日立ハイテク List of Products and Services

The "Power Module Dynamic Characteristic Evaluation Device" is an AC characteristic evaluation device that achieves low stray inductance. It protects the device during sample rupture with its built-in high-speed cutoff circuit. <Product Features> 1. Achievement of low stray inductance 2. Built-in high-speed cutoff circuit 3. Supports high current and high voltage *For more details, please download the PDF or contact us.

• Other semiconductors

The "batch-type plasma treatment device" can be used for pre-treatment before adhering materials such as LCP and PTFE, as well as for removing residues from desmear and dry films. It has a proven track record of over 200 units operating in mass production factories around the world. <Product Features> 1. High-speed, highly uniform double-sided treatment 2. Abundant track record 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

• Other semiconductors

The "inline plasma treatment device" can be used for pre-treatment before attaching low transmission loss substrates for high-speed communication, as well as for removing residues from desmear and dry film. It also supports inline transport. <Product Features> 1. High speed and high uniformity for both sides 2. Compatible with automatic transport 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

• Other semiconductors

The "Roll-to-Roll Plasma Treatment Device" has been upgraded to the 2019 model. Please refer to the main product features below. <Product Features> 1. New Electrode Adoption - Increased plasma density enhances processing efficiency per electrode. - Provides fast and highly uniform treatment (in-plane uniformity within ±15%). - Supports a maximum width of 550mm. 2. Reduced Processing Time - Plasma irradiation length reduced by approximately 50% (number of electrodes: old type 12 sheets ⇒ 2019 model 7 sheets). - Supports both sides treatment (options for both sides or one side treatment). 3. Improved Cooling Performance - Enhanced cooling to minimize substrate damage due to heat. *For more details, please download the PDF or contact us.

• Other semiconductors

The "UV Laser Driller" is equipped with a new scanner that reduces processing time. Additionally, the power has been increased from 20W to 30W, enhancing the processing speed. <Product Features> - Reduced processing time compared to conventional products - High positional accuracy (±15μ) - Adoption of high-power laser (30W) *For more details, please download the PDF or contact us.

• Other semiconductors

The "LED Overheat Resistance Tester" can measure the junction temperature of LEDs and thermal resistance. Measurement conditions can be set on a PC, and automatic measurements are performed. Data storage is also done automatically. <Product Features> - High-precision Tj measurement using the VF method - Compatible with high-power LEDs and multi-element LED modules - Power supply with "fast response," "stability," and "high current capability" *For more details, please download the PDF or contact us.

• Other semiconductors

Our company offers a range of equipment that plays a vital role in each process of MEMS production, from wafer cleaning to etching, stripping, and inspection. At the "MEMS Sensing & Network System Exhibition 2020," we will showcase products that received significant feedback from visitors. We will introduce equipment that contributes to process efficiency. [Exhibited Products (Partial)] < Piezoelectric MEMS Plasma Polling (Polarization Processing) Equipment > Exhibits excellent uniformity and demonstrates a high polarity effect of up to 90% < Ion Milling Equipment for Piezoelectric and Magnetic Materials > Models capable of processing six 100mm wafers simultaneously are available < High-Power, Short Pulse Control Light Sintering Equipment > Can control the irradiation light in microseconds, heating instantly without damaging the substrate

• Analytical Equipment and Devices

At Hitachi High-Tech, we handle "Lasers for Thin Films & High-Function Films." We support various processes including patterning, cutting, drilling, and irregular processing, as well as half-cutting. We offer products such as the "TLSP Series," which has high process adaptability due to multi-wavelength support, and the "TLSM-301," which allows for quick cutting of various shapes. 【Features】 <TLSP Series> ■ High process adaptability due to multi-wavelength support ■ Reduced thermal impact with short pulse width ■ Homogeneous processing through high-speed control of laser pulses ■ High-precision patterning in a 200mm x 200mm area *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• others

At Hitachi High-Tech, we handle "light curing equipment." The irradiation light from high-power lamps is precisely controlled in microseconds. It can heat the surface instantaneously without damaging the underlying material. You can also try experiments in our domestic demo room, so please feel free to contact us. 【Features】 ■ Precise control of irradiation light from high-power lamps in microseconds ■ Instantaneous heating of the surface without damaging the underlying material *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• others

At Hitachi High-Tech, we handle the "Curved Slit Coater." It can be applied not only to flat surfaces but also to concave/convex surfaces, uneven surfaces, and flexible materials. The workpiece is transported by the stage, and the slit die can rotate to an angle that matches the shape of the workpiece. It is compatible with curved cover lenses and film touch sensors. 【Features】 ■ Optimized slit die ■ Design considering maintenance ■ Suitable bubble removal design ■ Compatible with high-viscosity resins ■ Structure to prevent resin leakage *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• others

At Hitachi High-Tech, we handle the "Roll to Roll Coating Drying Equipment." No large structures are necessary. It contributes to reducing equipment and installation costs, and the effect of bottom heating enhances the adhesion strength between the substrate and the coating film. It improves maintainability and shortens the time for foil work and foil cutting recovery. 【Features】 ■ Archless drying furnace type ■ Reduced initial costs ■ Increased drying efficiency ■ Increased adhesion strength ■ Reduced downtime *For more details, please refer to the PDF materials or feel free to contact us.

