminum base boards to copper base and custom specifications. ■ Ultraviolet High Reflective Film A film that can be applied to the surfaces of ceramics and metals, excellent in insulation, heat resistance, and ultraviolet resistance, reflecting even in the ultraviolet range. ■ Overview of EMS Services ■ List of Equipment from Partner Companies for Implementation

This document introduces the AMB substrate design rules. It clearly presents information on ceramic types and thicknesses, layer composition, work sizes, product sizes, and prohibited areas for patterns on the product's outer perimeter, along with diagrams and tables. We encourage you to read it. 【Contents (excerpt)】 ■ Ceramic types and thicknesses ■ Copper thickness ■ Layer composition ■ Work sizes and product sizes ■ Product outer dimension tolerances ■ Prohibited areas for patterns on the product's outer perimeter *For more details, please refer to the PDF document or feel free to contact us.