アイン Product Lineup

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the products of Ain Co., Ltd., which engages in the design, manufacturing, and sales of printed circuit boards, categorized by function. It features various types of multilayer circuit boards (resin, metal, ceramics), including thick film printed circuit boards and inner layer thick copper circuit boards (with busbars). We respond to diverse needs such as high frequency, high thermal conductivity, and dimensional stability. 【Contents】 ■ High Frequency ■ High Thermal Conductivity ■ Dimensional Stability (Low Expansion) ■ High Heat Resistance ■ High Current *For more details, please refer to the PDF document or feel free to contact us.

The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.

The "Ultraviolet (UV) High Reflective Film" is an excellent film that can be applied to the surfaces of ceramics and metals, reflecting in the ultraviolet range while providing insulation, heat resistance, and UV resistance. Our company engages in consistent product development from design to production. In response to the diversifying electronics industry, we provide high quality and high reliability based on the know-how we have cultivated over many years. 【Features】 ■ Can be applied to the surfaces of ceramics and metals ■ Reflects in the ultraviolet range ■ Excellent insulation, heat resistance, and UV resistance *For more details, please refer to the PDF document or feel free to contact us.

Ain Co., Ltd. will exhibit at the 'JPCA Show 2026' held at Tokyo Big Sight. This exhibition will showcase electronic circuits and mounting technologies used in various electronic, information communication, and control devices, as well as new content and solutions. We plan to display our thick copper ceramic substrate "AMB substrate" for power devices and our ceramic wiring substrate "DPC substrate" using a plating method. We sincerely look forward to your visit. 【Exhibition Information】 ■ Dates: June 10 (Wed) to June 12 (Fri), 2026, from 10:00 AM to 5:00 PM (tentative) ■ Venue: Tokyo Big Sight ■ Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Booth Number: East Exhibition Hall　3F-32　 ■ Exhibition Zone: Printed Circuit Board Technology Exhibition *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.

This is a ceramic wiring substrate capable of forming fine patterns through a thin film process. 【Features】 By combining our plating technology, it is also possible to create circuits with different thicknesses on the front and back. Example: Front Cu/Ni/Au, Back Ti/Pt/Au *For more details, please refer to the PDF document or feel free to contact us.