• Drying Equipment
• others

At Hitachi High-Tech, we handle "Roll to Roll Inkjet." We provide high-precision coating with high impact accuracy and small droplet ejection. In addition to sheet-fed systems, we also support Roll to Roll, improving productivity. Furthermore, our multi-head technology offers uniform thin film coating over wide areas. 【Features】 ■ Increased productivity ■ High-precision coating ■ Fine coating ■ Thin film coating ■ Contributes to low-cost manufacturing of electronic devices *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• others

At Hitachi High-Tech, we handle "Laser Slitters." Using a laser beam, we perform non-contact slitting on films with difficult-to-process functional coatings that are layered with blades. Our special laser optical system reduces thermal effects at the processing area. 【Features】 ■ For functional films ■ Equipped with multiple laser emission units ■ Reduces burrs and cracks due to the absence of external stress ■ Reduces thermal effects at the processing area with a special laser optical system ■ Output control that follows processing speed *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• others

Introducing Hitachi High-Tech's "Clean Dry Air System." Leveraging our expertise gained from consistent rotor production to machine design and manufacturing, we respond to our customers' needs at various stages requiring a dry environment with an optimal system. Additionally, the dew point temperature of the dry air supplied using a desiccant dehumidifier ranges widely from -40°C DP, which is typically required in general dry rooms, to ultra-low dew points of -90°C DP, allowing for flexible control to meet the dew point temperature required by our customers. 【Features】 ■ Capable of flexibly separating and removing oxygen and moisture, allowing for the use of inert gases and dry environments as needed. ■ Proposing suitable combinations of purification and dehumidification equipment tailored to the scale and requirements of the manufacturing line. ■ Achieving efficient purification through the combined use of purification and dehumidification equipment. ■ Reducing costs by reaching target values in a short time. *For more details, please refer to the PDF materials or feel free to contact us.

• others

At Hitachi High-Tech, we handle "wet processing equipment." We offer a lineup of devices compatible with thick film resist and film resist, as well as specifications for MEMS. We also customize solutions for customer-specific processes. Please feel free to consult with us. 【Features】 <Developing and Stripping Process> ■ Compatible with thick film resist and film resist ■ A wide range of options to accommodate various stripping processes ■ Unique tank structure and circulation design to prevent re-adhesion of stripped materials *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• others

The "PVD for R&D" is a multi-layer deposition device designed for development purposes. It supports magnetron sputtering, thermal evaporation, and E-Beam. It boasts a delivery record of over 400 units worldwide. With a modular design, combinations can be customized according to your needs. 【Features】 ■ Development-focused deposition device specialized for R&D ■ Over 400 units delivered to renowned research institutes, universities, and companies ■ Combinations of magnetron sputtering, thermal evaporation, and E-Beam are possible (Combinations can also be changed through modifications) *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Other processing machines

At Hitachi High-Tech, we handle "OCR Bonding Equipment." We offer two types of equipment: "Atmospheric Bonding," which allows a series of operations to be performed with a single device, and "Vacuum Bonding." You can choose according to your application. 【Features】 <Atmospheric Bonding> ■ Capable of performing a series of operations from adhesive application, auto-alignment, bonding, to UV spot curing with a single device ■ Suitable for bonding using optical elastic resins and adhesives ■ Supports auto-alignment with a CCD camera ■ Incorporating two stages to enhance production efficiency *For more details, please refer to the PDF materials or feel free to contact us.

• Other machine elements
• Other processing machines

At Hitachi High-Tech, we handle "Ion Milling Equipment." We offer a lineup that includes the "Diffusion Beam Milling System," which allows for large-area processing with a small-diameter electrode, and the "R&D Compact Milling System," which is specialized for experimental development. With our extensive experience, we support our customers from development onward. 【Features】 <Diffusion Beam Milling System> ■ Large-area processing possible with a small-diameter electrode ■ Simultaneous processing of all six φ100mm wafers ■ Achieves good in-plane uniformity with a self-rotating wafer holder *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Other processing machines

The "Ultrasonic Imaging Device" is a non-destructive defect inspection device for MEMS devices. Hitachi High-Tech can accommodate everything from the "FineSAT series" for development, prototyping, and small-scale production to the "Wafer LINE" for fully automated wafer inspection. We offer proposals that match your situation with a wide range of options. 【Features】 ■ A 64-bit processing system with enhanced analysis capabilities Capable of measuring up to 400 million points in standard specifications and up to 2 billion points in optional specifications ■ A high-speed scanner with a maximum scanning speed of 2,000 mm/sec, Significantly reduces measurement time by adopting a new ultrasonic pulser ■ Newly developed high-frequency probes (400 MHz) that accommodate various wafers with a rich lineup of probes for both short and long focal distances *For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices

The "IM-580 Series" is a batch-type ion beam milling device suitable for processing large substrates and a large number of pieces. It features a bucket-type ion source with a maximum diameter of φ580. It can accommodate non-standard substrates such as square-shaped substrates, support mixed non-standard substrates, and is compatible with various substrate sizes. We offer free sample processing tailored to your application for the first time. Please contact us regarding wafer sizes, processing quantities, and other inquiries. 【Features】 ■ Maximum φ580 bucket-type ion source ■ Achieves both high uniformity and high throughput ■ Capable of controlling both high and low etching rates ■ Self-rotating stage for wafers (substrates) ■ Compatible with non-standard substrates such as square-shaped substrates, supports mixed non-standard substrates, and is compatible with various substrate sizes ■ Filament-free μ-wave neutralizer (optional) *For more details, please refer to the external link or feel free to contact us.

• Other machine elements

The "IM Series" is a compact ion beam milling device suitable for research and development as well as small-scale production. It has a compact footprint and is equipped with an endpoint detection system (optional for load lock). We offer free initial sample processing tailored to your application. Please contact us for information regarding wafer sizes, processing quantities, and more. 【Features】 ■ Capable of high-rate etching and low-rate control ■ Rotating and tilting wafer holder ■ A variety of chucking methods available ■ Compact footprint ■ Equipped with an endpoint detection system (optional for load lock) ■ Filamentless μ-wave neutralizer (optional) *For more details, please refer to the external link or feel free to contact us.

• Other machine elements

The "IML Series" is a sheet-type ion beam milling device that processes from cassette to cassette. It allows for high-rate etching and low-rate control. Additionally, devices with two processing chambers are also available. We offer free initial sample processing tailored to your application. For inquiries regarding wafer sizes, processing quantities, and more, please contact us. 【Features】 ■ High-rate etching and low-rate control are possible ■ Filamentless μ-wave neutralizer (optional) ■ EPD (endpoint detector) installation (optional) ■ Reactive gas compatibility (optional) ■ Filamentless RF bucket-type ion source (optional) *For more details, please refer to the PDF materials or feel free to contact us.

• Other machine elements

Hitachi High-Technologies Corporation offers plasma equipment with a proven track record among major electronic device manufacturers in Asia. We propose surface treatment solutions in various fields, including desmear equipment suitable for removing smears from small-diameter rigid and flexible printed circuit boards. 【Features】 ■ Desmear Equipment - For removing smears from small-diameter rigid and flexible printed circuit boards Cleaning application: Enhancing hydrophilicity before the plating process of printed circuit boards ■ Vacuum Plasma Cleaner - For removing residues after resist stripping and for pre-treatment before IC bonding ■ Atmospheric Plasma - For removing organic substances, surface modification, and surface roughening of films and glass substrates *For more details, please refer to the PDF materials or feel free to contact us.

• Plasma surface treatment equipment
• Other physicochemical equipment

The "Glove Box" is a box that can control the dew point at -76°C DP. We offer products such as the "Desi-Cube," which removes moisture using a desiccant dehumidification method, and the "N-Cube," which removes oxygen and moisture using an inert gas replacement method. At our company, we leverage our expertise gained from consistent production of rotors, machine design, and manufacturing as a dehumidifier manufacturer to propose suitable systems tailored to our customers' needs at all stages requiring dry environments, such as enclosures and dry rooms. 【Features (Desiccant Dehumidification Method)】 ■ Removes moisture and carbon dioxide from the air, creating an ultra-low dew point and low carbon dioxide environment ■ High safety due to the absence of inert gases ■ Capable of controlling moisture concentration and CO2 levels ■ Low running costs ■ High scalability *For more details, please refer to the PDF document or feel free to contact us.

• Glove box

The "TLSM-301" is a laser cutting system for optical films that enables high-precision and free cutting processing. It overcomes challenges faced in previous laser processing, such as the inability to process complex shapes at high speeds (position misalignment) and thermal effects in acceleration and deceleration ranges. By synchronizing the galvanometer scanner and drive equipment, it achieves high-quality cutting with high processing capability. 【Features】 ■ Suppresses cracks caused by external stress ■ Reduces bulging due to melting ■ Taper-free cutting surface ■ Freely cuts various shapes in a short time (supports up to 500mm x 500mm) *For more details, please request materials or view the PDF data available for download.

• Other processing machines

"PulseForge" is a device that precisely controls the irradiation light from a uniquely developed high-output xenon lamp to instantaneously heat, dry, and sinter only the surface of materials. It is effective for rapid drying of materials and improving conductivity and adhesion, allowing for drying and sintering of only the surface without damaging substrates with low heat resistance through high-output, short-pulse irradiation. 【Features】 ■ Formation of free pulse sequences ■ Drying and sintering possible without damage due to unique beam formation technology ■ Anticipation of processing results in advance with proprietary software (unique design tool SimPulse) ■ Quick transition from R&D to mass production possible (R2R compatible) *For details, please request materials or view the PDF data from the download.

• Drying Equipment
• Other surface treatment equipment
• Annealing furnace

"Roll to Roll" is a rotary screen printing machine that enables high-speed continuous printing with fine detail using cylindrical plates. It achieves high productivity at low manufacturing costs. It has excellent reproducibility and can accommodate a wide range from fine patterns to thick film printing. [Features] - Continuous, precise, and ultra-fast printing with cylindrical plates - High productivity and low manufacturing costs - Excellent reproducibility from fine patterns to thick film printing *For more details, please refer to the PDF document or feel free to contact us.

• Painting Machine
• Photomask
• Other semiconductor manufacturing equipment

We perform pinpoint processing on extremely small areas. ■ Processing Targets Surface modification/roughening of the target workpiece (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target workpiece surface 【Features】 ■ Ideal for narrow processing areas: 10/20/35mm ■ Enables processing of three-dimensional objects in combination with robotic mechanisms ■ Compatible with various reaction gases: CDA (Clean Dry Air), N2, Ar, O2, etc. For more details, please download the catalog or contact us.

• Other physicochemical equipment
• Plasma surface treatment equipment
• Plasma Generator

Stable plasma is generated under the counter electrode. Furthermore, by placing a dielectric between the electrodes, stable plasma can be generated and maintained. ■Processing Targets Modification/roughening of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■Wide compatibility: up to 2,250mm ■Excellent surface modification performance ■Physical and chemical processing is possible ■Maintenance-free ■Various reaction gases can be used: CDA (Clean Dry Air), N2, Ar, O2, etc. For more details, please download the catalog or contact us.

• Other physicochemical equipment
• Plasma surface treatment equipment
• Plasma Generator

The plasma generation section and the processing section are completely separated. The processing is carried out using only radical components. ■ Processing Targets Modification of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■ Reduces damage to the processed film due to chemical processing using only radicals without electron or ion attacks ■ Ideal for processing conductive films and glass after electrode formation ■ Various reaction gases can be used: CDA (Clean Dry Air), N2, O2, Ar, etc. For more details, please contact us.

• Other physicochemical equipment
• Plasma surface treatment equipment
• Plasma Generator

- We propose two types of drying ovens (thin compact dryer, large chamber dryer). - The drying method utilizes hot air in addition to IR (infrared) for high-efficiency drying. - Our in-house manufactured, multifunctional slot die nozzle accommodates ultra-thin to thick films. 【Features】 1) Reduction of initial costs: No need for large structures ⇒ Achieves lower equipment costs. 2) Reduction of running costs: Significantly reduces the volume of the drying oven ⇒ Decreases the required amount of hot air. 3) Reduction of building costs: Halves the height of the equipment ⇒ Lowers factory construction costs. 4) Improvement of productivity: - Easier foil work and cleaning tasks. - Shortens setup time by reducing heating and temperature stabilization time. - Increases drying efficiency by adopting IR heaters. 5) Shortened installation period: Reduces installation time from about 2 months to about 1 month (achieves lower installation costs). *For more details, please download the catalog or contact us.

• Drying Equipment

The "Compact Dryer Type Coater" is a coating drying device that has further improved drying efficiency by using a CT-IR heater. It accommodates substrate types such as resin films with widths up to 2300mm and thicknesses ranging from 15 to 200μm, as well as metal foils. This product reduces initial costs, construction costs, running costs, and downtime, achieving compactness and cost-effectiveness. 【Features】 ■ No need for large structures, reducing equipment and installation costs ■ Halved equipment height, reducing factory construction costs ■ Reduced furnace volume = decreased heat consumption, shortened heating time ■ Improved maintainability, shortened foil passing operations and foil cutting recovery time *For more details, please refer to the PDF document or feel free to contact us.

• Drying Equipment